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Texas Instruments OMAP3525ECUS
- Part No.:
- OMAP3525ECUS
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 423-LFBGA, FCBGA
- Datasheet:
-
OMAP3525ECUS.pdf
- Description:
- IC MPU OMAP-35XX 600MHZ 423FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
OMAP3525ECUS from Texas Instruments is a 423-ball s-PBGA applications processor featuring an ARM Cortex-A8 core (up to 720 MHz), C64x+ DSP core (up to 520 MHz), IVA2.2 multimedia accelerator, and integrated camera ISP - designed for portable media players, digital video cameras, and navigation devices requiring real-time video decode, image processing, and Linux/Android OS support.
For engineers reviewing the OMAP3525ECUS datasheet, OMAP3525ECUS pinout, OMAP3525ECUS application, or OMAP3525ECUS equivalent, this page delivers verified package mapping, validated GPIO count (188 pins), confirmed memory interface (SDRAM + GPMC), and precise feature differentiation versus OMAP3530 - critical for PCB layout, power sequencing, and multimedia subsystem integration.
Technical Context
The OMAP3525ECUS implements a dual-core heterogeneous architecture: the ARM Cortex-A8 handles high-level OS execution and application logic, while the C64x+ DSP offloads compute-intensive tasks like video encode/decode, audio processing, and image enhancement via the IVA2.2 subsystem. Both cores share 256KB L2 cache and access unified on-chip SRAM (64KB) and ROM (112KB).
It supports discrete memory interfaces only - no Package-on-Package (POP) stacking - with a 16-/32-bit SDRAM controller (SDRC), General Purpose Memory Controller (GPMC) supporting NAND/NOR/Flash/SRAM, and dedicated video DAC outputs for NTSC/PAL composite and S-Video. The CUS package omits HSUSB3_TLL, MM_FSUSB3, and two GPMC chip-select/wait signals present in CBB/CBC variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8 (up to 720 MHz) + TMS320C64x+ DSP (up to 520 MHz) - enables concurrent HLOS execution and hardware-accelerated media processing. |
| Memory Interface | SDRAM Controller (SDRC) + General Purpose Memory Controller (GPMC) - supports LPDDR, SDRAM, NAND/NOR Flash, SRAM, and pseudo-SRAM without glue logic. |
| L2 Cache | 256KB unified L2 cache - reduces external memory bandwidth demand and improves deterministic latency for real-time video pipelines. |
| On-Chip RAM/ROM | 64KB shared SRAM + 112KB ROM - provides boot code storage and low-latency scratchpad for DSP/ISP firmware and secure boot routines. |
| Video Output | Dual analog video DACs (NTSC/PAL composite + S-Video) - enables direct connection to legacy displays without external encoder ICs. |
| Package | 423-pin s-PBGA (CUS suffix), 0.65-mm ball pitch - compact footprint optimized for handheld form factors; excludes POP interface and HSUSB3_TLL. |
| GPIO Count | 188 multiplexed GPIO pins - supports flexible peripheral expansion including camera sensors, touch controllers, and display interfaces. |
| Power Management | SmartReflex AVS with adaptive core voltage (0.985–1.35 V) - dynamically scales voltage/frequency per workload to minimize active power in battery-powered systems. |
Pinout & Package
OMAP3525ECUS uses a 423-ball s-PBGA package (CUS suffix) with 0.65-mm ball pitch. Pin assignments follow TI's documented CUS ball map (SPRS507H, Table 2-3), supporting discrete memory interfaces only - no POP stacking capability. Key interface groups include SDRC (SDRAM control/data), GPMC (NAND/NOR/Flash), MMC/SDIO (3 ports), McSPI (4 ports), McBSP (5 ports), UART (3), I²C (3), USB OTG/Host, and dedicated video DAC outputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM Data Bus | 32-bit bidirectional data path for LPDDR/SDRAM; timing-critical for video frame buffering and OS memory access. |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM Address & Bank Select | 16-bit address + 2-bit bank select - defines up to 1GB SDRAM space; requires precise trace length matching. |
| gpmc_ad0–gpmc_ad15 | GPMC Address/Data Multiplexed Bus | 16-bit multiplexed bus for NAND/NOR/Flash/SRAM; supports asynchronous protocol with programmable wait-state generation. |
| dss_data0–dss_data23, dss_hsync, dss_vsync, dss_pclk | Display Subsystem Parallel Output | 24-bit RGB + sync signals - drives LCD panels directly; supports dual-panel configuration and RFBI interface. |
| tv_out1, tv_out2, tv_vref, tv_vfb1, tv_vfb2 | Analog Video DAC Outputs | Dual independent DAC channels - generate composite NTSC/PAL or S-Video signals; require external RC filter networks. |
