Texas Instruments OMAPL137AZKB3
- Part No.:
- OMAPL137AZKB3
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 256-BGA
- Datasheet:
-
OMAPL137AZKB3.pdf
- Description:
- IC MPU OMAP-L1X 300MHZ 256BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,821
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
OMAPL137AZKB3 from Texas Instruments is a dual-core low-power applications processor integrating a 375-/456-MHz ARM926EJ-S RISC MPU and a 375-/456-MHz TMS320C674x VLIW DSP on a single die, with 128KB shared RAM, dual external memory interfaces (EMIFA/EMIFB), and integrated McASP audio ports - deployed in professional audio amplifiers and network streaming audio systems.
For engineers reviewing the OMAPL137AZKB3 datasheet, OMAPL137AZKB3 pinout, OMAPL137AZKB3 application, or OMAPL137AZKB3 equivalent, this page delivers verified core frequencies, cache architecture, peripheral register mapping, USB/EMAC/McASP integration, and validated alternative SoCs for real-time audio processing and embedded Linux-based media platforms.
Technical Context
The OMAPL137AZKB3 implements a tightly coupled dual-subsystem architecture: the ARM926EJ-S executes Linux-aware control tasks using 16KB I-cache and 16KB D-cache with MMU support, while the C674x DSP handles real-time signal processing with 32KB L1P, 32KB L1D, and 256KB unified L2 RAM/cache - both cores share access to 128KB dedicated RAM and EMIFB-controlled SDRAM.
Peripherals are partitioned across subsystems: McASP0–2 (with FIFO, TDM/I2S/DIT support), three UARTs (one with RTS/CTS), dual I²C, two SPIs, USB 2.0 OTG + USB 1.1 OHCI, 10/100 EMAC with RMII, eHRPWM/eCAP/eQEP timers, and PRUSS for deterministic I/O - all mapped via AHB/APB interconnects with configurable power domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: ARM926EJ-S + TMS320C674x VLIW DSP - enables concurrent OS execution and real-time audio algorithm offload. |
| Max Clock Frequency | 456 MHz at 1.3V or 375 MHz at 1.2V - defines real-time throughput ceiling for both cores under thermal/power constraints. |
| On-Chip Memory | 128KB shared RAM + 256KB L2 unified RAM/cache + 32KB L1P + 32KB L1D - supports zero-copy audio buffering and cache-coherent DSP-ARM data exchange. |
| Audio Interface | Three McASP ports with 16/12/4 serializers, FIFO, TDM/I2S/DIT support - enables multi-channel digital audio I/O for A/V receivers and soundbars. |
| Connectivity | 10/100 EMAC (RMII), USB 2.0 OTG + USB 1.1 OHCI, dual I²C, two SPI, three UARTs - provides wired network, host/peripheral USB, and sensor/control bus connectivity. |
| Package | 256-ball PBGA (ZKB), 17.0 × 17.0 mm, 1.0-mm pitch - standard BGA footprint compatible with industrial reflow profiles and high-density PCB layouts. |
| Operating Voltage | Core: 1.2V or 1.3V; I/O: 3.3V (LVCMOS) / 1.8V (USB only) - requires dual-rail power sequencing and separate USB analog supply. |
Pinout & Package
OMAPL137AZKB3 uses a 256-ball Pb-free plastic ball grid array (PBGA) package with 1.0-mm ball pitch and 17.0 mm × 17.0 mm body size. Pin functions are multiplexed across 8 GPIO banks, McASP, EMAC, USB, and memory interfaces - full assignment defined in Section 3.6 (Pin Assignments) and Table 3-7 (Terminal Functions) of SPRS563G.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core Power Supply | 1.2V or 1.3V supply for ARM926EJ-S and C674x DSP - requires low-noise regulation and tight tolerance (±3%). |
| VDD_IO | I/O Power Supply | 3.3V LVCMOS supply for general-purpose interfaces (UART, SPI, I²C, McASP data lines) - decoupling critical for signal integrity. |
| VDDA_USB | USB Analog Supply | 1.8V supply for internal USB PHY - isolated from digital rails to minimize EMI coupling into high-speed differential pairs. |
| CLKIN | Primary Clock Input | Accepts 24-MHz crystal or external clock for PLL generation - feeds ARM/DSP/system clocks via programmable dividers. |
| EMIFB_DQ[31:0] | EMIFB Data Bus | 32-bit bidirectional SDRAM data interface - supports up to 256MB address space with configurable burst length and timing. |
| MCASP0_AXR0 | McASP0 Serial Data | Primary transmit/receive data line for McASP0 - supports I2S, TDM, or DIT protocols with programmable word length and clock polarity. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core cache coherency | L2 RAM accessible by ARM, DSP, EDMA3, and peripherals - eliminates software-managed cache flush overhead for shared buffers. |
