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Texas Instruments OMAP5910GGZG2

Part No.:
OMAP5910GGZG2
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
-
Datasheet:
AetrixOMAP5910GGZG2.pdf
Description:
MIXED SIGNAL PROCESSOR
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Inventory:712

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Product details

Overview

OMAP5910GGZG2 from Texas Instruments is a dual-core system-on-chip integrating a 16-bit TMS320C55x DSP core and a TI-enhanced ARM925T RISC processor, operating at up to 200 MHz (MPU) and 100 MHz (DSP), with 192 KB on-chip SRAM, SDRAM interface support, and integrated LCD controller for STN/TFT panels. It targets handheld multimedia terminals requiring real-time signal processing and application-level control.

For engineers reviewing the OMAP5910GGZG2 datasheet, OMAP5910GGZG2 pinout, OMAP5910GGZG2 application, or OMAP5910GGZG2 equivalent, key selection considerations include dual-core interprocessor communication via mailbox registers and shared memory, 16-bit SDRAM interface timing compliance, USB host/function peripheral integration, and McBSP-based audio codec interfacing capability.

Technical Context

The OMAP5910GGZG2 implements tightly coupled MPU and DSP subsystems sharing peripherals including USB, McBSP, I²C, and LCD controller. The MPU runs ARM925T with MMU support, while the DSP executes C55x instructions optimized for low-power audio/video algorithms.

System clocking uses dual oscillators: a 32-kHz crystal for RTC and a 12/13-MHz base oscillator feeding PLLs to generate core clocks. Power management supports multiple sleep modes with configurable wake-up sources including STAT_VAL/WKUP and real-time clock alarms.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureDual-core: ARM925T RISC + TMS320C55x DSP, enabling concurrent OS execution and real-time signal processing
Max Clock Frequency200 MHz MPU / 100 MHz DSP - defines real-time throughput limits for multimedia codecs and UI rendering
On-Chip Memory192 KB SRAM (IMIF), no internal flash - requires external boot ROM or NAND/NOR flash for firmware storage
SDRAM Interface16-bit EMIFF supporting standard SDRAM - enables cost-effective external memory expansion up to 128 MB
LCD ControllerSupports monochrome STN and color STN/TFT panels - eliminates need for external display controller in portable devices
USB InterfaceIntegrated USB 1.1 host and function controller - allows direct peripheral attachment and PC connectivity without bridge ICs
Serial InterfacesThree McBSPs, one MCSI, UARTs, I²C, MICROWIRE - provides flexible audio, sensor, and legacy peripheral connectivity

Pinout & Package

The OMAP5910GGZG2 is packaged in a 423-pin MicroStar BGA (Ball Grid Array) with 0.8-mm pitch, designed for high-density portable PCB layouts and thermal dissipation via exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
GZG Pin V12VSS (Ground)Dedicated ground terminal with special VSS considerations for oscillator circuit stability per Section 5.6.1–5.6.2
GZG Pin P9USB.DPDifferential data+ line for USB 1.1 physical layer - replaced legacy "USB0.DP" designation in SPRS197D revision
GDY Pin F6VSS (Ground)Additional oscillator-related ground terminal - requires dedicated PCB ground plane routing per Section 5.6.1–5.6.2
GDY Pin P5USB.DPSecondary USB differential data+ line - supports dual-USB configuration when GDY package variant is used
A11, A13, H9, G9VSSAdditional ground pins added in SPRS197D revision to improve power integrity and reduce noise coupling

Key Features

FeatureDesign Value
Dual-core interprocessor communicationMailbox registers and 64 KB shared memory enable deterministic message passing and data exchange between ARM925T and C55x domains
Hardware acceleratorsDCT/iDCT, motion estimation, and pixel interpolation engines offload compute-intensive video processing from main cores
Programmable LCD timingConfigurable polarity and edge alignment for LCD.HS/LCD.VS and LCD.Px signals supports diverse panel timing requirements
Flexible clock configurationBase oscillator (12/13 MHz) and PLL allow independent scaling of MPU, DSP, and peripheral clocks for power/performance tuning
Low-power sleep modesMultiple retention states with selective peripheral wake-up (RTC, STAT_VAL/WKUP) minimize battery drain in handheld operation

Applications

Handheld Multimedia TerminalPortable Medical Imaging Device

Use Scenario: Integrated PDA with video playback, camera capture, and touchscreen UI.

IC Role / Device Role / Timing Role: OMAP5910GGZG2 serves as main application processor and media engine, coordinating ARM-based OS tasks and C55x-accelerated video decode.

Use Value: Dual-core architecture enables simultaneous UI responsiveness and real-time MPEG-4 playback at QVGA resolution without frame drops.

Use Scenario: Battery-powered ultrasound or dermatology imager with real-time image enhancement.

IC Role / Device Role / Timing Role: OMAP5910GGZG2 processes raw sensor data using DCT/iDCT and motion estimation accelerators, then displays results on integrated TFT panel.

Use Value: On-chip accelerators reduce processing latency by >40% versus software-only implementation, enabling sub-100-ms image update cycles.

Industrial HMI PanelLegacy Protocol Gateway

Use Scenario: Factory-floor operator interface with graphical display, touch input, and serial fieldbus connectivity.

IC Role / Device Role / Timing Role: OMAP5910GGZG2 acts as HMI controller running embedded Linux, driving LCD via integrated controller and communicating via UART/McBSP to PLCs.

Use Value: Integrated LCD controller and multiple serial interfaces eliminate 3–4 discrete ICs, reducing BOM cost and board area by ~25%.

