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Texas Instruments OMAP3530ECBBALPD
- Part No.:
- OMAP3530ECBBALPD
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-VFBGA, FCBGA
- Datasheet:
-
OMAP3530ECBBALPD.pdf
- Description:
- IC MPU OMAP-35XX 600MHZ 515FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
OMAP3530ECBBALPD from Texas Instruments is a 515-pin s-PBGA applications processor integrating an ARM Cortex-A8 core (up to 720 MHz), TMS320C64x+ DSP core (up to 520 MHz), PowerVR SGX graphics accelerator, and IVA2.2 video/audio subsystem. It supports Linux, Android, and Windows CE, and targets portable media players, digital video cameras, and web tablets requiring high-performance multimedia processing with integrated display, camera, and USB OTG interfaces.
For engineers reviewing the OMAP3530ECBBALPD datasheet, OMAP3530ECBBALPD pinout, OMAP3530ECBBALPD application, or OMAP3530ECBBALPD equivalent, this page delivers verified technical context, package-specific pin mapping, real-world use cases, and validated alternative options for embedded system design and BOM optimization.
Technical Context
The OMAP3530ECBBALPD implements a heterogeneous dual-core architecture: the ARM Cortex-A8 handles OS execution and application logic with NEON SIMD acceleration, while the C64x+ DSP offloads intensive image/video processing tasks including encode/decode, scaling, and color space conversion. The dedicated PowerVR SGX GPU enables OpenGL ES 1.1/2.0 and OpenVG 1.0 rendering at up to 10 MPoly/sec.
It integrates a full multimedia I/O stack - including BT.601/BT.656 camera interface, dual-display subsystem (RGB + S-Video/NTSC/PAL), three MMC/SDIO controllers, five McBSPs (two with sidetone), and high-speed USB 2.0 OTG/host - all coordinated via L3/L4 interconnects and managed by SmartReflex dynamic voltage and frequency scaling for power efficiency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8 (720 MHz) + TMS320C64x+ DSP (520 MHz) - enables concurrent HLOS execution and real-time signal processing without CPU contention. |
| Graphics Acceleration | PowerVR SGX (OMAP3530 only) - delivers hardware-accelerated 3D graphics compliant with OpenGL ES 2.0 for UI rendering and gaming. |
| Memory Interface | SDRAM Controller (SDRC) + General Purpose Memory Controller (GPMC) - supports LPDDR, DDR, NOR/NAND flash, and SRAM with ECC for robust boot and storage. |
| Video I/O | BT.601/BT.656 camera input + dual-display output (24-bit RGB + S-Video/NTSC/PAL) - enables simultaneous capture and playback in portable imaging devices. |
| Package & Process | 515-pin s-PBGA (CBB suffix), 0.5-mm top / 0.4-mm bottom ball pitch, 65-nm CMOS - optimized for POP memory stacking and thermal performance in compact handheld form factors. |
| Power Management | SmartReflex AVS + DVFS + multiple power domains - dynamically scales voltage/frequency per subsystem to reduce active power consumption in battery-powered applications. |
| Peripheral Integration | 3x UART (1 with IrDA/CIR), 3x I2C, 5x McBSP, 4x McSPI, 3x MMC/SDIO, HDQ/1-Wire, 12x timers, 188 GPIO - eliminates external glue logic for cost-sensitive consumer electronics. |
Pinout & Package
OMAP3530ECBBALPD uses a 515-ball s-PBGA package (CBB suffix) with 0.5-mm pitch on top and 0.4-mm pitch on bottom, supporting Package-on-Package (POP) memory stacking. Ball assignments follow TI's SPRS507H datasheet Section 2.2.1 (CBB Pin Map), with quadrant-specific signal routing across A–D quadrants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM Data Bus | 32-bit bidirectional data path for LPDDR/DDR memory; requires matched trace lengths and termination for signal integrity at >133 MHz. |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM Address & Bank Select | 16-bit address + 2-bit bank select for up to 1 GB addressing; multiplexed with GPMC signals in discrete memory mode. |
| gpmc_ncs0–gpmc_ncs7 | General-Purpose Memory Chip Select | Eight independent chip-select outputs for NAND/NOR/SRAM/Pseudo-SRAM; ncs1/ncs2 disabled in CBB package per Table 1-1. |
| dss_data0–dss_data23, dss_hsync, dss_vsync, dss_pclk | Display Subsystem Parallel Output | 24-bit RGB + sync signals for direct LCD panel interface; supports rotation, scaling, and temporal dithering in hardware. |
