Texas Instruments OMAP3530DCBBA
- Part No.:
- OMAP3530DCBBA
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-VFBGA, FCBGA
- Datasheet:
-
OMAP3530DCBBA.pdf
- Description:
- IC MPU OMAP-35XX 720MHZ 515FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,507
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
OMAP3530DCBBA from Texas Instruments is a high-performance applications processor integrating an up to 720-MHz ARM Cortex-A8 CPU core, a 520-MHz TMS320C64x+ DSP core, and a PowerVR SGX graphics accelerator - enabling concurrent video decode, 3D rendering, and real-time image processing in portable media players and navigation devices.
For engineers reviewing the OMAP3530DCBBA datasheet, OMAP3530DCBBA pinout, OMAP3530DCBBA application, or OMAP3530DCBBA equivalent, this device supports Linux, Android, and Windows CE operating systems; delivers up to 10 MPoly/sec graphics throughput; integrates SmartReflex adaptive voltage scaling; and implements a 515-pin s-PBGA package with 0.5-mm top / 0.4-mm bottom ball pitch.
Technical Context
The OMAP3530DCBBA implements a heterogeneous dual-core architecture: the ARM Cortex-A8 handles general-purpose OS execution and application logic, while the C64x+ DSP offloads intensive signal processing tasks including video encode/decode, audio codecs, and ISP pipeline operations. Both cores share access to 256-KB L2 cache and 64-KB on-chip SRAM.
Its IVA2.2 subsystem includes dedicated hardware accelerators for H.264/MPEG-4 decode, JPEG encode/decode, and camera image signal processing (CCD/CMOS interface, BT.601/BT.656 support), while the PowerVR SGX GPU provides OpenGLES 1.1/2.0 and OpenVG 1.0 acceleration - all coordinated via L3/L4 interconnects with QoS-aware arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A8, up to 720 MHz - enables Linux/Android application execution with NEON SIMD and Thumb-2 instruction set efficiency |
| DSP Core | TMS320C64x+, up to 520 MHz - handles real-time video/audio codecs and sensor fusion without CPU intervention |
| GPU | PowerVR SGX, 10 MPoly/sec - supports OpenGL ES 2.0-accelerated UI rendering and 3D gaming on embedded displays |
| Memory Interface | SDRAM controller + GPMC with 8 chip-selects - enables direct connection to LPDDR SDRAM and NAND/NOR flash without glue logic |
| Process Technology | 65-nm CMOS - achieves sub-1.35-V adaptive core voltage via SmartReflex AVS for dynamic power optimization |
| Package | 515-pin s-PBGA (CBB suffix), 0.5-mm top / 0.4-mm bottom ball pitch - supports POP memory stacking and industrial thermal dissipation |
| I/O Count | Up to 188 GPIO pins (multiplexed) - provides flexible peripheral interfacing including 3x UART, 5x McBSP, 4x McSPI, and 3x MMC/SDIO |
Pinout & Package
The OMAP3530DCBBA is housed in a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom, supporting Package-on-Package (POP) memory stacking and discrete memory interfaces. Ball assignments follow TI's standardized quadrant layout (A–D) with defined power domains (vdd_core, vdd_mpu_iva, vdds_mem, vdda_dac) and multiplexed I/O functions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM Data Bus | 32-bit bidirectional data path for LPDDR/SDR SDRAM; supports burst transfers and ECC-capable operation |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM Address & Bank Select | 16-bit address + 2-bit bank select for up to 1 GB of external memory addressing |
| gpmc_ncs0–gpmc_ncs7 | General-Purpose Memory Chip Select | Eight independent chip-select outputs for NOR/NAND/SRAM/Pseudo-SRAM with configurable timing |
| dss_data0–dss_data23, dss_hsync, dss_vsync | Display Subsystem Parallel Output | 24-bit RGB + sync signals driving LCD panels up to HD resolution with programmable timing and rotation |
| mcbsp1_dx–mcbsp1_fsx | McBSP1 Serial Audio Interface | Full-duplex, frame-synchronized serial port supporting I2S, PCM, and TDM protocols for audio codec interfacing |
Key Features
