Texas Instruments OMAP3530ECBCA

Overview

OMAP3530ECBCA from Texas Instruments is a dual-core applications processor integrating an up to 720-MHz ARM Cortex-A8 CPU and an up to 520-MHz TMS320C64x+ DSP, with PowerVR SGX graphics acceleration, 256KB L2 cache, and 64KB on-chip SRAM - deployed in portable media players and digital video cameras for real-time video decode, display, and image processing.

For engineers reviewing the OMAP3530ECBCA datasheet, OMAP3530ECBCA pinout, OMAP3530ECBCA application, or OMAP3530ECBCA equivalent, this page delivers verified functional partitioning, package-specific I/O mapping (515-pin s-PBGA, CBC suffix), SmartReflex power management implementation, and validated alternative options for multimedia SoC migration paths.

Technical Context

The OMAP3530ECBCA implements a heterogeneous multi-processor architecture: the ARM Cortex-A8 core executes Linux/Android OS tasks and application logic, while the C64x+ DSP offloads intensive IVA2.2 subsystem workloads including video encode/decode, audio processing, and ISP pipeline operations. The PowerVR SGX graphics engine operates independently at up to 10 MPoly/sec for OpenGL ES 1.1/2.0 rendering.

Memory subsystems are segregated and coherently managed: 256KB unified L2 cache serves both cores; 64KB shared SRAM enables low-latency inter-processor communication; and the SDRC controller supports LPDDR SDRAM with SMS-based rotation and scheduling. All domains use adaptive voltage scaling via SmartReflex AVS modules.

Key Specifications

Pinout & Package

OMAP3530ECBCA is housed in a 515-ball s-PBGA package with CBC suffix, featuring 0.5-mm pitch on top and 0.4-mm pitch on bottom, optimized for Package-on-Package (POP) memory integration and thermal dissipation in handheld form factors.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multimedia applications processor applications.

Compared with OMAP3525ECBB, OMAP3530ECBCA adds essential 3D graphics capability for modern UIs; compared with AM3715BZC, it offers proven stability and lower qualification risk in legacy industrial deployments where 720p video and Linux 2.6.x are sufficient.

Availability

OMAP3530ECBCA is available at Aetrix Electronics and suitable for portable navigation devices, digital video cameras, and web tablets requiring stable component supply across extended product lifecycles.

Supply support for OMAP3530ECBCA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in high-reliability silicon design.

The OMAP™ family was engineered for mobile multimedia convergence - delivering tightly integrated ARM+DSP+GPU architectures optimized for power-constrained, high-performance consumer and industrial applications.

FAQ

What operating systems does the OMAP3530ECBCA officially support?

The OMAP3530ECBCA officially supports Linux, Windows CE, and Android - with TI-provided BSPs and kernel patches validated for each. Android support was added in the October 2013 revision of the SPRS507H datasheet, confirming compatibility with early Android versions up to 2.3. Its TrustZone security extensions also enable secure boot and trusted execution environments for DRM and payment applications.

Does the OMAP3530ECBCA include hardware video encoding capabilities?

Yes, the OMAP3530ECBCA includes dedicated hardware acceleration for video encoding through its IVA2.2 subsystem - specifically supporting H.264 Baseline and Main Profiles, MPEG-4 SP/ASP, and JPEG encode at up to 1080p30 resolution. This acceleration runs entirely on the C64x+ DSP, freeing the ARM Cortex-A8 core for application tasks and OS services.

What is the function of the POP interface on the OMAP3530ECBCA package?

The POP (Package-on-Package) interface on the OMAP3530ECBCA's CBC-package variant enables vertical stacking of LPDDR memory directly atop the processor die - using dedicated POP balls (e.g., pop_a1_a1, pop_k2_m2) to route memory signals with minimal trace length. This reduces PCB layer count, improves signal integrity for high-speed memory buses, and saves board space in compact handheld designs.

How does SmartReflex technology operate in the OMAP3530ECBCA?

SmartReflex in the OMAP3530ECBCA uses on-die process/voltage/temperature sensors to dynamically adjust core voltage (0.985–1.35 V) and frequency per operating performance point (OPP). Two independent SmartReflex modules manage MPU and IVA subsystems, enabling real-time power optimization without software intervention - reducing active power consumption by up to 40% versus static voltage operation.

Can the OMAP3530ECBCA interface directly with HDMI transmitters?

No, the OMAP3530ECBCA does not include native HDMI transmitter circuitry. It outputs video via parallel RGB, BT.656, or S-Video interfaces; HDMI output requires an external HDMI encoder IC (e.g., TI TFP410 or THS8200) connected to the DSS parallel output or TV DAC outputs. The device's TV DAC supports composite NTSC/PAL, but HDMI compliance mandates external conversion and TMDS signaling.