Texas Instruments OMAP3530DCBCA

Overview

OMAP3530DCBCA from Texas Instruments is a high-performance applications processor integrating an ARM Cortex-A8 core (up to 720 MHz), a TMS320C64x+ DSP core (up to 520 MHz), and a PowerVR SGX graphics accelerator - enabling concurrent video decode, 3D rendering, and real-time image processing in portable media players and navigation devices.

For engineers reviewing the OMAP3530DCBCA datasheet, OMAP3530DCBCA pinout, OMAP3530DCBCA application, or OMAP3530DCBCA equivalent, this page delivers verified package mapping (515-pin s-PBGA, CBC suffix), confirmed dual-core clock domains, validated video DAC and display subsystem capabilities, and precise GPIO and memory interface constraints per TI SPRS507H Rev. October 2013.

Technical Context

The OMAP3530DCBCA implements a heterogeneous dual-core architecture: the ARM Cortex-A8 executes Linux/Android OS tasks with NEON SIMD acceleration, while the C64x+ DSP handles intensive IVA2.2 multimedia workloads including HD video encode/decode and audio preprocessing. Both cores share 256 KB L2 cache and access unified memory via L3/L4 interconnects.

Its integrated peripherals include a camera ISP supporting BT.601/BT.656 interfaces, dual LCD controllers with RFBI support, three MMC/SDIO ports, five McBSP serial audio interfaces (two with sidetone), and SmartReflex-enabled adaptive voltage scaling for dynamic power management across OPP levels.

Key Specifications

Pinout & Package

OMAP3530DCBCA is housed in a 515-ball, 0.5-mm (top) / 0.4-mm (bottom) pitch s-PBGA package (CBC suffix), optimized for Package-on-Package (POP) memory stacking and discrete LPDDR interface. Ball assignments follow TI SPRS507H Table 2-2 (CBC Pin Map).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3525DCBCA and AM3517BZCNA, OMAP3530DCBCA uniquely combines ARM Cortex-A8, C64x+ DSP, and PowerVR SGX530 in a single die - making it the only option among the three capable of concurrent high-definition video decode, 3D graphics rendering, and general-purpose OS execution without performance throttling.

Availability

OMAP3530DCBCA is available at Aetrix Electronics and suitable for portable media players, automotive navigation systems, and digital video cameras requiring stable component supply and long-term industrial lifecycle support.

Supply support for OMAP3530DCBCA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in high-reliability silicon design.

The OMAP3530DCBCA belongs to TI's OMAP™ 3 family - engineered specifically for mobile multimedia applications demanding integrated video, graphics, and signal processing in thermally constrained handheld form factors.

FAQ

What operating systems are officially supported on OMAP3530DCBCA?

OMAP3530DCBCA supports Linux®, Windows® CE, and Android™ (as documented in TI SPRS507H Rev. October 2013). Android 2.x was validated with the ICS (Ice Cream Sandwich) BSP release, leveraging the ARM Cortex-A8 NEON unit and SGX530 GPU for accelerated UI rendering. OMAP3530DCBCA does not support Android versions beyond 4.0 without third-party porting effort due to discontinued vendor kernel maintenance.

Does OMAP3530DCBCA support LPDDR memory, and what are the interface limitations?

Yes, OMAP3530DCBCA supports LPDDR SDRAM via its SDRAM Controller (SDRC) with 16-/32-bit bus width and 1 GB total address space. The CBC package enables glueless LPDDR interface with dedicated DQS strobes and adaptive impedance control. However, it does not support LPDDR2 or LPDDR3 - only JEDEC-compliant LPDDR (low-power DDR1) per Section 4.6 of SPRS507H.

How many display interfaces does OMAP3530DCBCA provide, and are they concurrent?

OMAP3530DCBCA integrates a dual-output display subsystem supporting up to two independent LCD panels simultaneously - one via parallel RGB interface (up to 24-bit) and another via RFBI (Remote Frame Buffer Interface). It also supports composite NTSC/PAL output through integrated 10-bit DACs. All three outputs (RGB, RFBI, CVBS) can operate concurrently, as confirmed in Section 1.3 and Figure 1-1 of SPRS507H.

What is the role of the C64x+ DSP in OMAP3530DCBCA, and can it be used independently of the ARM core?

The C64x+ DSP in OMAP3530DCBCA handles compute-intensive multimedia tasks including video encode/decode (H.264, MPEG-4), audio processing (AAC, MP3), and image enhancement - offloading these from the ARM Cortex-A8. It operates independently with its own L1/L2 memory and EDMA controller, and can run bare-metal or DSP/BIOS firmware without ARM intervention, as defined in the IVA2.2 subsystem architecture.

Is OMAP3530DCBCA pin-compatible with OMAP3525DCBCA, and what hardware changes are needed for substitution?

OMAP3530DCBCA and OMAP3525DCBCA share identical 515-pin s-PBGA (CBC) packaging and pinout per TI SPRS507H Table 2-2, making them mechanically and electrically pin-compatible. However, the OMAP3530DCBCA includes the PowerVR SGX530 GPU, requiring additional power sequencing (vdda_gfx rail) and PCB routing for GPU-specific signals (e.g., dss_gfx_*). No layout change is needed for substitution, but firmware must disable unused GPU blocks when migrating from OMAP3530DCBCA to OMAP3525DCBCA.