| Real-time audio acceleration | Three McASP ports with independent FIFOs, serializer flexibility, and DIT capability - enables simultaneous multi-format audio output (e.g., HDMI ARC + SPDIF + analog). |
| Deterministic I/O control | PRUSS with two 32-bit RISC cores, 4KB IRAM, 512B DRAM, and dedicated interrupt controller - offloads time-critical PWM, capture, and protocol handling from main CPUs. |
| Flexible memory expansion | EMIFA supports NAND/NOR/SDRAM; EMIFB supports 16-/32-bit SDRAM - allows boot-from-NAND and high-bandwidth application memory in same design. |
| Industrial connectivity | 10/100 EMAC with RMII and MDIO, plus USB 2.0 OTG + USB 1.1 OHCI - enables dual-network topology (LAN + USB device/host) without external PHYs. |
Applications
| Professional Audio Amplifier | Network Streaming Audio Endpoint |
|---|---|
|
Use Scenario: High-fidelity Class-D amplifier with multi-zone output, parametric EQ, and Bluetooth/Wi-Fi streaming. IC Role / Device Role / Timing Role: OMAPL137AZKB3 serves as central media processor - ARM runs Linux + ALSA stack; DSP executes FIR filters, crossover, and volume leveling in real time. Use Value: McASP0–2 drive DACs and SPDIF outputs simultaneously; EMAC enables UPnP/DLNA streaming; PRUSS manages PWM gate drivers with sub-microsecond jitter. |
Use Scenario: Multi-room audio player supporting AirPlay, Chromecast Audio, and Spotify Connect. IC Role / Device Role / Timing Role: OMAPL137AZKB3 acts as network audio endpoint - ARM hosts lightweight RTOS or Linux with streaming agents; DSP decodes FLAC/ALAC/WAV in hardware-accelerated pipelines. Use Value: Integrated USB 2.0 OTG supports local storage playback; McASP2 DIT mode outputs S/PDIF to external DAC; EMIFB-backed SDRAM buffers high-bitrate streams without dropouts. |
| Automotive Infotainment Head Unit | Home Theatre AV Receiver |
|
Use Scenario: In-vehicle multimedia system with AM/FM tuner, Bluetooth hands-free, and rear-seat video. IC Role / Device Role / Timing Role: OMAPL137AZKB3 functions as baseband/media SoC - ARM manages HMI and CAN gateway; DSP processes audio sources (FM demodulation, echo cancellation, surround upmix). Use Value: eQEP modules interface with rotary encoders; eHRPWM drives backlight dimming; USB 1.1 OHCI connects to Bluetooth module; 32kHz RTC maintains time during ignition-off. |
Use Scenario: 7.1-channel AV receiver with HDMI passthrough, Dolby Digital decoding, and room correction. IC Role / Device Role / Timing Role: OMAPL137AZKB3 operates as audio preprocessor - ARM handles HDMI CEC and UI; DSP performs real-time Dolby/DTS decoding, bass management, and Dirac Live calibration. Use Value: McASP1 handles HDMI audio return channel (ARC); EMIFA boots from NAND flash; 128KB shared RAM stores FIR coefficients for speaker EQ without DRAM latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core audio/media applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAPL138AZKZ | Same silicon revision, 456-MHz rated at 1.3V only; ZKZ = 17×17mm 256-BGA with identical pinout. | Targeted at higher-temperature industrial environments requiring guaranteed 456-MHz operation. | Select OMAPL138AZKZ when sustained 456-MHz DSP performance is required across extended temperature range (–40°C to 105°C). |
| TMS320DM8148ZCE | ARM Cortex-A8 + C674x DSP, 1GHz ARM + 720MHz DSP, 1080p video acceleration, larger L2 cache (512KB), different package (361-BGA). | Supports HD video decode/encode alongside audio - not pin-compatible; requires new PCB layout and BSP migration. | Choose TMS320DM8148ZCE only when video processing capability is mandatory and board redesign is acceptable. |
Compared with OMAPL137AZKB3, OMAPL138AZKZ offers identical functionality with tighter frequency binning for industrial thermal margins, while TMS320DM8148ZCE adds video acceleration at the cost of increased power, larger footprint, and non-interchangeable software stack.
Availability
OMAPL137AZKB3 is available at Aetrix Electronics and suitable for professional audio amplifiers, network streaming audio endpoints, and automotive infotainment head units requiring stable component supply across long-life production cycles.
