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Texas Instruments OMAP3530DCBBA

Part No.:
OMAP3530DCBBA
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
515-VFBGA, FCBGA
Datasheet:
AetrixOMAP3530DCBBA.pdf
Description:
IC MPU OMAP-35XX 720MHZ 515FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,507

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Product details

Overview

OMAP3530DCBBA from Texas Instruments is a high-performance applications processor integrating an up to 720-MHz ARM Cortex-A8 CPU core, a 520-MHz TMS320C64x+ DSP core, and a PowerVR SGX graphics accelerator - enabling concurrent video decode, 3D rendering, and real-time image processing in portable media players and navigation devices.

For engineers reviewing the OMAP3530DCBBA datasheet, OMAP3530DCBBA pinout, OMAP3530DCBBA application, or OMAP3530DCBBA equivalent, this device supports Linux, Android, and Windows CE operating systems; delivers up to 10 MPoly/sec graphics throughput; integrates SmartReflex adaptive voltage scaling; and implements a 515-pin s-PBGA package with 0.5-mm top / 0.4-mm bottom ball pitch.

Technical Context

The OMAP3530DCBBA implements a heterogeneous dual-core architecture: the ARM Cortex-A8 handles general-purpose OS execution and application logic, while the C64x+ DSP offloads intensive signal processing tasks including video encode/decode, audio codecs, and ISP pipeline operations. Both cores share access to 256-KB L2 cache and 64-KB on-chip SRAM.

Its IVA2.2 subsystem includes dedicated hardware accelerators for H.264/MPEG-4 decode, JPEG encode/decode, and camera image signal processing (CCD/CMOS interface, BT.601/BT.656 support), while the PowerVR SGX GPU provides OpenGLES 1.1/2.0 and OpenVG 1.0 acceleration - all coordinated via L3/L4 interconnects with QoS-aware arbitration.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreARM Cortex-A8, up to 720 MHz - enables Linux/Android application execution with NEON SIMD and Thumb-2 instruction set efficiency
DSP CoreTMS320C64x+, up to 520 MHz - handles real-time video/audio codecs and sensor fusion without CPU intervention
GPUPowerVR SGX, 10 MPoly/sec - supports OpenGL ES 2.0-accelerated UI rendering and 3D gaming on embedded displays
Memory InterfaceSDRAM controller + GPMC with 8 chip-selects - enables direct connection to LPDDR SDRAM and NAND/NOR flash without glue logic
Process Technology65-nm CMOS - achieves sub-1.35-V adaptive core voltage via SmartReflex AVS for dynamic power optimization
Package515-pin s-PBGA (CBB suffix), 0.5-mm top / 0.4-mm bottom ball pitch - supports POP memory stacking and industrial thermal dissipation
I/O CountUp to 188 GPIO pins (multiplexed) - provides flexible peripheral interfacing including 3x UART, 5x McBSP, 4x McSPI, and 3x MMC/SDIO

Pinout & Package

The OMAP3530DCBBA is housed in a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom, supporting Package-on-Package (POP) memory stacking and discrete memory interfaces. Ball assignments follow TI's standardized quadrant layout (A–D) with defined power domains (vdd_core, vdd_mpu_iva, vdds_mem, vdda_dac) and multiplexed I/O functions.

Pin/Terminal Circuit Role Design Meaning
sdrc_d0–sdrc_d31SDRAM Data Bus32-bit bidirectional data path for LPDDR/SDR SDRAM; supports burst transfers and ECC-capable operation
sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1SDRAM Address & Bank Select16-bit address + 2-bit bank select for up to 1 GB of external memory addressing
gpmc_ncs0–gpmc_ncs7General-Purpose Memory Chip SelectEight independent chip-select outputs for NOR/NAND/SRAM/Pseudo-SRAM with configurable timing
dss_data0–dss_data23, dss_hsync, dss_vsyncDisplay Subsystem Parallel Output24-bit RGB + sync signals driving LCD panels up to HD resolution with programmable timing and rotation
mcbsp1_dx–mcbsp1_fsxMcBSP1 Serial Audio InterfaceFull-duplex, frame-synchronized serial port supporting I2S, PCM, and TDM protocols for audio codec interfacing

