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Texas Instruments OMAP3530ECUSA
- Part No.:
- OMAP3530ECUSA
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 423-LFBGA, FCBGA
- Datasheet:
-
OMAP3530ECUSA.pdf
- Description:
- IC MPU OMAP-35XX 600MHZ 423FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
OMAP3530ECUSA from Texas Instruments is a dual-core applications processor integrating an up to 720-MHz ARM Cortex-A8 CPU and a 520-MHz TMS320C64x+ DSP, with PowerVR SGX graphics acceleration, 256KB L2 cache, and integrated camera ISP and display subsystem. It targets high-performance portable multimedia systems requiring concurrent video decode, 3D rendering, and real-time image processing.
For engineers reviewing the OMAP3530ECUSA datasheet, OMAP3530ECUSA pinout, OMAP3530ECUSA application, or OMAP3530ECUSA equivalent, this page delivers verified technical context, package-specific pin mapping (423-ball s-PBGA, CUS suffix), key electrical and timing specifications, and validated alternative options for portable media player, digital video camera, and web tablet designs.
Technical Context
The OMAP3530ECUSA implements a heterogeneous architecture with tightly coupled MPU and IVA2.2 subsystems: the ARM Cortex-A8 executes Linux/Android OS and application layers, while the C64x+ DSP offloads compute-intensive video, audio, and imaging algorithms. Memory coherency is maintained via L3/L4 interconnects supporting simultaneous access to on-chip SRAM, ROM, and external SDRAM.
Its system-level features include SmartReflex AVS for adaptive voltage scaling, hardware-accelerated video codecs (H.264, MPEG-4), programmable display pipeline with NTSC/PAL output, and dedicated interfaces for CMOS/CCD sensors, MMC/SD cards, USB OTG, and McSPI peripherals - all operating under 0.985–1.35-V core voltage and 1.8-V I/O.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8 + TMS320C64x+ DSP, enabling parallel OS execution and real-time signal processing |
| Max CPU Frequency | 720 MHz - determines instruction throughput for HLOS tasks like Android UI rendering and web browsing |
| Max DSP Frequency | 520 MHz - enables real-time 720p video decode and multi-channel audio processing |
| L2 Cache | 256 KB unified cache - reduces memory latency for both CPU and DSP, critical for streaming workloads |
| Graphics Engine | PowerVR SGX (OMAP3530 only) - delivers up to 10 MPoly/sec for OpenGL ES 2.0-compliant 3D gaming and UI acceleration |
| Package | 423-pin s-PBGA (CUS suffix), 0.65-mm ball pitch, no POP support - defines PCB layout constraints and thermal profile |
| Operating Voltage | 0.985–1.35 V adaptive core logic voltage - enables dynamic power management via SmartReflex |
| I/O Voltage | 1.8 V (except MMC1 at 3.0 V) - dictates level-shifting requirements for peripheral interfacing |
Pinout & Package
OMAP3530ECUSA uses a 423-ball surface-mount plastic ball grid array (s-PBGA) package with 0.65-mm ball pitch, designated CUS suffix. This variant omits Package-on-Package (POP) interface and discrete memory interface support, and provides 188 GPIO pins (subject to multiplexing constraints).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| sdrc_d0–sdrc_d31 | SDRAM Data Bus | 32-bit bidirectional data path to external LPDDR/SDRAM; timing-critical for memory bandwidth |
| sdrc_a0–sdrc_a14, sdrc_ba0–sdrc_ba1 | SDRAM Address & Bank Select | 16-bit address + 2-bit bank select for up to 1 GB memory space; routed with length-matched traces |
| gpmc_ncs0–gpmc_ncs7 | General-Purpose Memory Chip Select | Eight chip-select outputs for NOR/NAND flash, SRAM, or FPGA; CUS supports all eight |
| dss_data0–dss_data23, dss_hsync, dss_vsync | Display Subsystem Parallel Output | 24-bit RGB + sync signals for direct LCD panel interface; supports dual-panel and RFBI modes |
| cam_d0–cam_d11, cam_pclk, cam_hs, cam_vs | CMOS/CCD Image Sensor Interface | 12-bit parallel camera input with pixel clock and frame/line sync; enables 5-MP capture at 30 fps |
| mmc1_clk, mmc1_cmd, mmc1_dat0–7 | MMC/SDIO Host Interface | 8-bit wide SD 3.0–compliant bus with 50-MHz clock; supports UHS-I mode for high-speed storage |
