Texas Instruments OMAP3530ECBB72

Overview

OMAP3530ECBB72 from Texas Instruments is a 515-pin s-PBGA applications processor integrating an ARM Cortex-A8 core (up to 720 MHz), C64x+ DSP core (up to 520 MHz), PowerVR SGX graphics accelerator, and IVA2.2 video/audio subsystem. It delivers hardware-accelerated HD video decode/encode, 3D graphics, camera ISP, and dual-display support for portable media and navigation devices.

For engineers reviewing the OMAP3530ECBB72 datasheet, OMAP3530ECBB72 pinout, OMAP3530ECBB72 application, or OMAP3530ECBB72 equivalent, key selection criteria include its 720-MHz MPU clock, 520-MHz DSP clock, PowerVR SGX GPU presence, POP-enabled memory stacking capability, and 188 GPIOs with extensive peripheral muxing.

Technical Context

The OMAP3530ECBB72 implements a heterogeneous dual-core architecture: the ARM Cortex-A8 handles OS execution and application logic under Linux, Android, or Windows CE, while the C64x+ DSP offloads real-time video, audio, and imaging processing. Its L3/L4 interconnect enables concurrent high-bandwidth access to internal SRAM, ROM, and external SDRAM via SDRC and GPMC controllers.

Power management relies on SmartReflex AVS with adaptive core voltage (0.985–1.35 V), dynamic voltage/frequency scaling (DVFS), and ultralow-power standby modes. The device supports discrete LPDDR SDRAM and NAND/NOR flash interfaces, plus POP stacking in CBB/CBC packages - a feature absent in the CUS variant.

Key Specifications

Pinout & Package

The OMAP3530ECBB72 is housed in a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom, supporting Package-on-Package (POP) memory stacking. Ball assignments follow TI's documented quadrant layout (A–D) with defined power domains (vdd_core, vdd_mpu_iva, vdds_mem, vdda_dac), interface groups (SDRC, GPMC, DSS, MMC, McBSP), and debug/test pins (JTAG, ETM, SDTI).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3525ECBB72, the OMAP3530ECBB72 adds essential 3D graphics acceleration for UI-rich applications; compared with AM3715BZC, it offers proven maturity and broader legacy design support but lacks 1-GHz scaling and newer USB features.

Availability

OMAP3530ECBB72 is available at Aetrix Electronics and suitable for portable media players, automotive navigation systems, and digital video cameras requiring stable component supply and long-term industrial availability.

Supply support for OMAP3530ECBB72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer markets.

The OMAP3530ECBB72 belongs to TI's OMAP™3 family of applications processors, designed specifically for high-performance mobile multimedia devices requiring integrated video, graphics, imaging, and connectivity capabilities.

FAQ

What is the maximum operating frequency of the ARM Cortex-A8 core in the OMAP3530ECBB72?

The OMAP3530ECBB72 features an ARM Cortex-A8 microprocessor core rated for up to 720 MHz. This frequency is validated under commercial temperature conditions with appropriate voltage (0.985–1.35 V) and cooling. The actual sustained clock depends on thermal design, SmartReflex AVS settings, and workload intensity - TI's OPP (Operating Performance Point) tables define guaranteed frequencies per voltage point.

Does the OMAP3530ECBB72 include a graphics processing unit (GPU)?

Yes, the OMAP3530ECBB72 integrates a PowerVR SGX530 graphics accelerator, delivering up to 10 million polygons per second. This GPU supports OpenGL ES 1.1/2.0 and OpenVG 1.0 APIs, enabling hardware-accelerated 3D rendering and vector graphics - a key differentiator from the OMAP3525ECBB72, which omits this block.

What memory interfaces does the OMAP3530ECBB72 support?

The OMAP3530ECBB72 supports multiple memory interfaces: an SDRAM Controller (SDRC) for LPDDR/DDR, a General Purpose Memory Controller (GPMC) for NAND/NOR flash and SRAM, and a Package-on-Package (POP) interface for stacked memory. The CBB package enables POP stacking, while discrete memory connections remain fully accessible via GPMC and SDRC pins.

How many general-purpose I/O pins does the OMAP3530ECBB72 provide?

The OMAP3530ECBB72 supports up to 188 general-purpose I/O pins, all multiplexed with peripheral functions including UART, McSPI, McBSP, MMC/SDIO, and I²C. Pin assignment and muxing are defined in Tables 2-1 (CBB) and 2-4 of the SPRS507H datasheet, with physical ball locations mapped across quadrants A–D of the 515-ball s-PBGA package.

Is the OMAP3530ECBB72 pin-compatible with other OMAP3 family members?

The OMAP3530ECBB72 shares the same 515-pin s-PBGA (CBB) package footprint with OMAP3525ECBB72 and AM3715BZC, enabling mechanical compatibility. However, signal-level pin compatibility is limited: OMAP3525ECBB72 lacks GPU-related pins, and AM3715BZC reassigns some peripheral balls for enhanced USB functionality - full functional replacement requires schematic and layout review.