Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments OMAP3530DCBB

Part No.:
OMAP3530DCBB
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
515-VFBGA, FCBGA
Datasheet:
AetrixOMAP3530DCBB.pdf
Description:
IC MPU OMAP-35XX 600MHZ 515FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,119

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

OMAP3530DCBB from Texas Instruments is a dual-core applications processor integrating an up to 720-MHz ARM Cortex-A8 CPU and a 520-MHz TMS320C64x+ DSP, with PowerVR SGX graphics acceleration, 256-KB L2 cache, and support for LPDDR SDRAM - deployed in portable media players, digital video cameras, and web tablets requiring high-throughput multimedia processing.

For engineers reviewing the OMAP3530DCBB datasheet, OMAP3530DCBB pinout, OMAP3530DCBB application, or OMAP3530DCBB equivalent, key selection considerations include its 515-pin s-PBGA (CBB) package with POP interface, SmartReflex-enabled adaptive voltage scaling (0.985–1.35 V core), and hardware-accelerated video encode/decode via IVA2.2 and PowerVR SGX subsystems.

Technical Context

The OMAP3530DCBB implements a heterogeneous architecture: the ARM Cortex-A8 executes Linux, Android, or Windows CE OS tasks with NEON SIMD and Thumb-2 instruction support, while the C64x+ DSP handles real-time imaging, audio, and video preprocessing in parallel. Both cores share a unified L3 interconnect and access on-chip SRAM (64 KB), ROM (112 KB), and L2 cache (256 KB).

Its IVA2.2 subsystem includes dedicated hardware accelerators for camera ISP (BT.601/BT.656 input), resize, color space conversion, and alpha blending; the PowerVR SGX graphics engine delivers up to 10 MPoly/sec and supports OpenGL ES 1.1/2.0 and OpenVG 1.0 - features exclusive to the OMAP3530 (not OMAP3525).

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ARM Cortex-A8 + TMS320C64x+ DSP - enables concurrent OS execution and real-time signal processing without software task switching overhead.
CPU Frequency Up to 720 MHz - delivers >2× integer performance vs. ARM9, sufficient for 720p video playback and UI rendering in resource-constrained mobile devices.
DSP Frequency Up to 520 MHz - supports real-time HD video encode (H.264 baseline), multi-channel audio decoding, and computational imaging pipelines.
Graphics Engine PowerVR SGX (OMAP3530 only) - provides programmable pixel/vertex shaders and tile-based rendering for smooth 3D UIs and gaming.
Memory Interface LPDDR SDRAM controller with 16-/32-bit bus - enables low-power, high-bandwidth access to external memory for frame buffers and streaming data.
Package 515-pin s-PBGA (CBB suffix), 0.5-mm top / 0.4-mm bottom ball pitch - supports Package-on-Package (POP) memory stacking for compact system-in-package designs.
Power Management SmartReflex AVS with dynamic voltage/frequency scaling - reduces active power by up to 40% versus fixed-voltage operation under variable workload.

Pinout & Package

OMAP3530DCBB uses a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom, supporting POP memory stacking and discrete memory interfaces. Ball assignments follow TI's documented quadrant layout (A–D) with dedicated domains for SDRC, GPMC, DSS, McSPI, McBSP, USB, and power/ground.

Pin/Terminal Circuit Role Design Meaning
sdrc_d0–sdrc_d31 SDRAM Data Bus 32-bit bidirectional data path for LPDDR SDRAM; timing-critical signals requiring matched trace lengths and controlled impedance.
sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 SDRAM Address & Bank Select 16-bit address + 2-bit bank select for up to 1 GB address space; multiplexed with GPMC for flexible memory mapping.
gpmc_ncs0–gpmc_ncs7 General-Purpose Memory Chip Select Eight independent chip-select outputs enabling glueless interface to NOR/NAND flash, SRAM, and FPGA peripherals.
dss_data0–dss_data23, dss_hsync, dss_vsync Display Subsystem Parallel Output 24-bit RGB + sync signals driving LCD panels up to HD resolution; supports dual-panel output and RFBI interface.
hsusb0_data0–hsusb0_data7, hsusb0_clk High-Speed USB 2.0 OTG PHY Interface 8-bit ULPI-compliant transceiver interface - eliminates need for external USB PHY, reducing BOM and board area.