| cam_d0–cam_d11, cam_pclk, cam_hs, cam_vs, cam_fld | Camera ISP Parallel Input | 12-bit parallel interface compliant with BT.601 (8-bit YCbCr) and BT.656 (10-bit YCbCr); supports CCD/CMOS sensors up to 3-MP resolution. |
| hsusb0_data0–hsusb0_data7, hsusb0_clk, hsusb0_stp, hsusb0_nxt, hsusb0_dir | USB 2.0 High-Speed Transceiver Logic (TLL) | Dedicated 8-bit ULPI/TLL interface for USB OTG/host operation; eliminates need for external PHY in cost-sensitive designs. |
Key Features
| Feature | Design Value |
|---|---|
| IVA2.2 Video Acceleration | Hardware codecs for H.264, MPEG-4, VC-1 decode and encode; enables 720p30 video playback with <5% ARM CPU utilization. |
| SmartReflex Adaptive Voltage Scaling | Real-time voltage adjustment per operating performance point (OPP); reduces dynamic power by up to 40% vs. fixed-voltage operation. |
| Integrated Display Processor | Triple-layer composition (graphics + 2 video layers), rotation (90°/180°/270°), resize (¼× to 8×), and alpha blending - eliminates external video compositing IC. |
| Camera Image Signal Processor (ISP) | Auto-exposure, auto-white-balance, lens shading correction, and noise filtering - enables direct connection to uncalibrated CMOS sensors. |
| Secure Boot & TrustZone | Hardware-enforced secure execution environment with encrypted ROM bootloader and secure RAM partitioning - meets basic content protection requirements. |
Applications
| Portable Media Player | Digital Video Camera |
|---|---|
|
Use Scenario: High-resolution audio/video playback with touchscreen UI and wireless connectivity. IC Role / Device Role / Timing Role: Main applications processor executing Android/Linux, driving LCD, decoding H.264/AVC streams, and managing SD card storage. Use Value: Integrated PowerVR SGX and IVA2.2 enable smooth 720p UI animation and 1080p decode without external GPUs or co-processors. |
Use Scenario: Real-time HD video capture, preview, compression, and HDMI/TV-out playback. IC Role / Device Role / Timing Role: Central media hub handling raw sensor data ingestion, ISP processing, H.264 encoding, and dual-display output synchronization. Use Value: BT.656 camera interface + hardware encoder + S-Video/NTSC output deliver end-to-end video pipeline with sub-30ms latency. |
| Web Tablet | Portable Navigation Device |
|
Use Scenario: Browser-based navigation, streaming video, and multitouch gesture support in sub-10″ form factor. IC Role / Device Role / Timing Role: Primary SoC running Android, managing capacitive touchscreen controller, Wi-Fi/BT coexistence, and dual-display (LCD + HDMI). Use Value: ARM Cortex-A8 + NEON + PowerVR SGX provides responsive web rendering and GPU-accelerated UI compositing at <1W typical power. |
Use Scenario: Turn-by-turn GPS guidance with map rendering, voice prompts, and traffic updates in automotive-grade thermal envelope. IC Role / Device Role / Timing Role: Real-time navigation engine interfacing with GPS module, rendering vector maps via OpenGL ES, and driving TFT LCD with touch overlay. Use Value: Integrated 2D/3D graphics, hardware-accelerated JPEG decode, and SmartReflex enable fast map redraw and extended battery life in extended-temperature operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3525ECBBALPD | Lacks PowerVR SGX graphics accelerator; identical ARM/DSP cores, memory interfaces, and peripheral set. | Suitable for non-3D applications (e.g., basic PMP, POS terminals) where OpenGL ES rendering is unnecessary. | Select when 3D graphics capability is not required - lower cost and reduced thermal load. |
| AM3517BZCNA | ARM Cortex-A8 only (no C64x+ DSP); adds PRU-ICSS for industrial protocol offload; same package and pinout compatibility. | Better suited for industrial HMIs and gateway devices needing EtherCAT/PROFINET, not multimedia acceleration. | Choose for deterministic real-time control tasks; avoid if video encode/decode or DSP-intensive algorithms are needed. |
Compared with OMAP3525ECBBALPD and AM3517BZCNA, the OMAP3530ECBBALPD uniquely combines high-performance ARM + DSP + GPU in a single die, making it irreplaceable for applications demanding concurrent video processing, 3D UI, and OS-level multitasking - no alternative matches its balanced multimedia throughput.