Key Features

Feature Design Value
SmartReflex AVSReal-time adaptive voltage scaling across MPU and IVA domains reduces active power by up to 30% versus fixed-voltage operation
IVA2.2 Hardware AccelerationDedicated engines for H.264 BP/MP decode, JPEG encode/decode, and camera ISP eliminate CPU/DSP load for multimedia pipelines
PowerVR SGX GraphicsTile-based rendering engine with universal scalable shader supports OpenGL ES 2.0 shaders and anti-aliased 3D UIs
Flexible Memory ArchitectureIntegrated SDRC + GPMC allows simultaneous use of LPDDR for system memory and NAND for storage - no external memory controller required
Multi-Protocol Serial Interfaces5 McBSPs (2 with sidetone), 4 McSPI ports, 3 UARTs (1 with IrDA/CIR), and USB OTG/host enable full peripheral connectivity

Applications

Portable Media Player Automotive Navigation System

Use Scenario: High-resolution video playback with multitouch UI and background audio streaming.

IC Role / Device Role / Timing Role: OMAP3530DCBBA serves as main SoC executing Android OS, decoding 720p H.264 video in IVA2.2, rendering UI via PowerVR SGX, and managing touch/audio I/O.

Use Value: Single-chip integration eliminates need for discrete GPU, DSP, and video decoder - reducing BOM cost and PCB area by >40% versus multi-chip solutions.

Use Scenario: Real-time map rendering, voice-guided turn-by-turn navigation, and rear-view camera display with low-latency video overlay.

IC Role / Device Role / Timing Role: OMAP3530DCBBA runs Linux-based navigation stack, processes camera feed through ISP, renders vector maps using OpenGL ES 2.0, and drives dual-display output (LCD + CVBS).

Use Value: Hardware-accelerated graphics and video processing ensure consistent 60 fps UI refresh and <50 ms camera-to-display latency - critical for driver safety compliance.

Digital Video Camera Industrial Human-Machine Interface

Use Scenario: 1080p video capture with digital zoom, color correction, and HDMI output.

IC Role / Device Role / Timing Role: OMAP3530DCBBA receives raw Bayer data from CMOS sensor via parallel interface, applies ISP pipeline (demosaic, white balance, gamma), encodes to H.264, and outputs via DSS to HDMI encoder.

Use Value: On-chip ISP and video encoder reduce external component count; SmartReflex dynamically scales voltage during burst capture to maintain thermal envelope.

Use Scenario: Ruggedized panel PC running factory automation software with real-time data visualization and local video analytics.

IC Role / Device Role / Timing Role: OMAP3530DCBBA executes deterministic Linux RT kernel, processes machine vision input via camera ISP, renders SVG-based dashboards, and communicates over industrial Ethernet via external PHY.

Use Value: Dual-core heterogeneity isolates real-time control (DSP) from UI rendering (ARM/GPU), ensuring guaranteed response times for PLC-like operations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
OMAP3525DCBBAOmits PowerVR SGX graphics accelerator; identical ARM/DSP cores and memory subsystemSuitable for non-3D UI applications (e.g., basic PNDs, data loggers) where GPU is unnecessarySelect when graphics acceleration is not required - reduces cost and power consumption without sacrificing CPU/DSP performance
AM3517BZCNASuccessor device with same ARM Cortex-A8 core but enhanced peripherals (USB 2.0 PHY integrated, improved security features)Better suited for new designs requiring longer lifecycle support and industrial-grade USB host/OTG functionalityChoose for new designs needing extended availability and integrated USB PHY - requires minor board redesign due to different pinout

Compared with OMAP3530DCBBA, OMAP3525DCBBA removes the SGX GPU to lower cost and power, while AM3517BZCNA retains CPU/DSP capability but adds integrated USB 2.0 PHY and enhanced security - making it more suitable for long-lifecycle industrial deployments.

Availability

OMAP3530DCBBA is available at Aetrix Electronics and suitable for portable media players, automotive navigation systems, and digital video cameras requiring stable component supply and long-term industrial support.

Supply support for OMAP3530DCBBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and wireless technologies, with decades of experience in high-reliability industrial and automotive silicon.

The OMAP3530DCBBA belongs to TI's OMAP™ 3 family - designed specifically for mobile and portable applications demanding high-performance multimedia processing, low-power operation, and rich OS support (Linux, Android, Windows CE).

FAQ

What operating systems does the OMAP3530DCBBA officially support?

The OMAP3530DCBBA is validated for Linux, Android, and Windows CE operating systems. TI provides Board Support Packages (BSPs), kernel drivers, and graphics stacks for all three platforms. Android support was added in the October 2013 revision of the SPRS507H datasheet, confirming compatibility with early Android versions targeting embedded devices.

Does the OMAP3530DCBBA include on-chip graphics acceleration?

Yes, the OMAP3530DCBBA integrates a PowerVR SGX graphics accelerator capable of up to 10 MPoly/sec, supporting OpenGL ES 1.1/2.0 and OpenVG 1.0 APIs. This GPU is absent in the pin-compatible OMAP3525DCBBA variant - a key differentiator confirmed in TI's SPRS507H documentation.

What memory interfaces does the OMAP3530DCBBA support?

The OMAP3530DCBBA supports LPDDR SDRAM via its integrated SDRAM Controller (SDRC), plus NAND/NOR flash, SRAM, and Pseudo-SRAM via the General-Purpose Memory Controller (GPMC). It provides eight chip-select pins and flexible asynchronous protocol control for custom logic interfacing - all documented in Section 6.4 of the SPRS507H datasheet.

How does SmartReflex technology function in the OMAP3530DCBBA?

SmartReflex in the OMAP3530DCBBA uses on-die process/voltage/temperature sensors to dynamically adjust core voltage (0.985 V to 1.35 V) based on real-time workload and thermal conditions. This adaptive voltage scaling reduces active power consumption without compromising performance - a feature explicitly enabled in both MPU and IVA2.2 domains per TI's electrical characteristics tables.

Is the OMAP3530DCBBA pin-compatible with other OMAP3 packages?

The OMAP3530DCBBA uses the CBB 515-pin s-PBGA package. It shares pinout compatibility with the CBC package variant but differs from the CUS 423-pin package - which lacks POP interface, GPMC wait pins, and certain UART/McBSP signal options. Table 1-1 in SPRS507H details these mechanical and functional differences.

OMAP3530DCBBA Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
515-VFBGA, FCBGA
Series:
OMAP-35xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
-
SATA:
-
USB:
USB 1.x (3), USB 2.0 (1)
Voltage - I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
515-POP-FCBGA (12x12)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

OMAP3530DCBBA FAQ

1.How can I place an order for OMAP3530DCBBA through Aetrix?

Please submit a Request for Quotation (RFQ) for OMAP3530DCBBA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OMAP3530DCBBA reliable?

The price and inventory of OMAP3530DCBBA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3530DCBBA is usually 5 days.

3.What payment methods are accepted for OMAP3530DCBBA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3530DCBBA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OMAP3530DCBBA?

OMAP3530DCBBA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OMAP3530DCBBA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OMAP3530DCBBA?

For technical support, including OMAP3530DCBBA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3530DCBBA requirements.

6.How does Aetrix verify that OMAP3530DCBBA is sourced from the original manufacturer or authorized distributors?

All OMAP3530DCBBA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3530DCBBA meets industry standards.

7.What is the process for return or replacement of OMAP3530DCBBA?

All OMAP3530DCBBA units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3530DCBBA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OMAP3530DCBBA part is unused and in its original packaging.

Return procedure for OMAP3530DCBBA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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