Key Features

Feature Design Value
IVA2.2 Video Acceleration Hardware-resize (1/4× to 8×), BT.601/BT.656 capture, chroma/luma separation, and temporal dithering - offloads 90% of video pipeline from CPU/DSP.
PowerVR SGX Graphics Multi-threaded scalable shader engine supporting OpenGL ES 2.0 - enables hardware-accelerated 2D/3D compositing and UI effects in Android/Linux environments.
Camera ISP Parallel CCD/CMOS sensor interface with embedded preview engine, auto-exposure, and white balance - eliminates need for external image co-processor.
SmartReflex AVS Real-time adaptive voltage control per power domain - dynamically scales core voltage from 0.985 V to 1.35 V, cutting leakage and dynamic power by up to 40%.
Security Extensions ARM TrustZone and Jazelle RCT - enables secure boot, encrypted media playback, and isolated execution environments for DRM and payment applications.

Applications

Portable Media Player Digital Video Camera

Use Scenario: High-resolution video playback (720p@30fps), audio decoding, touch UI, and battery-optimized standby.

IC Role / Device Role / Timing Role: Primary applications processor executing Android/Linux OS, managing display, storage, and peripheral I/O while coordinating DSP-assisted decode.

Use Value: Integrated IVA2.2 and PowerVR SGX eliminate discrete video/audio codecs and GPU, reducing bill-of-materials and PCB area by >35%.

Use Scenario: Real-time 1080p video capture, sensor framing, on-device encoding, and HDMI output.

IC Role / Device Role / Timing Role: Central imaging hub - ISP ingests BT.656 sensor data, C64x+ DSP encodes H.264, and DSS drives HDMI/LCD simultaneously.

Use Value: Hardware-accelerated resize, color conversion, and alpha blending enable zero-latency preview at full sensor resolution without CPU intervention.

Web Tablet Smart Home Controller

Use Scenario: Web browsing, app execution, multi-touch gesture processing, and Wi-Fi/Bluetooth connectivity.

IC Role / Device Role / Timing Role: Main SoC running Android with NEON-accelerated JavaScript engines and GPU-rendered UI layers.

Use Value: Dual-core heterogeneity allows background audio streaming (DSP) while maintaining responsive UI (Cortex-A8), extending usable battery life by 2.3× vs. single-core alternatives.

Use Scenario: Multi-sensor aggregation (camera, mic, temp/humidity), local AI inference, and secure cloud gateway functions.

IC Role / Device Role / Timing Role: Secure edge compute node - TrustZone isolates firmware updates and sensor data, while SmartReflex minimizes always-on power draw.

Use Value: On-chip ROM bootloader, 112 KB ROM, and hardware crypto accelerators reduce external memory dependency and attack surface for certified IoT deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
OMAP3525DCBB No PowerVR SGX graphics engine; identical CPU/DSP, memory, and peripheral set otherwise. Not suitable for 3D UI, gaming, or OpenGL ES 2.0 workloads; lower thermal/power envelope. Select when graphics acceleration is unnecessary and BOM cost reduction is prioritized over future-proofing.
i.MX535CJM ARM Cortex-A8 @ 1 GHz, Vivante GC880 GPU, no integrated DSP; different memory controller (DDR2/DDR3 only). Lacks hardware video encode acceleration and ISP; requires external codec for camera pipelines. Prefer for pure UI-centric designs where GPU compute dominates, but avoid for real-time imaging or multi-format video ingest.

Compared with OMAP3525DCBB and i.MX535CJM, OMAP3530DCBB uniquely combines programmable 3D graphics, dedicated video DSP acceleration, and camera ISP in a single die - making it the only option among the three capable of standalone 1080p encode + decode + display without companion ICs.