| cam_d0–cam_d11, cam_pclk, cam_hs, cam_vs, cam_fld | Camera ISP Parallel Input | 12-bit parallel sensor interface with pixel clock and frame/line sync - supports BT.601/BT.656 and raw CMOS/CCD sensors. |
Key Features
| Feature | Design Value |
|---|---|
| IVA2.2 Multimedia Accelerator | Hardware video decode (MPEG-4, H.264, VC-1), encode (MPEG-4 SP), and image processing - offloads CPU/DSP, enabling 720p playback at ≤300 mW. |
| Camera Image Signal Processor (ISP) | Real-time pipeline for Bayer demosaic, white balance, gamma correction, and noise reduction - supports 5MP sensors with minimal host intervention. |
| SmartReflex Adaptive Voltage Scaling | Runtime voltage/frequency adjustment per OPP level - reduces dynamic power by up to 40% vs. fixed-voltage operation in variable-workload scenarios. |
| Integrated Display Subsystem | Triple-layer compositor (graphics + 2 video layers), temporal dithering, rotation (90°/180°/270°), and resize (¼× to 8×) - eliminates need for external display controllers. |
| Security & Boot | TrustZone-enabled ARM core + secure boot ROM - enforces authenticated firmware loading and isolates secure OS services from user applications. |
| Peripheral Flexibility | 188 GPIOs with extensive pin muxing (Table 2-4, SPRS507H) - allows single PCB design to support multiple camera modules, display types, and connectivity options. |
Applications
| Portable Media Player | Digital Video Camera |
|---|---|
Use Scenario: High-resolution video playback (720p) with multitasking UI, audio decoding, and touchscreen interaction in handheld consumer devices. IC Role / Device Role / Timing Role: Primary applications processor executing Android/Linux, managing DRAM, driving LCD, and coordinating IVA2.2 hardware decode blocks. Use Value: Enables smooth 720p playback at <300 mW via hardware-accelerated decode and SmartReflex DVFS - extending battery life beyond 6 hours. |
Use Scenario: Real-time capture, preview, and encoding of HD video from CMOS sensors with electronic image stabilization and auto-focus control. IC Role / Device Role / Timing Role: Central imaging hub integrating ISP, C64x+ DSP (for EIS algorithms), and ARM Cortex-A8 (for UI and storage management). Use Value: Full pipeline acceleration - ISP handles sensor preprocessing, DSP runs stabilization kernels, and ARM manages FAT32 file writes - achieving 30 fps 1080p encode. |
| Portable Navigation Device | Web Tablet |
Use Scenario: Turn-by-turn navigation with live traffic overlay, voice guidance, and map rendering on resistive/capacitive touchscreens. IC Role / Device Role / Timing Role: Dual-core runtime: ARM executes navigation stack and UI; DSP accelerates map projection, route calculation, and speech synthesis. Use Value: Concurrent map rendering (GPU-assisted via PowerVR SGX in OMAP3530, not present here) and voice output - OMAP3525ECUS relies on DSP for real-time TTS and route recalculation. |
Use Scenario: Web browsing, document viewing, and light productivity apps on 7–10 inch tablets with Wi-Fi and optional 3G modem connectivity. IC Role / Device Role / Timing Role: Main system-on-chip providing CPU, memory controller, display interface, and peripheral host (USB, SDIO, UART) for add-on modules. Use Value: Integrated GPMC and MMC/SDIO enable direct attachment of cellular modems and expandable storage - reducing BOM cost vs. discrete bridge ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3530ECBB | Includes PowerVR SGX graphics accelerator; 515-pin s-PBGA with POP support; higher pin count and thermal envelope. | Required for OpenGL ES 2.0 graphics rendering (e.g., 3D maps, gaming UI); supports stacked memory for higher bandwidth. | Select when GPU-accelerated UI or 3D content is mandatory; avoid if cost, size, or power budget constrain use of SGX. |
| AM3517BZCNA | ARM Cortex-A8 only (no C64x+ DSP); identical CUS package; lower power, reduced multimedia acceleration. | Suitable for HMI, industrial gateways, and Linux-based control where video encode/decode is unnecessary. | Choose for non-multimedia embedded applications needing ARM performance without DSP overhead or licensing complexity. |
Compared with OMAP3530ECBB, OMAP3525ECUS trades graphics acceleration and POP memory support for lower cost and power; compared with AM3517BZCNA, it adds full C64x+ DSP and IVA2.2 hardware codecs - making it optimal for media-centric designs where DSP offload justifies the silicon area and licensing.
