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Texas Instruments OMAP5910GGZG1

Part No.:
OMAP5910GGZG1
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
-
Datasheet:
AetrixOMAP5910GGZG1.pdf
Description:
OMAP5910 DSP MULTIPURPOSE
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Product details

Overview

OMAP5910GGZG1 from Texas Instruments is a dual-core system-on-chip integrating a 16-bit TMS320C55x DSP core and a TI-enhanced ARM925T RISC processor, operating at up to 200 MHz (MPU) and 100 MHz (DSP), with integrated SDRAM controller, LCD controller, USB host/function, and McBSP peripherals. It targets handheld multimedia terminals requiring real-time video decode, voice processing, and display control.

For engineers reviewing the OMAP5910GGZG1 datasheet, OMAP5910GGZG1 pinout, OMAP5910GGZG1 application, or OMAP5910GGZG1 equivalent, key selection considerations include dual-core interprocessor communication via mailbox registers and shared memory, 16-bit SDRAM interface timing compliance, LCD panel timing support for STN/TFT, and USB 1.1 transceiver integration with dedicated DP/DM pins.

Technical Context

The OMAP5910GGZG1 implements tightly coupled MPU and DSP subsystems sharing memory interfaces and peripherals via MPUI and Traffic Controller. Its clock architecture includes independent PLLs for MPU (up to 200 MHz) and DSP (up to 100 MHz), with base oscillator options of 12 MHz or 13 MHz and a separate 32-kHz RTC crystal input.

System-level features include hardware accelerators for DCT/iDCT, motion estimation, and pixel interpolation-dedicated to JPEG/MPEG-4 video processing-and a configurable 16-bit external memory interface supporting SDRAM, Flash, and SRAM with programmable wait states and burst modes.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Dual-core: ARM925T RISC (MPU) + TMS320C55x DSP, non-symmetric multiprocessing with shared peripherals
Max Clock Frequency MPU: 200 MHz; DSP: 100 MHz - defines real-time throughput for concurrent OS execution and signal processing
On-Chip Memory 192 KB SRAM (IMIF), split between MPU/DSP access; no embedded flash - requires external boot ROM or NAND
SDRAM Interface 16-bit EMIFF supporting standard SDRAM with programmable CAS latency, burst length, and refresh timing
LCD Controller Supports monochrome STN and color STN/TFT panels with programmable pixel clock, HS/VS polarity, and 16-bit parallel data bus
USB Interface Integrated USB 1.1 transceiver with host controller and function peripheral; DP/DM pins routed to GZG package pins P9 and P10
Power Supply Core voltage: 1.6 V ±0.1 V (CVDD); I/O voltage: 1.8 V or 3.3 V (VDD_IO) - requires separate LDO regulation per rail

Pinout & Package

OMAP5910GGZG1 is packaged in a 423-pin MicroStar BGA (GZG) with 0.8-mm pitch, 27 × 27 mm body size, and thermal pad. Pin assignments follow Table 2–1 of SPRS197D, revision D.

Pin Circuit Role Design Meaning
P9 USB.DP Differential positive data line for integrated USB 1.1 transceiver - requires 45-Ω impedance-controlled routing
P10 USB.DM Differential negative data line for integrated USB 1.1 transceiver - paired with P9 for full-speed signaling
V12 VSS (Oscillator Ground) Dedicated ground for 32-kHz oscillator circuit - must be isolated from digital VSS per Section 5.6.1
A11, A13, H9, G9 VSS Additional ground terminals for power integrity - listed explicitly in Table 2–4 revision D for noise reduction
T6 → P14 USB1.TXEN USB1 transceiver enable signal relocated to P14 in revision D - controls physical layer activation

Key Features

Feature Design Value
Dual-core interprocessor communication Mailbox registers + 64 KB shared memory block enable deterministic low-latency message passing between ARM925T and C55x
Hardware video acceleration DCT/iDCT, motion estimation, and pixel interpolation accelerators offload JPEG/MPEG-4 encode/decode from CPU/DSP cores
Configurable LCD timing Programmable polarity, pulse width, and clock phase for HS/VS sync signals - supports both TFT and STN panel types
Flexible memory interface EMIFS (Flash/SRAM) and EMIFF (SDRAM) controllers with independent wait-state, burst, and width configuration per chip select
Integrated USB 1.1 PHY On-die transceiver eliminates need for external USB PHY - reduces BOM cost and board area for handheld designs

Applications

Handheld Multimedia Terminal Portable Medical Imaging Device

Use Scenario: Battery-powered PDA running Linux OS with real-time video playback and touchscreen UI.

IC Role / Device Role / Timing Role: OMAP5910GGZG1 serves as main application processor, coordinating ARM-based UI rendering and C55x-accelerated video decode with synchronized LCD frame output.

Use Value: Dual-core architecture enables concurrent OS task scheduling and hard real-time video processing without external co-processors.

Use Scenario: Portable ultrasound unit capturing and displaying grayscale image sequences in clinical settings.

IC Role / Device Role / Timing Role: DSP core executes motion-compensated frame averaging and pixel interpolation; MPU manages DICOM export and touch interface.

Use Value: Integrated accelerators reduce frame latency by >40% versus software-only implementation on comparable single-core SoCs.

Industrial HMI Panel Legacy Mobile Phone Baseband Platform

Use Scenario: Factory-floor operator interface with resistive touchscreen, serial diagnostics, and local data logging.

IC Role / Device Role / Timing Role: MPU runs RTOS for UI responsiveness; DSP handles audio feedback generation and sensor preprocessing via McBSP and GPIO.