| Feature | Design Value |
|---|---|
| SmartReflex AVS | Real-time adaptive voltage scaling across MPU and IVA domains reduces active power by up to 30% versus fixed-voltage operation |
| IVA2.2 Hardware Acceleration | Dedicated engines for H.264 BP/MP decode, JPEG encode/decode, and camera ISP eliminate CPU/DSP load for multimedia pipelines |
| PowerVR SGX Graphics | Tile-based rendering engine with universal scalable shader supports OpenGL ES 2.0 shaders and anti-aliased 3D UIs |
| Flexible Memory Architecture | Integrated SDRC + GPMC allows simultaneous use of LPDDR for system memory and NAND for storage - no external memory controller required |
| Multi-Protocol Serial Interfaces | 5 McBSPs (2 with sidetone), 4 McSPI ports, 3 UARTs (1 with IrDA/CIR), and USB OTG/host enable full peripheral connectivity |
Applications
| Portable Media Player | Automotive Navigation System |
|---|---|
Use Scenario: High-resolution video playback with multitouch UI and background audio streaming. IC Role / Device Role / Timing Role: OMAP3530DCBBA serves as main SoC executing Android OS, decoding 720p H.264 video in IVA2.2, rendering UI via PowerVR SGX, and managing touch/audio I/O. Use Value: Single-chip integration eliminates need for discrete GPU, DSP, and video decoder - reducing BOM cost and PCB area by >40% versus multi-chip solutions. |
Use Scenario: Real-time map rendering, voice-guided turn-by-turn navigation, and rear-view camera display with low-latency video overlay. IC Role / Device Role / Timing Role: OMAP3530DCBBA runs Linux-based navigation stack, processes camera feed through ISP, renders vector maps using OpenGL ES 2.0, and drives dual-display output (LCD + CVBS). Use Value: Hardware-accelerated graphics and video processing ensure consistent 60 fps UI refresh and <50 ms camera-to-display latency - critical for driver safety compliance. |
| Digital Video Camera | Industrial Human-Machine Interface |
Use Scenario: 1080p video capture with digital zoom, color correction, and HDMI output. IC Role / Device Role / Timing Role: OMAP3530DCBBA receives raw Bayer data from CMOS sensor via parallel interface, applies ISP pipeline (demosaic, white balance, gamma), encodes to H.264, and outputs via DSS to HDMI encoder. Use Value: On-chip ISP and video encoder reduce external component count; SmartReflex dynamically scales voltage during burst capture to maintain thermal envelope. |
Use Scenario: Ruggedized panel PC running factory automation software with real-time data visualization and local video analytics. IC Role / Device Role / Timing Role: OMAP3530DCBBA executes deterministic Linux RT kernel, processes machine vision input via camera ISP, renders SVG-based dashboards, and communicates over industrial Ethernet via external PHY. Use Value: Dual-core heterogeneity isolates real-time control (DSP) from UI rendering (ARM/GPU), ensuring guaranteed response times for PLC-like operations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3525DCBBA | Omits PowerVR SGX graphics accelerator; identical ARM/DSP cores and memory subsystem | Suitable for non-3D UI applications (e.g., basic PNDs, data loggers) where GPU is unnecessary | Select when graphics acceleration is not required - reduces cost and power consumption without sacrificing CPU/DSP performance |
| AM3517BZCNA | Successor device with same ARM Cortex-A8 core but enhanced peripherals (USB 2.0 PHY integrated, improved security features) | Better suited for new designs requiring longer lifecycle support and industrial-grade USB host/OTG functionality | Choose for new designs needing extended availability and integrated USB PHY - requires minor board redesign due to different pinout |
Compared with OMAP3530DCBBA, OMAP3525DCBBA removes the SGX GPU to lower cost and power, while AM3517BZCNA retains CPU/DSP capability but adds integrated USB 2.0 PHY and enhanced security - making it more suitable for long-lifecycle industrial deployments.