Availability
OMAP3530ECBBALPD is available at Aetrix Electronics and suitable for portable media players, digital video cameras, and web tablets requiring stable component supply and long-term industrial availability.
Supply support for OMAP3530ECBBALPD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in low-power, high-integration SoCs for mobile and industrial markets.
The OMAP3530ECBBALPD belongs to TI's OMAP™ 3 family, designed specifically for portable multimedia devices requiring balanced CPU, DSP, and GPU performance within strict power and thermal constraints.
FAQ
What is the maximum operating frequency of the ARM Cortex-A8 core in OMAP3530ECBBALPD?
The OMAP3530ECBBALPD features an ARM Cortex-A8 microprocessor core rated for up to 720 MHz under commercial temperature conditions. This frequency is achievable with appropriate board-level decoupling, thermal management, and SmartReflex AVS voltage tuning per TI's OPP tables in SPRS507H Section 3.3.
Does OMAP3530ECBBALPD support Android operating system?
Yes, OMAP3530ECBBALPD is officially supported by Android versions up to Gingerbread (2.3.x) and has community porting support for later releases. TI provided Android BSPs, kernel drivers, and HAL implementations for display, camera, audio, and graphics subsystems, enabling full-stack Android deployment on reference hardware.
What memory types does the OMAP3530ECBBALPD support via its external interfaces?
The OMAP3530ECBBALPD supports LPDDR SDRAM (via SDRC), DDR SDRAM, NOR flash, NAND flash (with Hamming ECC), SRAM, and Pseudo-SRAM (via GPMC). The SDRC supports 16-/32-bit LPDDR up to 133 MHz, while GPMC provides flexible asynchronous timing for legacy memories and FPGA interfaces.
Is the PowerVR SGX graphics accelerator present in all OMAP3530ECBBALPD units?
Yes, the PowerVR SGX graphics accelerator is a defining feature of the OMAP3530 device family and is physically integrated into every OMAP3530ECBBALPD unit. It is absent only in the pin-compatible OMAP3525 variant, which shares the same package but omits the SGX block.
What is the purpose of the POP interface in the OMAP3530ECBBALPD CBB package?
The POP (Package-on-Package) interface in the OMAP3530ECBBALPD enables vertical stacking of LPDDR memory directly onto the processor package, reducing PCB area, improving signal integrity, and simplifying layout. It uses dedicated POP balls (e.g., pop_a1_a1, pop_k2_m2) defined in Table 2-1 of SPRS507H for memory interconnection.
OMAP3530ECBBALPD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-VFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Signal Processing; C64x+, Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3530ECBBALPD FAQ
1.How can I place an order for OMAP3530ECBBALPD through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3530ECBBALPD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3530ECBBALPD reliable?
The price and inventory of OMAP3530ECBBALPD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3530ECBBALPD is usually 5 days.
3.What payment methods are accepted for OMAP3530ECBBALPD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3530ECBBALPD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3530ECBBALPD?
OMAP3530ECBBALPD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3530ECBBALPD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3530ECBBALPD?
For technical support, including OMAP3530ECBBALPD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3530ECBBALPD requirements.
6.How does Aetrix verify that OMAP3530ECBBALPD is sourced from the original manufacturer or authorized distributors?
All OMAP3530ECBBALPD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3530ECBBALPD meets industry standards.
7.What is the process for return or replacement of OMAP3530ECBBALPD?
All OMAP3530ECBBALPD units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3530ECBBALPD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3530ECBBALPD part is unused and in its original packaging.
Return procedure for OMAP3530ECBBALPD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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