Use Value: Single-chip integration of UART, I²C, PWM, and camera interface eliminates discrete logic and reduces PCB layer count.

Use Scenario: 2.5G feature phone platform supporting GSM voice, SMS, and basic Java ME applications.

IC Role / Device Role / Timing Role: ARM925T executes protocol stack and UI; C55x handles adaptive multi-rate (AMR) speech coding/decoding in real time.

Use Value: Hardware autobauding (1200–115.2 kbps) on UART1/UART2 simplifies modem interface design and field firmware updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core multimedia processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
OMAP5912GGZG1 Same die, but supports 3.3-V I/O only (no 1.8-V mode); lacks 1.8-V SDRAM interface capability Not suitable for systems using 1.8-V SDRAM or mixed-voltage I/O domains Select OMAP5910GGZG1 when 1.8-V SDRAM or flexible I/O voltage (1.8 V/3.3 V) is required.
OMAP5910GDY Identical functionality, but in 423-pin GDY BGA package with different pinout (e.g., USB.DP on P5 vs. P9) Requires PCB redesign due to non-identical terminal assignment and power/ground distribution Choose OMAP5910GGZG1 for designs targeting the GZG mechanical footprint and signal routing defined in SPRS197D Table 2–1.

Compared with OMAP5912GGZG1 and OMAP5910GDY, the OMAP5910GGZG1 uniquely supports 1.8-V I/O operation and matches the GZG package pinout used in reference designs for handheld video terminals, enabling direct compatibility with existing layout footprints and power delivery networks.

Availability

OMAP5910GGZG1 is available at Aetrix Electronics and suitable for handheld multimedia terminals, portable medical imaging devices, and industrial HMI panels requiring stable component supply across extended product lifecycles.

Supply support for OMAP5910GGZG1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 50 years of innovation in microcontrollers and DSPs.

The OMAP5910 product line was designed for portable multimedia applications demanding integrated processing, video acceleration, and low-power connectivity - bridging the gap between general-purpose processors and application-specific SoCs.

FAQ

What is the maximum supported SDRAM density for OMAP5910GGZG1?

The OMAP5910GGZG1 EMIFF interface supports up to 128 MB of 16-bit SDRAM, configured via programmable row/column address bits and bank selection. This limit arises from the 25-bit address bus width and internal memory controller architecture documented in Section 3.11 of SPRS197D. The OMAP5910GGZG1 does not support DDR or LPDDR memory types.

Does OMAP5910GGZG1 support USB device mode with host negotiation (OTG)?

No, the OMAP5910GGZG1 implements separate USB host controller and USB function peripheral blocks but lacks USB On-The-Go (OTG) support. It cannot dynamically switch roles or manage ID pin detection. The USB.DP and USB.DM pins are fixed for either host or function operation based on software configuration, as specified in Section 3.6.2 and 3.6.3 of SPRS197D.

Can the OMAP5910GGZG1's DSP core execute code from external SDRAM?

Yes, the OMAP5910GGZG1 DSP core can execute code from external SDRAM when the MMU is enabled and appropriate memory mapping is configured via the DSP MMU registers. Section 3.4 of SPRS197D confirms managed external memory access, though performance-critical code is typically loaded into on-chip DARAM or SARAM for deterministic timing.

What is the purpose of the FUNC_MUX_CTRL_B register in OMAP5910GGZG1?

FUNC_MUX_CTRL_B register (address FFFE:C008) configures multiplexed pin functions for peripherals including the internal oscillator control. As revised in SPRS197D page 126, it determines whether OSC1_OUT is enabled or left unconnected when the internal oscillator is disabled - a critical setting for external clock source integration.

How does the OMAP5910GGZG1 handle power sequencing between CVDD and VDD_IO rails?

The OMAP5910GGZG1 requires CVDD (core) to be ramped before VDD_IO (I/O) during power-up, and CVDD must remain active until VDD_IO is fully discharged during power-down. This sequencing is enforced by internal power-on-reset circuitry and documented in Section 5.14 of SPRS197D to prevent latch-up or undefined I/O states.

OMAP5910GGZG1 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
-
Series:
*
Packaging:
Bulk
Product Status:
Active
Core Processor:
-
Number of Cores/Bus Width:
-
Speed:
-
Co-Processors/DSP:
-
RAM Controllers:
-
Graphics Acceleration:
-
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
-
Supplier Device Package:
-
Additional Interfaces:
-

OMAP5910GGZG1 FAQ

1.How can I place an order for OMAP5910GGZG1 through Aetrix?

Please submit a Request for Quotation (RFQ) for OMAP5910GGZG1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OMAP5910GGZG1 reliable?

The price and inventory of OMAP5910GGZG1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP5910GGZG1 is usually 5 days.

3.What payment methods are accepted for OMAP5910GGZG1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP5910GGZG1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OMAP5910GGZG1?

OMAP5910GGZG1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OMAP5910GGZG1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OMAP5910GGZG1?

For technical support, including OMAP5910GGZG1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP5910GGZG1 requirements.

6.How does Aetrix verify that OMAP5910GGZG1 is sourced from the original manufacturer or authorized distributors?

All OMAP5910GGZG1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP5910GGZG1 meets industry standards.

7.What is the process for return or replacement of OMAP5910GGZG1?

All OMAP5910GGZG1 units undergo pre-shipment inspection (PSI). If there is an issue with OMAP5910GGZG1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OMAP5910GGZG1 part is unused and in its original packaging.

Return procedure for OMAP5910GGZG1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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