Texas Instruments OMAP3530ECBBA

Overview

OMAP3530ECBBA from Texas Instruments is a high-performance applications processor integrating an ARM Cortex-A8 core (up to 720 MHz), a TMS320C64x+ DSP core (up to 520 MHz), and a PowerVR SGX graphics accelerator - enabling concurrent video decode, 3D rendering, and OS execution in portable media devices. It features 256-KB L2 cache, 64-KB on-chip SRAM, and dual 10-bit DACs for composite video output.

For engineers reviewing the OMAP3530ECBBA datasheet, OMAP3530ECBBA pinout, OMAP3530ECBBA application, or OMAP3530ECBBA equivalent, this page delivers verified technical context, package-specific pin mapping, real-world use cases, and validated alternative parts for embedded Linux, Android, and Windows CE systems requiring integrated multimedia acceleration and low-power mobile compute.

Technical Context

The OMAP3530ECBBA implements a heterogeneous dual-core architecture: the ARM Cortex-A8 handles general-purpose OS tasks and application logic with NEON SIMD support, while the C64x+ DSP offloads intensive image/video processing via the IVA2.2 subsystem. Both cores share a unified 256-KB L2 cache and access external memory through a 16-/32-bit SDRAM controller and GPMC interface.

Its display subsystem supports parallel RGB up to HD resolution, dual LCD panels, and analog NTSC/PAL output via integrated 10-bit DACs; the PowerVR SGX GPU enables OpenGLES 1.1/2.0 and OpenVG 1.0 acceleration - a capability exclusive to the OMAP3530 family (not present in OMAP3525).

Key Specifications

Pinout & Package

The OMAP3530ECBBA is housed in a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom, supporting Package-on-Package (POP) memory stacking and discrete memory interfaces. Ball assignments follow TI's CBB pin map (SPRS507H, Tables 2-1 and 2-4), with dedicated signal groups for SDRC, GPMC, DSS, MMC/SDIO, McBSP, McSPI, USB, and debug interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3530ECBBA, OMAP3525ECBBA removes GPU functionality while retaining identical CPU/DSP performance and power profile, whereas AM3517BZCNA eliminates the DSP entirely - simplifying software stack but requiring CPU-based media processing and increasing active power by ~25% under video load.

Availability

OMAP3530ECBBA is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and web tablets requiring stable component supply, long-term lifecycle support, and qualified industrial-grade silicon.

Supply support for OMAP3530ECBBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity solutions, with decades of expertise in low-power, high-integration SoCs for mobile and industrial applications.

The OMAP3530ECBBA belongs to TI's OMAP 3 family - designed specifically for portable multimedia devices demanding concurrent high-definition video, 3D graphics, and rich OS execution within strict thermal and power envelopes.

FAQ

What operating systems are officially supported on the OMAP3530ECBBA?

The OMAP3530ECBBA is officially supported for Linux (including TI's Linux SDK), Windows CE, and Android - with vendor-provided BSPs, kernel drivers, and graphics libraries (e.g., PowerVR SDK, IVA2.2 codecs). Android support was added in SPRS507H revision (October 2013), confirming compatibility with Android 2.3+ versions targeting ARMv7-A architecture.

Does the OMAP3530ECBBA include on-chip ROM and SRAM, and what are their roles?

Yes, the OMAP3530ECBBA integrates 112-KB on-chip ROM containing boot firmware and security code, plus 64-KB of shared SRAM accessible by both ARM and DSP cores for low-latency inter-processor communication and critical real-time buffers. This eliminates dependency on external boot memory and accelerates boot time to under 500 ms in typical configurations.

How does the SmartReflex technology function in the OMAP3530ECBBA?

SmartReflex in the OMAP3530ECBBA uses on-die process/voltage/temperature sensors to dynamically adjust core voltage (0.985–1.35 V) across five OPP levels - reducing active power by up to 40% versus fixed-voltage operation while maintaining full 720-MHz ARM and 520-MHz DSP performance. It operates transparently under Linux cpufreq and Android power HAL control.

What video output interfaces does the OMAP3530ECBBA support natively?

The OMAP3530ECBBA supports native analog video output via two integrated 10-bit DACs (tv_out1/tv_out2) for composite NTSC/PAL and S-Video, plus parallel digital RGB up to HD resolution (1366×768) with programmable timing. It does not include HDMI or LVDS transmitters - those require external PHYs connected via DSS parallel interface.

Is the OMAP3530ECBBA pin-compatible with other OMAP3 packages like CUS or CBC?

No - the OMAP3530ECBBA uses the CBB package (515-pin s-PBGA), which differs electrically and mechanically from the CUS (423-pin) and CBC (515-pin) variants. While CBB and CBC share pin count, CBB omits certain signals (e.g., gpmc_ncs1/2, gpmc_wait1/2) and has distinct ball assignments per Table 1-1 in SPRS507H - requiring unique PCB layout.