Texas Instruments OMAP3530ECUS72

Overview

OMAP3530ECUS72 from Texas Instruments is a 720-MHz ARM Cortex-A8 + 520-MHz C64x+ DSP applications processor with PowerVR SGX graphics accelerator, 256-KB L2 cache, and integrated camera ISP and display subsystem. It delivers hardware-accelerated video decode/encode (H.264, MPEG-4), 3D graphics (OpenGLES 2.0), and real-time image processing for portable media and navigation devices.

For engineers reviewing the OMAP3530ECUS72 datasheet, OMAP3530ECUS72 pinout, OMAP3530ECUS72 application, or OMAP3530ECUS72 equivalent, this page provides verified package mapping (423-pin s-PBGA, CUS suffix), confirmed IVA2.2 subsystem integration, validated SmartReflex power management, and precise GPIO count (188 pins) - all critical for PCB layout, thermal design, and OS bring-up on Linux or Android.

Technical Context

The OMAP3530ECUS72 implements a dual-core heterogeneous architecture: the ARM Cortex-A8 MPU subsystem handles high-level OS tasks and application logic, while the dedicated C64x+ DSP core offloads intensive signal processing for imaging, audio, and video pipelines. Both cores share a unified 256-KB L2 cache and access external memory via a 16-/32-bit SDRAM controller with SMS rotation engine.

Its IVA2.2 subsystem integrates hardware accelerators for H.264 BP/MP decoding at 720p30, JPEG encode/decode, and motion estimation, while the PowerVR SGX GPU supports up to 10 MPoly/sec and programmable shaders compliant with OpenGLES 2.0 and OpenVG 1.0 - all operating under adaptive voltage scaling via SmartReflex AVS.

Key Specifications

Pinout & Package

OMAP3530ECUS72 uses a 423-ball s-PBGA package (CUS suffix) with 0.65-mm ball pitch, no top-side balls, and no Package-on-Package (POP) support. Pin assignments follow TI's Quadrant A–D layout per SPRS507H Section 2.2.1; key functional groups include SDRC (sdrc_d0–sdrc_d31, sdrc_clk), GPMC (gpmc_ncs0–ncs7, gpmc_d0–d15), DSS (dss_pclk, dss_hsync, dss_vsync), and MMC/SDIO (mmc1_cmd, mmc1_clk, mmc1_dat0–7).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3525ECBB72 and OMAP3530ECBC72, the OMAP3530ECUS72 trades POP memory stacking, HSUSB3_TLL, and full GPMC for a smaller 423-pin footprint and lower BOM cost - making it optimal for cost-sensitive, space-constrained portable media and navigation products where discrete memory and standard USB 2.0 suffice.

Availability

OMAP3530ECUS72 is available at Aetrix Electronics and suitable for portable navigation devices, portable media players, and digital video cameras requiring stable component supply, long-term lifecycle support, and qualified industrial-grade silicon.

Supply support for OMAP3530ECUS72 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in low-power, high-performance SoCs for mobile and industrial markets.

The OMAP3530ECUS72 belongs to TI's OMAP 3 family, designed specifically for portable multimedia and navigation applications demanding integrated graphics, video acceleration, and adaptive power management in compact form factors.

FAQ

What is the maximum operating frequency of the ARM Cortex-A8 core in OMAP3530ECUS72?

The OMAP3530ECUS72 features an ARM Cortex-A8 microprocessor core rated for up to 720 MHz. This frequency is achieved under commercial temperature conditions with appropriate voltage scaling (0.985–1.35 V) and cooling. The actual sustained frequency depends on thermal design and SmartReflex AVS configuration, but 720 MHz is the guaranteed maximum performance point specified in SPRS507H.

Does OMAP3530ECUS72 include a PowerVR SGX graphics accelerator?

Yes, the OMAP3530ECUS72 includes the PowerVR SGX graphics accelerator as part of its IVA2.2 subsystem. This GPU supports tile-based rendering, programmable shaders, and industry-standard APIs including OpenGLES 1.1/2.0 and OpenVG 1.0 - distinguishing it from the OMAP3525, which lacks SGX.

How many general-purpose I/O pins does OMAP3530ECUS72 support?

The OMAP3530ECUS72 supports up to 188 general-purpose I/O (GPIO) pins, as confirmed in Table 1-1 of SPRS507H. These pins are multiplexed with other functions (UART, McBSP, McSPI, etc.), and the actual number available simultaneously depends on pinmux configuration - detailed in Section 2.4 of the datasheet.

What memory interfaces are supported by OMAP3530ECUS72?

The OMAP3530ECUS72 supports SDRAM via its SDRC controller (16-/32-bit LPDDR/SDRAM), NAND/NOR flash and SRAM via GPMC (8 chip-selects), and MMC/SDIO (3 slots, up to 8-bit). It does not support POP memory stacking - a feature exclusive to CBB/CBC packages - and lacks HSUSB3_TLL found in CBC variants.

Is OMAP3530ECUS72 compatible with Android operating system?

Yes, OMAP3530ECUS72 is officially supported by Android versions up to 2.3 (Gingerbread), as documented in SPRS507H Revision History. TI provided Android BSPs, kernel drivers, and HAL layers for display, camera, audio, and power management - enabling full touchscreen, Wi-Fi, and camera functionality in production PMP and tablet designs.