Texas Instruments OMAP3530DCBB72

Overview

OMAP3530DCBB72 from Texas Instruments is a 515-pin s-PBGA applications processor integrating an ARM Cortex-A8 core (up to 720 MHz), TMS320C64x+ DSP core (up to 520 MHz), PowerVR SGX graphics accelerator, and IVA2.2 video/audio subsystem. It supports Linux, Android, and Windows CE, and targets portable media players, digital video cameras, and web tablets requiring high-resolution video decode, 3D graphics, and real-time image processing.

For engineers reviewing the OMAP3530DCBB72 datasheet, OMAP3530DCBB72 pinout, OMAP3530DCBB72 application, or OMAP3530DCBB72 equivalent, key selection factors include its 515-ball CBB package with POP interface support, dual-core heterogeneous architecture, integrated video DACs for NTSC/PAL output, and SmartReflex-enabled adaptive voltage scaling for mobile power efficiency.

Technical Context

The OMAP3530DCBB72 implements a hierarchical L3/L4 interconnect fabric linking the MPU, DSP, SGX, ISP, and display subsystems. Its memory subsystem includes 256-KB L2 cache, 64-KB on-chip SRAM, 112-KB ROM, and dedicated SDRAM controller supporting LPDDR with SMS rotation engine.

It integrates hardware accelerators for video (BT.601/BT.656 capture, resize, color space conversion), graphics (PowerVR SGX tile-based rendering at up to 10 MPoly/sec), and imaging (CCD/CMOS ISP with preview pipeline), all coordinated via programmable DMA channels and system-level power management.

Key Specifications

Pinout & Package

The OMAP3530DCBB72 uses a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom, supporting Package-on-Package (POP) memory stacking. Ball assignments follow TI's SPRS507H specification, with quadrant-specific signal mapping and unused balls (e.g., A1, A2, AB1, AC1) omitted from functional use.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3530DCBB72, OMAP3525DCBB72 removes graphics acceleration but retains full video processing, while AM3517BZCNA3 sacrifices DSP and multimedia engines for simplified software stack and reduced power - making each viable only where their specific feature omissions align with system requirements.

Availability

OMAP3530DCBB72 is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and web tablets requiring stable component supply across extended product lifecycles.

Supply support for OMAP3530DCBB72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in low-power, high-performance SoCs.

The OMAP3530DCBB72 belongs to TI's OMAP 3 family, designed specifically for mobile multimedia applications demanding integrated video, graphics, imaging, and power-efficient heterogeneous processing in compact form factors.

FAQ

What is the maximum operating frequency of the ARM Cortex-A8 core in OMAP3530DCBB72?

The OMAP3530DCBB72 ARM Cortex-A8 core operates at up to 720 MHz under OPP5 performance state. This frequency enables real-time decoding of 720p30 H.264 video and supports demanding Android UI frameworks. Actual sustained frequency depends on thermal conditions and SmartReflex voltage scaling settings configured in the bootloader or kernel.

Does OMAP3530DCBB72 support Package-on-Package (POP) memory stacking?

Yes, OMAP3530DCBB72 in the CBB package supports POP implementation for stacking LPDDR memory directly atop the processor. This is confirmed in Table 1-1 of SPRS507H and enables compact, high-bandwidth memory integration without routing SDRAM traces on the PCB - a key advantage for space-constrained portable designs.

What video output interfaces does OMAP3530DCBB72 provide?

OMAP3530DCBB72 provides parallel digital RGB output (up to 24-bit HD resolution), dual composite video (NTSC/PAL via integrated DACs), and S-Video. It does not include HDMI or LVDS transmitters - those require external PHYs. The DAC outputs (tv_out1/tv_out2) must be filtered per TI's section 5.4 using 27 Ω series resistors and 470 pF capacitors to meet video spec compliance.

How many general-purpose I/O pins are available on OMAP3530DCBB72?

The OMAP3530DCBB72 supports up to 188 GPIO pins, though pin multiplexing restricts concurrent availability. In the CBB package, GPIO_112 through GPIO_176 are partially restricted - actual usable count depends on selected peripheral functions (e.g., enabling McBSP3 disables certain GPIOs). Full allocation details are in Table 2-4 of SPRS507H.

Is OMAP3530DCBB72 pin-compatible with OMAP3525DCBB72?

Yes, OMAP3530DCBB72 and OMAP3525DCBB72 share identical 515-pin CBB s-PBGA packaging, ball map, and electrical interface definitions. The only functional difference is the presence of PowerVR SGX in OMAP3530DCBB72 - making them drop-in replacements where graphics acceleration is not required, with no PCB layout changes needed.