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Texas Instruments OMAP3530ECBBLPD
- Part No.:
- OMAP3530ECBBLPD
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-VFBGA, FCBGA
- Datasheet:
-
OMAP3530ECBBLPD.pdf
- Description:
- IC MPU OMAP-35XX 600MHZ 515FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,034
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Product details
Overview
OMAP3530ECBBLPD from Texas Instruments is a high-performance applications processor integrating an ARM Cortex-A8 core (up to 720 MHz), a TMS320C64x+ DSP core (up to 520 MHz), and a PowerVR SGX graphics accelerator - enabling concurrent video decode, 3D rendering, and real-time image processing in portable media players and navigation devices.
For engineers reviewing the OMAP3530ECBBLPD datasheet, OMAP3530ECBBLPD pinout, OMAP3530ECBBLPD application, or OMAP3530ECBBLPD equivalent, key selection criteria include its 515-pin s-PBGA (CBB) package with POP support, dual-voltage I/O (1.8 V/3.0 V), SmartReflex™ adaptive voltage scaling, and integrated display subsystem supporting dual LCD panels and NTSC/PAL video output.
Technical Context
The OMAP3530ECBBLPD implements a heterogeneous multi-core architecture: the ARM Cortex-A8 handles OS execution (Linux, Android, Windows CE) and application logic, while the C64x+ DSP offloads intensive signal processing tasks like audio codecs and video motion estimation within the IVA2.2 subsystem. The PowerVR SGX GPU provides dedicated OpenGL ES 1.1/2.0 and OpenVG 1.0 acceleration - exclusive to the OMAP3530 variant, not OMAP3525.
Its memory subsystem includes 256 KB L2 cache, 112 KB ROM, 64 KB shared SRAM, and external interfaces for LPDDR SDRAM and NAND/NOR flash via GPMC. System-level power management leverages SmartReflex AVS, dynamic voltage/frequency scaling (DVFS), and fine-grained clock gating across MPU, DSP, and peripheral domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8 + TMS320C64x+ DSP + PowerVR SGX GPU - enables parallel execution of HLOS, media codecs, and 3D graphics without CPU bottlenecks. |
| CPU Clock Speed | Up to 720 MHz - delivers >2000 Dhrystone MIPS for responsive UI and multitasking in embedded Linux/Android systems. |
| DSP Clock Speed | Up to 520 MHz - supports real-time HD video encode/decode (e.g., H.264 BP@720p30) within IVA2.2 subsystem. |
| Graphics Acceleration | PowerVR SGX with 10 MPoly/sec fill rate - enables smooth OpenGL ES 2.0 UI rendering and 3D gaming on 800×480+ displays. |
| Package & Ball Pitch | 515-pin s-PBGA (CBB suffix), 0.5-mm top / 0.4-mm bottom ball pitch - supports Package-on-Package (POP) memory stacking for compact PCB layout. |
| Memory Interfaces | SDRAM Controller (SDRC) for LPDDR, plus General Purpose Memory Controller (GPMC) for NAND/NOR/SRAM - enables flexible, glueless external memory expansion. |
| Video Output | Dual-display support: parallel RGB up to 24-bit HD resolution + analog CVBS/S-Video NTSC/PAL - eliminates need for external video DACs in consumer media devices. |
Pinout & Package
OMAP3530ECBBLPD is housed in a 515-ball, 0.5-mm (top)/0.4-mm (bottom) pitch s-PBGA package with CBB suffix, optimized for POP memory integration and thermal dissipation in handheld form factors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM Data Bus | 32-bit bidirectional data path to LPDDR memory; timing-critical interface requiring controlled impedance routing. |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM Address & Bank Select | 16-bit address + 2-bit bank select for up to 1 GB LPDDR space; multiplexed with GPMC in alternate modes. |
| gpmc_ncs0–gpmc_ncs7 | General-Purpose Memory Chip Select | Eight independent chip-select signals for NAND/NOR/SRAM peripherals; ncs1/ncs2 omitted in CUS package only. |
| dss_data0–dss_data23, dss_hsync, dss_vsync | Display Subsystem Parallel Output | 24-bit RGB + sync signals for direct connection to TFT LCD panels; supports rotation, scaling, and alpha blending in hardware. |
| tv_out1, tv_out2, tv_vref | Composite Video DAC Output | Analog CVBS output pins with internal 10-bit DAC and reference voltage - enables direct NTSC/PAL TV-out without external DAC. |
| hsusb0_data0–hsusb0_data7 | High-Speed USB 2.0 PHY Data | 8-bit ULPI interface for external USB transceiver; supports OTG and host modes at 480 Mbps. |
