Texas Instruments OMAP3525DCUS

Overview

OMAP3525DCUS from Texas Instruments is a 423-ball s-PBGA applications processor integrating an ARM Cortex-A8 core (up to 720 MHz), TMS320C64x+ DSP core (up to 520 MHz), IVA2.2 multimedia accelerator, camera ISP, and display subsystem - all in a single die for portable media and navigation devices.

For engineers reviewing the OMAP3525DCUS datasheet, OMAP3525DCUS pinout, OMAP3525DCUS application, or OMAP3525DCUS equivalent, this page delivers verified package mapping, confirmed GPIO count (188), discrete memory interface support, absence of POP capability, and validated feature differentiation versus OMAP3530 - critical for BOM validation and PCB layout planning.

Technical Context

The OMAP3525DCUS implements a dual-core heterogeneous architecture: the ARM Cortex-A8 handles high-level OS tasks (Linux, Android, Windows CE) while the C64x+ DSP offloads real-time video encode/decode, audio processing, and image enhancement via the IVA2.2 subsystem. Memory coherency is managed through L3/L4 interconnects.

It supports SDRAM (via SDRC), LPDDR, NAND/NOR flash (with ECC), and SRAM through the GPMC - but excludes PowerVR SGX graphics (present only in OMAP3530). The CUS package omits HSUSB3_TLL, MM_FSUSB3, McBSP4, McSPI1 CS1/CS2, and GPMC NCS1/NCS2 signals per Table 1-1.

Key Specifications

Pinout & Package

OMAP3525DCUS uses a 423-ball s-PBGA package (CUS suffix) with 0.65-mm ball pitch, no top-side balls, and no POP stacking capability. Ball assignments follow TI's SPRS507H Figure 2-5 (bottom view) and Table 2-3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3530DCBB, OMAP3525DCUS trades 3D graphics and POP for smaller footprint and lower BOM cost; versus i.MX535CJM8A, it delivers superior fixed-function video acceleration and camera pipeline integration at the expense of peak CPU frequency.

Availability

OMAP3525DCUS is available at Aetrix Electronics and suitable for portable navigation devices, digital video cameras, and point-of-sale terminals requiring stable component supply and long-term industrial lifecycle support.

Supply support for OMAP3525DCUS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader focused on analog, embedded processing, and connectivity technologies, with decades of expertise in low-power, high-integration SoCs for mobile and industrial markets.

The OMAP3525 belongs to TI's OMAP 3 family - designed specifically for cost-sensitive, battery-powered portable devices needing balanced CPU/DSP performance, rich multimedia acceleration, and flexible peripheral interfacing without discrete graphics.

FAQ

What is the maximum operating frequency of the ARM Cortex-A8 core in OMAP3525DCUS?

The OMAP3525DCUS ARM Cortex-A8 core operates at up to 720 MHz under recommended conditions. This frequency is validated across commercial temperature range (0°C to 90°C) and defines the upper bound for instruction throughput in Linux or Android application stacks. The actual sustained frequency depends on SmartReflex AVS voltage scaling and thermal headroom in the end application.

Does OMAP3525DCUS support PowerVR SGX graphics acceleration?

No, OMAP3525DCUS does not include the PowerVR SGX graphics accelerator. That feature is exclusive to the OMAP3530 variant (e.g., OMAP3530DCBB). OMAP3525DCUS relies on its ARM Cortex-A8 core and IVA2.2 subsystem for 2D graphics composition and video overlay, but lacks hardware-accelerated OpenGL ES 1.1/2.0 or OpenVG 1.0 rendering capability.

What memory interfaces are supported by OMAP3525DCUS?

OMAP3525DCUS supports SDRAM via its SDRC (up to DDR2-400), LPDDR, and asynchronous memories (NOR/NAND flash, SRAM, pseudo-SRAM) via the GPMC. It includes hardware ECC for NAND and supports 8 chip-selects - all available in the CUS package. Unlike CBB/CBC variants, it does not support POP stacking or HSUSB3_TLL.

How many general-purpose I/O pins does OMAP3525DCUS provide?

OMAP3525DCUS supports up to 188 general-purpose I/O pins, as confirmed in Table 1-1 of SPRS507H. These are multiplexed with peripheral functions (UART, I²C, McBSP, etc.), and the actual number available simultaneously depends on pin muxing configuration. No GPIOs are disabled in the CUS package - unlike CBB/CBC which omit specific GPIOs like gpio_112–gpio_115.

Is OMAP3525DCUS pin-compatible with OMAP3530 variants?

No, OMAP3525DCUS is not pin-compatible with OMAP3530 variants. It uses a 423-ball s-PBGA (CUS) package, whereas OMAP3530 is offered only in 515-ball s-PBGA packages (CBB/CBC). Ball counts, pitch, and signal assignments differ fundamentally - requiring separate PCB layouts. Feature differences (e.g., missing SGX, no POP) further preclude mechanical or electrical interchangeability.