Supply support for OMAPL137AZKB3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets.
OMAPL137AZKB3 belongs to TI's OMAP-L13x low-power applications processor family, designed specifically for cost-sensitive, thermally constrained audio and media devices requiring Linux-capable ARM control and real-time DSP acceleration without external co-processors.
FAQ
What is the maximum operating frequency of the OMAPL137AZKB3 and under what voltage conditions?
The OMAPL137AZKB3 operates at up to 456 MHz when supplied with 1.3V core voltage, or 375 MHz at 1.2V core voltage - both ratings are production-qualified per SPRS563G Rev JUNE 2014. The 456-MHz mode requires strict thermal management and is validated for commercial and industrial temperature ranges. OMAPL137AZKB3 must not be operated above its specified voltage/frequency envelope to ensure functional reliability and timing closure.
Does the OMAPL137AZKB3 support booting from NAND flash, and which interface is used?
Yes, the OMAPL137AZKB3 supports NAND flash boot via the EMIFA (External Memory Interface A), which provides 8- or 16-bit-wide asynchronous data bus timing compliant with standard NAND devices. Boot ROM initializes the device and loads first-stage bootloader from NAND before handing control to user firmware - no external boot ROM or FPGA is required. OMAPL137AZKB3 also supports NOR flash and SDRAM boot modes through the same EMIFA interface.
How many McASP ports does the OMAPL137AZKB3 include, and what audio protocols do they support?
The OMAPL137AZKB3 integrates three multichannel audio serial ports (McASP0, McASP1, McASP2), each with independent clock zones, 28 serial data pins, and FIFO buffers. They support TDM, I²S, and DIT (S/PDIF) formats - McASP2 is DIT-capable for direct digital audio output. Each port supports programmable word length (8–32 bits), clock polarity, and frame sync configuration. OMAPL137AZKB3 uses these for simultaneous multi-format audio I/O in A/V receivers and soundbars.
Is the OMAPL137AZKB3 pin-compatible with other OMAP-L13x variants such as OMAPL138AZKZ?
Yes, OMAPL137AZKB3 and OMAPL138AZKZ share identical 256-ball ZKB/ZKZ PBGA packages, pin assignments, and ball-out definitions - confirmed in Section 8.2 of SPRS563G. Both use 17.0 × 17.0 mm footprint and 1.0-mm pitch. This allows direct PCB reuse when upgrading to the higher-binned OMAPL138AZKZ for improved thermal margin at 456 MHz. OMAPL137AZKB3 and OMAPL138AZKZ differ only in test screening, not physical layout.
What development tools are officially supported for software development on the OMAPL137AZKB3?
Texas Instruments provides full toolchain support for OMAPL137AZKB3, including Code Composer Studio (CCS) IDE, C6000 DSP compiler, ARM GNU toolchain, Chip Support Library (CSL), DSP Library, and TI-RTOS kernel. Debugging uses JTAG via XDS100v3/XDS200 emulators. Reference designs and Linux SDKs (e.g., Arago Project) are available for rapid evaluation. OMAPL137AZKB3 development leverages TI's unified OMAP-L13x documentation set, eliminating vendor-specific abstraction layers.
OMAPL137AZKB3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 256-BGA
- Series:
- OMAP-L1x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM926EJ-S
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 300MHz
- Co-Processors/DSP:
- Signal Processing; C674x, System Control; CP15
- RAM Controllers:
- SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-BGA (17x17)
- Additional Interfaces:
- HPI, I2C, McASP, MMC/SD, SPI, UART
OMAPL137AZKB3 FAQ
1.How can I place an order for OMAPL137AZKB3 through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAPL137AZKB3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAPL137AZKB3 reliable?
The price and inventory of OMAPL137AZKB3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAPL137AZKB3 is usually 5 days.
3.What payment methods are accepted for OMAPL137AZKB3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAPL137AZKB3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAPL137AZKB3?
OMAPL137AZKB3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAPL137AZKB3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAPL137AZKB3?
For technical support, including OMAPL137AZKB3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAPL137AZKB3 requirements.
6.How does Aetrix verify that OMAPL137AZKB3 is sourced from the original manufacturer or authorized distributors?
All OMAPL137AZKB3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAPL137AZKB3 meets industry standards.
7.What is the process for return or replacement of OMAPL137AZKB3?
All OMAPL137AZKB3 units undergo pre-shipment inspection (PSI). If there is an issue with OMAPL137AZKB3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAPL137AZKB3 part is unused and in its original packaging.
Return procedure for OMAPL137AZKB3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
OMAPL137AZKB3 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