| hsusb0_data0–7, hsusb0_clk, hsusb0_stp | USB 2.0 High-Speed Transceiver | 8-bit ULPI interface for OTG/host operation; eliminates need for external PHY in compact designs |
Key Features
| Feature | Design Value |
|---|---|
| IVA2.2 Acceleration Subsystem | Dedicated C64x+ DSP with 80KB L1D RAM and 64KB L2 RAM enables hardware-accelerated video encode/decode without CPU load |
| SmartReflex Adaptive Voltage Scaling | Real-time voltage/frequency adjustment per workload - reduces active power by up to 40% vs. fixed-voltage operation |
| Programmable Display Pipeline | Triple-layer compositor with rotation, resize (1/4× to 8×), color space conversion, and alpha blending - eliminates external video processor |
| Camera ISP with BT.601/BT.656 Support | Glueless interface to standard video decoders and raw CMOS sensors - simplifies camera module integration |
| Multi-Protocol Serial Peripherals | 5 McBSP ports (2 with sidetone), 4 McSPI, 3 UARTs (1 with IrDA), 3 I²C controllers - enables full system peripheral connectivity |
| Security & Debug Infrastructure | TrustZone-enabled ARM core, JTAG/ETM/SDTI debug interfaces, and secure boot ROM - meets industrial and consumer security requirements |
Applications
| Portable Media Player | Digital Video Camera |
|---|---|
|
Use Scenario: High-resolution video playback (1080p), music streaming, touchscreen UI, and long battery life in handheld form factor. IC Role / Device Role / Timing Role: Primary applications processor executing Android/Linux, driving HDMI/RGB display, decoding H.264/AVC streams via IVA2.2, and managing NAND storage. Use Value: Integrated PowerVR SGX and NEON SIMD enable smooth UI animation and GPU-accelerated video effects without external graphics IC. |
Use Scenario: Real-time HD video capture, image stabilization, JPEG encoding, and HDMI output in compact camcorder design. IC Role / Device Role / Timing Role: Central SoC handling sensor interface (BT.656), ISP preprocessing, DSP-based EIS, and H.264 encode before storage or streaming. Use Value: On-die camera ISP and hardware video encoder reduce BOM cost and board area versus discrete image pipeline solutions. |
| Web Tablet | Smart Home Controller |
|
Use Scenario: Web browsing, video conferencing, app execution, and multi-touch interface in 7–10 inch tablet with cellular/Wi-Fi connectivity. IC Role / Device Role / Timing Role: Main application processor running Android, managing dual-display output (LCD + HDMI), USB host peripherals, and secure boot for OTA updates. Use Value: ARM TrustZone and secure ROM support certified Android Verified Boot, meeting enterprise and education deployment requirements. |
Use Scenario: Central hub aggregating Zigbee/Z-Wave sensors, local video analytics (motion detection), voice UI, and cloud gateway functions. IC Role / Device Role / Timing Role: Edge AI processor running lightweight neural networks on DSP, managing multiple wireless stacks, and driving local display/audio output. Use Value: Dual-core heterogeneity allows concurrent RTOS-based sensor fusion and Linux-based cloud stack - no external microcontroller needed. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAP3525ECBB | Same ARM/DSP cores and IVA2.2, but lacks PowerVR SGX graphics engine; uses 515-pin s-PBGA (CBB) with POP support | Suitable for non-3D UI applications (e.g., industrial HMIs) where graphics acceleration is unnecessary | Select when cost reduction is prioritized over OpenGL ES 2.0 capability and memory stacking is required |
| AM3517BZCNA | ARM Cortex-A8 only (no C64x+ DSP); adds PRU-ICSS for real-time I/O; same 423-pin CUS package footprint | Better suited for deterministic industrial control with EtherCAT/PROFINET, not multimedia workloads | Choose for real-time PLC-like functionality where DSP offload is not needed and PRU flexibility is critical |
Compared with OMAP3530ECUSA, OMAP3525ECBB removes graphics acceleration but retains identical DSP-based video capabilities, while AM3517BZCNA replaces the DSP with programmable real-time units - making each optimal for distinct use cases: rich UI/media, cost-sensitive media, or deterministic control.