Key Features
| Feature | Design Value |
|---|---|
| SmartReflex™ Adaptive Voltage Scaling | Real-time dynamic core voltage adjustment (0.985–1.35 V) reduces active power by up to 40% vs. fixed-voltage operation. |
| IVA2.2 Imaging Pipeline | Integrated camera ISP with BT.601/BT.656 interface, resize engine (1/4× to 8×), color space conversion, and 8-bit alpha blending - accelerates still/video capture. |
| Dual-Display Subsystem | Simultaneous RGB LCD + analog TV output with temporal dithering and remote frame buffer interface - enables split-screen UI and secondary display mirroring. |
| Security & TrustZone® | ARM TrustZone-enabled secure boot, encrypted ROM loader, and isolated secure world execution - meets requirements for payment terminals and secure media playback. |
| Peripheral Integration | 5 McBSP ports (2 with sidetone), 4 McSPI, 3 UARTs (1 with IrDA), 3 I2C, 12 timers, and HDQ/1-Wire - minimizes BOM count and board area in portable designs. |
Applications
| Portable Media Player | Automotive Navigation |
|---|---|
Use Scenario: High-resolution video playback, touchscreen UI, and GPS-assisted map rendering in handheld devices with battery life constraints. IC Role / Device Role / Timing Role: Primary applications processor executing Android/Linux, driving 800×480 LCD, decoding H.264 video in IVA2.2, and rendering OpenGL ES 2.0 maps via PowerVR SGX. Use Value: Integrated graphics and video acceleration eliminate discrete GPU/DSP, reducing bill-of-materials cost by ~$1.80 and PCB area by 120 mm². |
Use Scenario: In-dash infotainment system requiring real-time traffic overlay, voice-guided turn-by-turn navigation, and rear-view camera input. IC Role / Device Role / Timing Role: Central SoC managing GPS baseband (via UART), camera ISP for CVBS input, dual-display output (LCD + backup camera), and audio processing via McBSP sidetone. Use Value: Hardware-accelerated video scaling (1/4× to 4×) and NTSC/PAL DAC enable plug-and-play analog camera integration without external scalers or encoders. |
| Digital Video Camera | Smart Home Controller |
Use Scenario: HD camcorder capturing 720p30 video with electronic image stabilization, HDMI output, and Wi-Fi upload. IC Role / Device Role / Timing Role: Real-time video encode pipeline: CMOS sensor → ISP → C64x+ DSP (H.264 BP) → SDIO storage; ARM Cortex-A8 manages UI and network stack. Use Value: Dedicated EDMA controller with 128 channels enables zero-copy data movement between ISP, DSP, and memory - cuts encode latency by 35% vs. software-only approach. |
Use Scenario: Voice-controlled home automation hub aggregating Zigbee/Z-Wave sensors, streaming audio, and rendering web-based UI on connected displays. IC Role / Device Role / Timing Role: Applications processor running Linux with RT-preempt patch, handling concurrent Bluetooth LE audio, I2C sensor polling, and lightweight web server for local UI. Use Value: 188 GPIO pins with programmable muxing allow direct connection to 12+ sensor interfaces and status LEDs - avoids need for I/O expanders in mid-tier smart home gateways. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3525ECBBLPD | Lacks PowerVR SGX GPU; identical ARM/DSP cores, memory subsystem, and package - 100% pin-compatible with OMAP3530ECBBLPD. | Suitable for cost-sensitive applications requiring video decode but no 3D graphics acceleration (e.g., basic PMPs). | Select when OpenGL ES rendering is unnecessary and BOM cost reduction is prioritized over GPU capability. |
| AM3517BZCNA | Successor device with same ARM Cortex-A8 core, but enhanced peripherals (USB 2.0 PHY integrated, no external ULPI required) and updated power management. | Better suited for new designs targeting longer product lifecycle and simplified USB layout; lacks C64x+ DSP and PowerVR SGX. | Choose for new industrial HMI projects where DSP offload is not required and USB integration simplifies design. |
Compared with OMAP3525ECBBLPD, OMAP3530ECBBLPD adds hardware-accelerated 3D graphics essential for rich UIs, while AM3517BZCNA trades DSP/SGX for modernized USB and lower system-level BOM - making OMAP3530ECBBLPD optimal for legacy media-centric designs needing full multimedia acceleration.
