Texas Instruments OMAP5912ZDY

Overview

OMAP5912ZDY from Texas Instruments is a dual-core applications processor integrating an ARM926EJ-S RISC CPU and TMS320C55x DSP on a single die, operating at up to 300 MHz (ARM) and 150 MHz (DSP), with integrated SDRAM/DDR memory controllers, camera interface supporting up to 80 MHz LCLK, and USB 1.1 OTG functionality. It targets portable multimedia terminals requiring real-time video encode/decode and OS-driven application execution.

For engineers reviewing the OMAP5912ZDY datasheet, OMAP5912ZDY pinout, OMAP5912ZDY application, or OMAP5912ZDY equivalent, key selection criteria include dual-core coherency architecture, 289-ball BGA (GDY/ZDY) package compatibility, 32-bit SDRAM/DDR timing compliance per EMIFF spec, and MPU/DSP shared memory interconnect via traffic controller.

Technical Context

The OMAP5912ZDY implements tightly coupled ARM926EJ-S and C55x cores sharing a unified memory map through a traffic controller, enabling low-latency interprocessor communication via mailbox registers and 128 KB of on-chip shared RAM. Its memory subsystem supports asynchronous NOR flash (EMIFS), NAND flash, SDR SDRAM, and Mobile DDR with configurable voltage control (DVDD4 = 1.8 V / 2.75 V / 3.3 V).

Peripherals include dual McBSPs, SPI, I²C, UART, MMC/SDIO, camera interface with CAM.EXCLK, LCD controller, RTC, HDQ/1-Wire, and hardware accelerators for DCT/iDCT, motion estimation, and pixel interpolation - all accessible to both MPU and DSP domains under OS or bare-metal control.

Key Specifications

Pinout & Package

OMAP5912ZDY uses a 289-ball plastic ball grid array (PBGA) package designated ZDY/GDY, with 1.0 mm ball pitch and thermal pad exposed on underside. Ball assignments are defined in Table 2−1 (SPRS231E, p.26), including multiplexed functions per pin.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core applications processor applications.

Compared with OMAP5912ZDY, OMAP5910ZDY sacrifices video acceleration and dual-core throughput for cost-sensitive voice applications, while OMAP1610ZDY delivers architectural upgrades and DDR2 readiness at the expense of legacy software compatibility and higher BOM cost.

Availability

OMAP5912ZDY is available at Aetrix Electronics and suitable for smartphone baseband processing, portable media player development, and industrial handheld terminal designs requiring stable component supply across long product lifecycles.

Supply support for OMAP5912ZDY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in digital signal processing and microcontroller architectures.

The OMAP5912ZDY belongs to TI's Open Multimedia Applications Platform (OMAP) family, designed specifically for portable multimedia terminals requiring tightly integrated ARM+DSP processing, rich peripheral sets, and low-power operation in space-constrained form factors.

FAQ

What is the maximum supported LCLK frequency for the camera interface on OMAP5912ZDY?

The OMAP5912ZDY camera interface supports a maximum LCLK frequency of 80 MHz, as specified in Table 5−33 of the SPRS231E datasheet. This enables direct interface with VGA-resolution CMOS sensors operating at 30 fps or QVGA sensors at 60 fps. The OMAP5912ZDY must be configured with appropriate PLL settings and timing constraints to maintain setup/hold margins at this rate.

Does OMAP5912ZDY support DDR SDRAM or only SDR SDRAM?

The OMAP5912ZDY supports SDR SDRAM and Mobile DDR SDRAM via its EMIFF interface, but does not support standard DDR or DDR2 SDRAM. Mobile DDR timing parameters are defined in Tables 5−17 and 5−18 (SPRS231E), and require setting CONF_VOLTAGE_SDRAM_R=1 regardless of DVDD4 voltage level.

What is the function of the TDO pin on OMAP5912ZDY, and which ball is it assigned to?

The TDO (Test Data Out) pin on OMAP5912ZDY provides JTAG boundary-scan output for IEEE 1149.1 compliance and production test. It is assigned to ball T15 in the ZDY/GDY package, as confirmed in Table 2−1 (SPRS231E, p.26) and Signal Descriptions (p.81).

How does the OMAP5912ZDY handle boot configuration, and what role does GPIO13 play?

The OMAP5912ZDY uses GPIO13 to select boot source: high for USB peripheral boot, low for external flash on CS3. This configuration is active during reset and documented in the MPU_BOOT signal description (SPRS231E, p.81). The OMAP5912ZDY does not require external strapping resistors for this selection.

What are the voltage requirements for DVDD4 on OMAP5912ZDY, and how does it affect memory timing?

OMAP5912ZDY supports DVDD4 at 1.8 V, 2.75 V, or 3.3 V, with memory timing parameters varying per voltage level - e.g., SDRAM tc(CLK) minimum is 10.41 ns at both 1.8 V and 2.75/3.3 V (Table 5−16). The CONF_VOLTAGE_SDRAM_R bit must be set to 1 for Mobile DDR operation regardless of DVDD4 value.