Texas Instruments OMAP3525ECBB

Overview

OMAP3525ECBB from Texas Instruments is a 515-pin s-PBGA applications processor featuring an up to 720-MHz ARM Cortex-A8 core, a 520-MHz TMS320C64x+ DSP, and IVA2.2 multimedia acceleration subsystem. It integrates 256KB L2 cache, 112KB ROM, 64KB shared SRAM, and supports LPDDR/SDRAM memory interfaces. Used in portable media players and digital video cameras for real-time video decode, image processing, and HLOS execution (Linux, Android).

For engineers reviewing the OMAP3525ECBB datasheet, OMAP3525ECBB pinout, OMAP3525ECBB application, or OMAP3525ECBB equivalent, this page delivers verified package mapping (CBB suffix), confirmed MPU/DSP clock domains, validated video DAC and display subsystem capabilities, and precise GPIO count (170 usable) - all critical for PCB layout, thermal design, and OS bring-up.

Technical Context

The OMAP3525ECBB implements a heterogeneous dual-core architecture: the ARM Cortex-A8 handles high-level OS tasks and application logic, while the C64x+ DSP offloads compute-intensive IVA2.2 functions including video encode/decode, camera ISP pipelines, and audio preprocessing. Both cores share the L3/L4 interconnect and access unified memory via the SDRC and GPMC controllers.

Its power management relies on SmartReflex AVS with adaptive core voltage (0.985–1.35 V), dynamic voltage/frequency scaling (DVFS), and ultralow-power standby modes. The CBB package enables Package-on-Package (POP) memory stacking but omits PowerVR SGX graphics - distinguishing it from the OMAP3530ECBB variant.

Key Specifications

Pinout & Package

OMAP3525ECBB uses a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top, 0.4-mm pitch on bottom. Ball assignments follow TI SPRS507H Table 2-1; unused balls include A1, A2, A22, A23, AB1, AB2, AB22, AB23, AC1, AC2, AC22, AC23, B1, B2, B22, B23. POP interface signals (e.g., pop_a1_a1, pop_k2_m2) are present; gpmc_ncs1/ncs2 and gpmc_wait1/wait2 are omitted per CBB-specific pin mapping.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3530ECBB, OMAP3525ECBB removes PowerVR SGX but retains full IVA2.2 video acceleration - making it optimal for media-centric devices without 3D UI demands. Versus AM3517BZCNA, OMAP3525ECBB adds dedicated DSP resources essential for real-time video encode and camera processing.

Availability

OMAP3525ECBB is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and portable navigation devices requiring stable component supply across long-life industrial programs.

Supply support for OMAP3525ECBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in high-performance SoCs.

The OMAP3525ECBB belongs to the OMAP 3 family, designed specifically for mobile multimedia applications demanding integrated video acceleration, low-power operation, and HLOS compatibility - targeting consumer and industrial portable devices.

FAQ

What is the maximum operating frequency of the ARM Cortex-A8 core in OMAP3525ECBB?

The OMAP3525ECBB ARM Cortex-A8 core operates at up to 720 MHz under commercial temperature conditions. This frequency is achievable with SmartReflex AVS enabled and proper thermal management. The actual sustained frequency depends on silicon revision, voltage rail stability, and board-level cooling. OMAP3525ECBB does not support frequencies above 720 MHz, unlike some later OMAP variants.

Does OMAP3525ECBB include PowerVR SGX graphics hardware?

No, OMAP3525ECBB does not include the PowerVR SGX graphics accelerator. That feature is exclusive to the OMAP3530ECBB variant. OMAP3525ECBB retains the full IVA2.2 video acceleration subsystem, display controller, and camera ISP, but omits 3D graphics rendering capability. Applications requiring OpenGL ES 1.1/2.0 must use OMAP3530ECBB instead of OMAP3525ECBB.

How many general-purpose I/O pins are available on OMAP3525ECBB?

OMAP3525ECBB supports up to 170 GPIO pins in the CBB package configuration. This count excludes pins dedicated to fixed functions (e.g., power, ground, clocks) and accounts for pin multiplexing constraints documented in TI SPRS507H Table 2-4. The CUS package offers 188 GPIOs, but OMAP3525ECBB uses the CBB variant, which disables gpio_112–gpio_115 and others per Table 1-1.

What memory types does the OMAP3525ECBB support via its external interfaces?

OMAP3525ECBB supports LPDDR SDRAM via the SDRC interface and NOR flash, NAND flash (with Hamming ECC), SRAM, and pseudo-SRAM via the GPMC interface. It does not support DDR2 or DDR3. The SDRC supports 16-/32-bit LPDDR with up to 1 GB address space; GPMC provides eight chip-selects and flexible asynchronous protocol control for custom logic or FPGA interfacing.

Is OMAP3525ECBB pin-compatible with OMAP3530ECBB?

Yes, OMAP3525ECBB and OMAP3530ECBB share identical pinout, package (CBB), and ball assignment per TI SPRS507H. They differ only in internal silicon features: OMAP3530ECBB includes PowerVR SGX, while OMAP3525ECBB omits it. This allows drop-in replacement in most designs - though thermal and software validation is required due to differing power profiles and driver dependencies.