Availability
OMAP3530ECBBLPD is available at Aetrix Electronics and suitable for portable navigation devices, digital video cameras, and smart home controllers requiring stable component supply throughout extended production cycles.
Supply support for OMAP3530ECBBLPD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in low-power, high-integration SoCs for portable and industrial applications.
The OMAP3530ECBBLPD belongs to TI's OMAP 3 family - designed specifically for mobile multimedia applications demanding simultaneous high-definition video, 3D graphics, and real-time OS performance in thermally constrained handheld devices.
FAQ
What is the maximum operating frequency of the ARM Cortex-A8 core in OMAP3530ECBBLPD?
The OMAP3530ECBBLPD features an ARM Cortex-A8 microprocessor core rated for up to 720 MHz under commercial temperature conditions. This frequency enables >2000 Dhrystone MIPS performance, sufficient for Android 2.x and Linux-based multimedia applications with responsive UI and multitasking capability. Actual sustained frequency depends on thermal design and SmartReflex AVS configuration.
Does OMAP3530ECBBLPD include an integrated graphics accelerator?
Yes, the OMAP3530ECBBLPD integrates a PowerVR SGX graphics accelerator supporting OpenGL ES 1.1/2.0 and OpenVG 1.0 APIs. This GPU delivers up to 10 million polygons per second and enables hardware-accelerated 3D UI rendering, gaming, and video compositing - a feature absent in the pin-compatible OMAP3525ECBBLPD variant.
What memory interfaces does OMAP3530ECBBLPD support?
The OMAP3530ECBBLPD supports two primary memory interfaces: a dedicated SDRAM Controller (SDRC) for LPDDR SDRAM, and a General Purpose Memory Controller (GPMC) for NAND flash, NOR flash, SRAM, and pseudo-SRAM. It also includes 256 KB of on-chip L2 cache, 112 KB ROM, and 64 KB shared SRAM for low-latency code/data access.
Is OMAP3530ECBBLPD compatible with Android operating system?
Yes, OMAP3530ECBBLPD is officially supported by Android versions up to 2.3 (Gingerbread) through TI's Android DevKit and kernel patches. Its ARM Cortex-A8 core, NEON SIMD extensions, and PowerVR SGX GPU provide the necessary compute and graphics foundation for early Android deployments in portable media players and tablets.
What package type and ball pitch does OMAP3530ECBBLPD use?
OMAP3530ECBBLPD uses a 515-ball s-PBGA package with CBB suffix, featuring 0.5-mm ball pitch on the top side and 0.4-mm ball pitch on the bottom side. This asymmetric pitch enables Package-on-Package (POP) memory stacking and meets IPC-7351B footprint standards for reliable reflow soldering in high-volume manufacturing.
OMAP3530ECBBLPD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-VFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Signal Processing; C64x+, Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3530ECBBLPD FAQ
1.How can I place an order for OMAP3530ECBBLPD through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3530ECBBLPD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3530ECBBLPD reliable?
The price and inventory of OMAP3530ECBBLPD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3530ECBBLPD is usually 5 days.
3.What payment methods are accepted for OMAP3530ECBBLPD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3530ECBBLPD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3530ECBBLPD?
OMAP3530ECBBLPD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3530ECBBLPD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3530ECBBLPD?
For technical support, including OMAP3530ECBBLPD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3530ECBBLPD requirements.
6.How does Aetrix verify that OMAP3530ECBBLPD is sourced from the original manufacturer or authorized distributors?
All OMAP3530ECBBLPD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3530ECBBLPD meets industry standards.
7.What is the process for return or replacement of OMAP3530ECBBLPD?
All OMAP3530ECBBLPD units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3530ECBBLPD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3530ECBBLPD part is unused and in its original packaging.
Return procedure for OMAP3530ECBBLPD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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