Availability

OMAP3530DCBB is available at Aetrix Electronics and suitable for portable navigation devices, digital video cameras, and web tablets requiring stable component supply across extended product lifecycles.

Supply support for OMAP3530DCBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in low-power, high-performance SoCs for mobile and industrial markets.

OMAP3530DCBB belongs to TI's OMAP™3 family - designed specifically for portable multimedia applications demanding balanced CPU/DSP/GPU compute, advanced power management, and rich peripheral integration in space-constrained form factors.

FAQ

What operating systems does OMAP3530DCBB officially support?

OMAP3530DCBB officially supports Linux®, Android™, and Windows® CE - with vendor-provided BSPs, kernel drivers, and graphics stacks validated for each. Android support was added in the October 2013 revision of the SPRS507H datasheet, confirming compatibility with early Android versions targeting ARMv7-A platforms.

Does OMAP3530DCBB include on-chip ROM and SRAM, and what are their sizes?

Yes, OMAP3530DCBB integrates 112 KB of on-chip ROM for boot code and secure functions, plus 64 KB of shared SRAM accessible by both ARM and DSP subsystems. This eliminates reliance on external boot memory and enables fast context-switching between CPU and DSP tasks without DRAM latency penalties.

How does the SmartReflex technology in OMAP3530DCBB reduce power consumption?

SmartReflex in OMAP3530DCBB dynamically adjusts core voltage (0.985–1.35 V) and frequency based on real-time process, voltage, and temperature (PVT) monitoring - reducing active power by up to 40% compared to fixed OPP operation while maintaining full performance headroom during peak loads.

Is OMAP3530DCBB pin-compatible with other OMAP35xx variants like OMAP3525DCBB?

Yes, OMAP3530DCBB and OMAP3525DCBB share identical 515-pin s-PBGA (CBB) packaging, ball map, and mechanical footprint - enabling drop-in replacement in hardware designs where PowerVR SGX graphics are not required, though software must be reconfigured to disable unused SGX registers.

What video interfaces does OMAP3530DCBB support for display output?

OMAP3530DCBB supports parallel RGB (up to 24-bit), HD resolution (1280×720), dual LCD panels, RFBI, S-Video, and composite NTSC/PAL output via integrated DACs - all managed by its programmable Display Subsystem without external timing controllers or level shifters.

OMAP3530DCBB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
515-VFBGA, FCBGA
Series:
OMAP-35xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
-
SATA:
-
USB:
USB 1.x (3), USB 2.0 (1)
Voltage - I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
515-POP-FCBGA (12x12)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

OMAP3530DCBB FAQ

1.How can I place an order for OMAP3530DCBB through Aetrix?

Please submit a Request for Quotation (RFQ) for OMAP3530DCBB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OMAP3530DCBB reliable?

The price and inventory of OMAP3530DCBB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3530DCBB is usually 5 days.

3.What payment methods are accepted for OMAP3530DCBB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3530DCBB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OMAP3530DCBB?

OMAP3530DCBB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OMAP3530DCBB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OMAP3530DCBB?

For technical support, including OMAP3530DCBB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3530DCBB requirements.

6.How does Aetrix verify that OMAP3530DCBB is sourced from the original manufacturer or authorized distributors?

All OMAP3530DCBB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3530DCBB meets industry standards.

7.What is the process for return or replacement of OMAP3530DCBB?

All OMAP3530DCBB units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3530DCBB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OMAP3530DCBB part is unused and in its original packaging.

Return procedure for OMAP3530DCBB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

OMAP3530DCBB Tags

  • OMAP3530DCBB
  • OMAP3530DCBB PDF
  • OMAP3530DCBB Datasheet
  • OMAP3530DCBB Specifications
  • OMAP3530DCBB Images
  • Texas Instruments
  • Texas Instruments OMAP3530DCBB
  • Buy OMAP3530DCBB
  • OMAP3530DCBB Price
  • OMAP3530DCBB Distributor
  • OMAP3530DCBB Supplier
  • OMAP3530DCBB Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER