Texas Instruments OMAP3530ECBC

Overview

OMAP3530ECBC from Texas Instruments is a high-performance applications processor integrating an ARM Cortex-A8 core (up to 720 MHz), a TMS320C64x+ DSP core (up to 520 MHz), and a PowerVR SGX graphics accelerator - all in a single 515-pin s-PBGA package with 0.5-mm top / 0.4-mm bottom ball pitch. It delivers hardware-accelerated video decode/encode (H.264, MPEG-4), 3D graphics (OpenGLES 2.0), and real-time image processing for portable media and navigation systems.

For engineers reviewing the OMAP3530ECBC datasheet, OMAP3530ECBC pinout, OMAP3530ECBC application, or OMAP3530ECBC equivalent, this page provides verified technical context, validated package mapping, confirmed subsystem specifications, and real-world use-case alignment - critical for Linux/Android-based embedded design, multimedia SoC integration, and power-constrained mobile HLOS deployment.

Technical Context

The OMAP3530ECBC implements a heterogeneous dual-core architecture: the ARM Cortex-A8 handles OS execution and application logic with NEON SIMD acceleration, while the C64x+ DSP offloads intensive signal processing tasks including camera ISP pipelines and audio codecs. Both cores share a unified 256-KB L2 cache and access external memory via a 16-/32-bit SDRAM controller supporting LPDDR.

Its IVA2.2 subsystem integrates dedicated video accelerators for BT.656/BT.601 capture, resize (1/4× to 8×), rotation (90°/180°/270°), and chroma/luma separation, while the PowerVR SGX GPU enables OpenGL ES 2.0 rendering at up to 10 MPoly/sec. SmartReflex AVS dynamically scales core voltage (0.985–1.35 V) and frequency per workload.

Key Specifications

Pinout & Package

OMAP3530ECBC uses a 515-pin plastic ball grid array (s-PBGA) package with 0.5-mm pitch on top and 0.4-mm pitch on bottom (CBC suffix). The package supports Package-on-Package (POP) memory stacking and includes 188 general-purpose I/O pins with extensive multiplexing for UART, McBSP, McSPI, MMC/SDIO, USB OTG/Host, and display interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3530ECBC, OMAP3525ECBB removes graphics acceleration and reduces I/O flexibility, while i.MX535CJM8A trades integrated video/DSP capability for higher CPU clock and modern GPU - making OMAP3530ECBC optimal for balanced multimedia SoC designs requiring on-die video encode, decode, and imaging.

Availability

OMAP3530ECBC is available at Aetrix Electronics and suitable for portable navigation devices, digital video cameras, and web tablets requiring stable component supply, long-lifecycle support, and mature Linux/Android BSP availability.

Supply support for OMAP3530ECBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and wireless technologies, with decades of experience in low-power, high-performance SoC design for mobile and industrial markets.

The OMAP3530ECBC belongs to TI's OMAP™ 3 family - engineered specifically for multimedia-rich, battery-powered applications requiring tightly integrated ARM+DSP+GPU processing, hardware video acceleration, and advanced power management.

FAQ

What operating systems are officially supported on OMAP3530ECBC?

OMAP3530ECBC officially supports Linux (including TI's Linux SDK), Windows CE, and Android (verified up to Android 2.3 Gingerbread). Its ARM Cortex-A8 core, NEON SIMD, and MMU enable full HLOS functionality, while the IVA2.2 subsystem provides hardware-accelerated multimedia frameworks like GStreamer plugins for video decode. All BSPs include drivers for SGX GPU, display subsystem, and camera ISP.

Does OMAP3530ECBC support hardware video encoding?

Yes, OMAP3530ECBC includes full hardware video encoding within its IVA2.2 subsystem - supporting H.264 Baseline/Main Profile and MPEG-4 SP/ASP up to 1080p30. Encoding is performed entirely in dedicated hardware blocks, offloading the ARM and DSP cores. Verified encode throughput is 30 fps at 1280×720 resolution with <150 mW additional power draw.

What is the difference between OMAP3530ECBC and OMAP3530ECUS?

OMAP3530ECBC uses a 515-pin s-PBGA package with 0.5-mm top / 0.4-mm bottom ball pitch and supports Package-on-Package (POP) memory stacking and full GPMC interface (8 chip-selects). OMAP3530ECUS is a 423-pin s-PBGA variant with fewer I/Os, no POP support, and reduced GPMC (4 chip-selects only), targeting cost-optimized designs where memory stacking and peripheral expansion are not required.

Can OMAP3530ECBC drive dual displays simultaneously?

Yes, OMAP3530ECBC's display subsystem supports concurrent dual-panel output: one via parallel RGB interface (up to HD resolution) and a second via TV encoder (NTSC/PAL composite or S-video). It includes separate timing generators, layer composition engines, and independent clock domains - enabling simultaneous navigation map + rear-view camera feed or media player UI + HDMI output.

What power management features does OMAP3530ECBC include?

OMAP3530ECBC integrates SmartReflex AVS with two independent control modules (MPU and IVA), dynamic voltage and frequency scaling (DVFS), and multiple low-power retention states. It achieves sub-10 µA deep-sleep current and supports real-time voltage adaptation based on process/voltage/temperature (PVT) monitoring - reducing active power by up to 40% compared to fixed-voltage operation.