Texas Instruments OMAP3530DCBC72

Overview

OMAP3530DCBC72 from Texas Instruments is a dual-core applications processor integrating an up to 720-MHz ARM Cortex-A8 CPU and a 520-MHz TMS320C64x+ DSP, with PowerVR SGX graphics acceleration, 256-KB L2 cache, and integrated video/audio/image processing subsystems. It targets high-performance portable media and navigation systems requiring real-time multimedia decoding, display composition, and camera interface support.

For engineers reviewing the OMAP3530DCBC72 datasheet, OMAP3530DCBC72 pinout, OMAP3530DCBC72 application, or OMAP3530DCBC72 equivalent, this page delivers verified technical context, package-specific pin mapping, functional subsystem boundaries, and validated alternative options for embedded Linux, Android, and Windows CE designs.

Technical Context

The OMAP3530DCBC72 implements a heterogeneous architecture with tightly coupled MPU (ARM Cortex-A8), IVA2.2 (C64x+ DSP + video accelerators), and PowerVR SGX GPU subsystems, all interconnected via hierarchical L3/L4 buses. It supports simultaneous execution of HLOS tasks, real-time DSP algorithms, and hardware-accelerated 3D rendering.

Its memory subsystem includes 256-KB unified L2 cache, 64-KB on-chip SRAM, 112-KB ROM, and external interfaces for LPDDR SDRAM and NAND/NOR flash. Power management leverages SmartReflex AVS with adaptive core voltage (0.985–1.35 V) and dynamic frequency scaling across multiple power domains.

Key Specifications

Pinout & Package

OMAP3530DCBC72 is housed in a 515-ball s-PBGA package (CBC suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom. This package supports discrete memory interface, full GPMC functionality (8 chip-selects), and 188 GPIO pins - distinguishing it from CUS (423-ball) and CBB variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3530DCBC72, OMAP3525DCBC72 removes graphics acceleration but retains full multimedia processing capability, while AM3517BZCNA3 sacrifices DSP and audio/video hardware blocks for simplified industrial control use cases - requiring architectural reevaluation of software partitioning and peripheral dependencies.

Availability

OMAP3530DCBC72 is available at Aetrix Electronics and suitable for portable navigation devices, digital video cameras, and web tablets requiring stable component supply, long-term lifecycle support, and full documentation access for Linux/Android BSP development.

Supply support for OMAP3530DCBC72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in high-performance computing and low-power design.

The OMAP3530DCBC72 belongs to TI's OMAP™3 family, engineered specifically for mobile multimedia applications demanding integrated CPU, DSP, GPU, and imaging subsystems in a single die - targeting Android/Linux-based consumer electronics with stringent power and performance requirements.

FAQ

What operating systems are officially supported on OMAP3530DCBC72?

OMAP3530DCBC72 is validated for Linux (including TI's Linux SDK), Windows CE, and Android platforms. TI provides board support packages (BSPs), kernel drivers, and graphics libraries (PVR SDK) for all three. Android support was added in revision SPRS507H (October 2013), confirming compatibility with early Android versions up to 4.x.

Does OMAP3530DCBC72 include on-chip ROM and SRAM, and what are their roles?

Yes, OMAP3530DCBC72 integrates 112-KB on-chip ROM containing boot code and security routines, plus 64-KB shared SRAM accessible by both ARM and DSP cores for low-latency inter-processor communication. The ROM enables secure boot and initial device configuration; the SRAM serves as fast scratchpad memory for time-critical algorithms in OMAP3530DCBC72-based systems.

How does the SmartReflex technology in OMAP3530DCBC72 reduce power consumption?

SmartReflex in OMAP3530DCBC72 uses on-die process/voltage/temperature sensors to dynamically adjust core voltage (0.985–1.35 V) and clock frequency per subsystem. This adaptive voltage scaling (AVS) lowers active power without software overhead - measured reductions exceed 20% in video playback versus fixed-voltage operation, directly extending battery life in OMAP3530DCBC72 portable designs.

What display interfaces does OMAP3530DCBC72 support natively?

OMAP3530DCBC72 supports parallel RGB (up to 24-bit), HD resolution output, NTSC/PAL composite video, S-video, and RFBI for remote frame buffer LCD panels. It includes dual display controllers capable of driving two independent panels simultaneously - enabling split-screen UIs or primary display + secondary status panel without external logic.

Is OMAP3530DCBC72 pin-compatible with other OMAP35xx variants like OMAP3525 or OMAP3503?

OMAP3530DCBC72 shares identical pinout and package (515-pin CBC s-PBGA) with OMAP3525DCBC72, making them drop-in replacements except for PowerVR SGX graphics functionality. However, it is not pin-compatible with OMAP3503 or CUS-package variants due to differing ball counts, memory interface allocations, and peripheral signal mappings - PCB layout must match the specific CBC package footprint.