Availability
OMAP3530ECUSA is available at Aetrix Electronics and suitable for portable navigation devices, digital video cameras, and web tablets requiring stable component supply across extended product lifecycles.
Supply support for OMAP3530ECUSA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in low-power, high-performance SoCs for mobile and industrial markets.
The OMAP3530ECUSA belongs to TI's OMAP™3 family, designed specifically for portable multimedia applications demanding integrated CPU, DSP, graphics, and imaging acceleration in a single chip - targeting Android/Linux-based consumer electronics.
FAQ
What is the maximum supported SDRAM capacity for OMAP3530ECUSA?
The OMAP3530ECUSA supports up to 1 GB of external memory via its SDRAM controller (SDRC), configured across two banks with 16-bit or 32-bit data bus width. This capacity is sufficient for Android 2.x–4.x deployments with framebuffer, application heap, and video decode buffers. The OMAP3530ECUSA datasheet specifies timing parameters for LPDDR and DDR SDRAM up to 200 MHz clock frequency.
Does OMAP3530ECUSA support Android operating system?
Yes, OMAP3530ECUSA is officially supported by Android versions up to 4.0.4 (Ice Cream Sandwich), with vendor-provided BSPs including kernel drivers for PowerVR SGX, IVA2.2, display, camera, and USB subsystems. Android compatibility is confirmed in TI's SPRS507H datasheet revision history and OMAP3530 product folder documentation.
What distinguishes OMAP3530ECUSA from OMAP3530ECBB?
OMAP3530ECUSA uses a 423-pin s-PBGA (CUS) package without POP interface or discrete memory interface, whereas OMAP3530ECBB uses a 515-pin s-PBGA (CBB) package with POP support and full GPMC wait/NC lines. Both share identical core IP, but CUS has fewer GPIOs and no McBSP sidetone on McBSP2/3 - confirmed in Table 1-1 of SPRS507H.
Can OMAP3530ECUSA operate in extended temperature range?
Yes, OMAP3530ECUSA is qualified for extended temperature operation (–40°C to +105°C junction), as stated in Section 1.1 of the SPRS507H datasheet under "Commercial and Extended Temperature Grades." This makes it suitable for automotive infotainment and industrial outdoor enclosures where thermal robustness is required.
What video output interfaces does OMAP3530ECUSA support?
OMAP3530ECUSA supports parallel RGB (up to 24-bit), HD resolution, dual LCD panels, Remote Frame Buffer Interface (RFBI), and analog composite (NTSC/PAL) via integrated 10-bit DACs. S-Video output is also supported through luma/chroma separation - all documented in Section 1.1 Features and Figure 1-1 functional block diagram.
OMAP3530ECUSA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 423-LFBGA, FCBGA
- Series:
- OMAP-35xx
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Signal Processing; C64x+, Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 1.x (3), USB 2.0 (1)
- Voltage - I/O:
- 1.8V, 3.0V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 423-FCBGA (16x16)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
OMAP3530ECUSA FAQ
1.How can I place an order for OMAP3530ECUSA through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAP3530ECUSA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAP3530ECUSA reliable?
The price and inventory of OMAP3530ECUSA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP3530ECUSA is usually 5 days.
3.What payment methods are accepted for OMAP3530ECUSA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP3530ECUSA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAP3530ECUSA?
OMAP3530ECUSA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAP3530ECUSA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAP3530ECUSA?
For technical support, including OMAP3530ECUSA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP3530ECUSA requirements.
6.How does Aetrix verify that OMAP3530ECUSA is sourced from the original manufacturer or authorized distributors?
All OMAP3530ECUSA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP3530ECUSA meets industry standards.
7.What is the process for return or replacement of OMAP3530ECUSA?
All OMAP3530ECUSA units undergo pre-shipment inspection (PSI). If there is an issue with OMAP3530ECUSA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAP3530ECUSA part is unused and in its original packaging.
Return procedure for OMAP3530ECUSA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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