Use Scenario: Protocol translator bridging RS-485 Modbus devices to USB-connected SCADA systems.

IC Role / Device Role / Timing Role: OMAP5910GGZG2 operates in dual-role USB mode: function peripheral to host PC and UART/McBSP master to field devices.

Use Value: Single-chip USB + serial interface integration enables compact, fanless gateway design with deterministic <5-ms protocol translation latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core multimedia processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
OMAP5912GGZG2Same package and pinout; adds 128 KB on-chip SRAM (vs. 192 KB in OMAP5910GGZG2) and enhanced USB PHY complianceTargeted at higher-bandwidth USB peripheral applications requiring tighter signal integrity marginsSelect OMAP5912GGZG2 only if USB 1.1 full-speed compliance testing mandates enhanced PHY specifications
OMAP5910GDYDifferent BGA package (484-pin vs. 423-pin); identical core architecture and feature set but revised pin assignments for improved signal routingSuitable for new designs where PCB layout flexibility and reduced crosstalk outweigh migration effort from GGZG2Choose OMAP5910GDY for green-field designs prioritizing signal integrity; avoid for GGZG2 drop-in replacement

Compared with OMAP5910GGZG2, OMAP5912GGZG2 offers marginally improved USB PHY specs but no functional upgrade, while OMAP5910GDY provides identical processing capability in a larger, re-optimized package-neither is pin-compatible, requiring PCB redesign for migration.

Availability

OMAP5910GGZG2 is available at Aetrix Electronics and suitable for handheld multimedia terminals, portable medical imaging devices, industrial HMI panels, and legacy protocol gateways requiring stable component supply across extended product lifecycles.

Supply support for OMAP5910GGZG2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company founded in 1930, specializing in analog, embedded processing, and digital signal processing technologies with broad industrial, automotive, and consumer applications.

The OMAP5910 product line was engineered for portable multimedia systems requiring tightly integrated application processing and real-time signal processing in a single SoC, targeting early-2000s handheld computing and imaging markets.

FAQ

What is the maximum supported SDRAM capacity for OMAP5910GGZG2?

The OMAP5910GGZG2 supports up to 128 MB of external SDRAM via its 16-bit EMIFF interface. This limit arises from the 27-bit address bus width (A0–A26) and standard SDRAM addressing conventions. Designers must configure EMIFF timing parameters per Section 5.8.2 of SPRS197D to ensure reliable operation at target clock rates.

Does OMAP5910GGZG2 support USB device mode with standard HID class drivers?

Yes, OMAP5910GGZG2 supports USB 1.1 function (device) mode and can implement HID class functionality using its integrated USB peripheral. However, full HID descriptor handling and enumeration require firmware-level driver development - the hardware provides the PHY and endpoint control logic but no built-in class stack.

How does the OMAP5910GGZG2 handle interprocessor interrupts between ARM925T and C55x cores?

The OMAP5910GGZG2 uses dedicated mailbox registers and level-sensitive interrupt lines mapped to both MPU and DSP interrupt controllers. Writing to a mailbox register asserts an interrupt on the target core; the interrupt vector and handler must be configured separately in each core's firmware per Sections 3.12.1 and 3.17 of SPRS197D.

Can OMAP5910GGZG2 drive a 480×640 TFT LCD panel directly?

Yes, OMAP5910GGZG2's integrated LCD controller supports 480×640 resolution in TFT mode using programmable timing registers (e.g., LCD_TIMING1/2). However, pixel clock generation depends on PLL configuration - designers must verify that the selected base oscillator (12/13 MHz) and PLL settings yield a stable pixel clock within panel specifications per Section 5.12.

What are the power supply requirements for OMAP5910GGZG2 core and I/O rails?

OMAP5910GGZG2 requires separate 1.6–1.8 V for CVDD (core) and 3.0–3.6 V for DVDD (I/O), with strict sequencing: CVDD must ramp before DVDD and remain active during DVDD transitions. Section 3.14.1 of SPRS197D specifies decoupling capacitor values (e.g., 10 µF bulk + 0.1 µF ceramic per power ball) and noise isolation techniques for stable operation.

OMAP5910GGZG2 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
-
Series:
*
Packaging:
Bulk
Product Status:
Active
Core Processor:
-
Number of Cores/Bus Width:
-
Speed:
-
Co-Processors/DSP:
-
RAM Controllers:
-
Graphics Acceleration:
-
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
-
Supplier Device Package:
-
Additional Interfaces:
-

OMAP5910GGZG2 FAQ

1.How can I place an order for OMAP5910GGZG2 through Aetrix?

Please submit a Request for Quotation (RFQ) for OMAP5910GGZG2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OMAP5910GGZG2 reliable?

The price and inventory of OMAP5910GGZG2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAP5910GGZG2 is usually 5 days.

3.What payment methods are accepted for OMAP5910GGZG2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAP5910GGZG2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OMAP5910GGZG2?

OMAP5910GGZG2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OMAP5910GGZG2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OMAP5910GGZG2?

For technical support, including OMAP5910GGZG2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAP5910GGZG2 requirements.

6.How does Aetrix verify that OMAP5910GGZG2 is sourced from the original manufacturer or authorized distributors?

All OMAP5910GGZG2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAP5910GGZG2 meets industry standards.

7.What is the process for return or replacement of OMAP5910GGZG2?

All OMAP5910GGZG2 units undergo pre-shipment inspection (PSI). If there is an issue with OMAP5910GGZG2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OMAP5910GGZG2 part is unused and in its original packaging.

Return procedure for OMAP5910GGZG2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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