Availability
OMAP3525ECUS is available at Aetrix Electronics and suitable for portable navigation devices, digital video cameras, and portable media players requiring stable component supply across extended product lifecycles.
Supply support for OMAP3525ECUS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in low-power, high-performance SoCs for mobile and industrial markets.
The OMAP3525ECUS belongs to TI's OMAP™3 family of applications processors, engineered specifically for battery-powered multimedia devices demanding balanced CPU/DSP performance, rich peripheral integration, and advanced power management under Linux and Android.
FAQ
What is the maximum operating frequency of the ARM Cortex-A8 core in OMAP3525ECUS?
The OMAP3525ECUS ARM Cortex-A8 core operates at up to 720 MHz under commercial temperature conditions. This frequency is achieved with adaptive core voltage (0.985–1.35 V) managed by SmartReflex AVS, and requires compliant power delivery and thermal design per TI's SPRS507H specification.
Does OMAP3525ECUS include a PowerVR SGX graphics accelerator?
No, the OMAP3525ECUS does not include the PowerVR SGX graphics accelerator. That feature is exclusive to the OMAP3530 variant. The OMAP3525ECUS relies on its C64x+ DSP and IVA2.2 subsystem for video/image acceleration but lacks dedicated 3D graphics hardware.
What memory interfaces does OMAP3525ECUS support?
The OMAP3525ECUS supports a 16-/32-bit SDRAM controller (SDRC) for LPDDR/SDRAM and a General Purpose Memory Controller (GPMC) for NAND/NOR Flash, SRAM, and pseudo-SRAM. It does not support Package-on-Package (POP) memory stacking - a capability limited to CBB/CBC packages.
How many GPIO pins are available on OMAP3525ECUS?
The OMAP3525ECUS provides up to 188 general-purpose I/O pins, multiplexed with other peripheral functions. Actual usable GPIO count depends on pinmux configuration; Table 2-4 in SPRS507H documents all valid combinations and constraints for the CUS package.
Is OMAP3525ECUS pin-compatible with OMAP3530ECUS?
Yes, OMAP3525ECUS and OMAP3530ECUS share identical 423-ball s-PBGA (CUS) packaging and pinout. However, functional differences exist: OMAP3530ECUS includes PowerVR SGX, while OMAP3525ECUS omits it - requiring software and driver adjustments despite mechanical compatibility.
OMAP3525ECUS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 423-LFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Signal Processing; C64x+, Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 423-FCBGA (16x16)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3525ECUS FAQ
1.How can I place an order for OMAP3525ECUS through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3525ECUS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3525ECUS reliable?
The price and inventory of OMAP3525ECUS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3525ECUS is usually 5 days.
3.What payment methods are accepted for OMAP3525ECUS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3525ECUS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3525ECUS?
OMAP3525ECUS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3525ECUS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3525ECUS?
For technical support, including OMAP3525ECUS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3525ECUS requirements.
6.How does Aetrix verify that OMAP3525ECUS is sourced from the original manufacturer or authorized distributors?
All OMAP3525ECUS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3525ECUS meets industry standards.
7.What is the process for return or replacement of OMAP3525ECUS?
All OMAP3525ECUS units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3525ECUS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3525ECUS part is unused and in its original packaging.
Return procedure for OMAP3525ECUS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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