Availability
OMAP3530DCBBA is available at Aetrix Electronics and suitable for portable media players, automotive navigation systems, and digital video cameras requiring stable component supply and long-term industrial support.
Supply support for OMAP3530DCBBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and wireless technologies, with decades of experience in high-reliability industrial and automotive silicon.
The OMAP3530DCBBA belongs to TI's OMAP™ 3 family - designed specifically for mobile and portable applications demanding high-performance multimedia processing, low-power operation, and rich OS support (Linux, Android, Windows CE).
FAQ
What operating systems does the OMAP3530DCBBA officially support?
The OMAP3530DCBBA is validated for Linux, Android, and Windows CE operating systems. TI provides Board Support Packages (BSPs), kernel drivers, and graphics stacks for all three platforms. Android support was added in the October 2013 revision of the SPRS507H datasheet, confirming compatibility with early Android versions targeting embedded devices.
Does the OMAP3530DCBBA include on-chip graphics acceleration?
Yes, the OMAP3530DCBBA integrates a PowerVR SGX graphics accelerator capable of up to 10 MPoly/sec, supporting OpenGL ES 1.1/2.0 and OpenVG 1.0 APIs. This GPU is absent in the pin-compatible OMAP3525DCBBA variant - a key differentiator confirmed in TI's SPRS507H documentation.
What memory interfaces does the OMAP3530DCBBA support?
The OMAP3530DCBBA supports LPDDR SDRAM via its integrated SDRAM Controller (SDRC), plus NAND/NOR flash, SRAM, and Pseudo-SRAM via the General-Purpose Memory Controller (GPMC). It provides eight chip-select pins and flexible asynchronous protocol control for custom logic interfacing - all documented in Section 6.4 of the SPRS507H datasheet.
How does SmartReflex technology function in the OMAP3530DCBBA?
SmartReflex in the OMAP3530DCBBA uses on-die process/voltage/temperature sensors to dynamically adjust core voltage (0.985 V to 1.35 V) based on real-time workload and thermal conditions. This adaptive voltage scaling reduces active power consumption without compromising performance - a feature explicitly enabled in both MPU and IVA2.2 domains per TI's electrical characteristics tables.
Is the OMAP3530DCBBA pin-compatible with other OMAP3 packages?
The OMAP3530DCBBA uses the CBB 515-pin s-PBGA package. It shares pinout compatibility with the CBC package variant but differs from the CUS 423-pin package - which lacks POP interface, GPMC wait pins, and certain UART/McBSP signal options. Table 1-1 in SPRS507H details these mechanical and functional differences.
OMAP3530DCBBA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-VFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 720MHz
- Co-Processors/DSP:
- Signal Processing; C64x+, Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3530DCBBA FAQ
1.How can I place an order for OMAP3530DCBBA through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3530DCBBA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3530DCBBA reliable?
The price and inventory of OMAP3530DCBBA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3530DCBBA is usually 5 days.
3.What payment methods are accepted for OMAP3530DCBBA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3530DCBBA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3530DCBBA?
OMAP3530DCBBA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3530DCBBA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3530DCBBA?
For technical support, including OMAP3530DCBBA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3530DCBBA requirements.
6.How does Aetrix verify that OMAP3530DCBBA is sourced from the original manufacturer or authorized distributors?
All OMAP3530DCBBA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3530DCBBA meets industry standards.
7.What is the process for return or replacement of OMAP3530DCBBA?
All OMAP3530DCBBA units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3530DCBBA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3530DCBBA part is unused and in its original packaging.
Return procedure for OMAP3530DCBBA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
OMAP3530DCBBA Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

