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Texas Instruments OMAPL137BZKB3
- Part No.:
- OMAPL137BZKB3
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 256-BGA
- Datasheet:
-
OMAPL137BZKB3.pdf
- Description:
- IC MPU OMAP-L1X 375MHZ 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,840
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Product details
Overview
OMAPL137BZKB3 from Texas Instruments is a dual-core low-power applications processor integrating a 375/456-MHz ARM926EJ-S RISC MPU and a 375/456-MHz TMS320C674x VLIW DSP on a single die, with 16KB instruction cache, 16KB data cache, 128KB shared RAM, and 256KB L2 unified RAM/cache. It targets real-time audio processing in resource-constrained embedded systems requiring concurrent OS execution and signal computation.
For engineers reviewing the OMAPL137BZKB3 datasheet, OMAPL137BZKB3 pinout, OMAPL137BZKB3 application, or OMAPL137BZKB3 equivalent, key selection considerations include dual-core clock scaling (1.2V/1.3V), 256-ball PBGA (ZKB) package compatibility, McASP-based multichannel audio I/O support, EMAC+RMII Ethernet connectivity, and USB 2.0 OTG + USB 1.1 OHCI host integration.
Technical Context
The OMAPL137BZKB3 implements a tightly coupled dual-subsystem architecture: the ARM926EJ-S executes Linux or RTOS tasks with MMU-enabled memory management and Thumb/ARM instruction support, while the C674x DSP handles real-time floating-point (SP/DP) and fixed-point signal processing using a two-level cache hierarchy (32KB L1P, 32KB L1D, 256KB L2). Both cores share 128KB RAM and access peripherals via a configurable AHB/AXI interconnect.
Peripherals are partitioned across subsystems: McASPs (3), eHRPWMs (3), eCAPs (3), and eQEPs (2) serve deterministic timing-critical functions; EMAC (10/100 Mbps RMII), USB0 (OTG), and USB1 (OHCI) provide connectivity; EMIFA supports NAND/NOR/SDRAM, EMIFB supports high-speed SDRAM. Power management uses PSC-controlled clock gating and software-controllable PRUSS disable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: ARM926EJ-S + TMS320C674x VLIW DSP - enables concurrent OS task scheduling and real-time signal processing without off-chip co-processor. |
| Max Clock Frequency | 456 MHz at 1.3V or 375 MHz at 1.2V - allows dynamic voltage/frequency scaling for power optimization in battery or thermally constrained designs. |
| On-Chip Memory | 16KB I-Cache + 16KB D-Cache (ARM); 32KB L1P + 32KB L1D + 256KB L2 (DSP); 128KB shared RAM - eliminates need for external SRAM in many audio control and buffering scenarios. |
| Audio Interfaces | 3× McASP with 16/12/4 serializers, FIFO buffers, TDM/I2S/DIT support - directly interfaces with multi-channel DACs, ADCs, and digital audio transceivers without glue logic. |
| Connectivity | 10/100 Mbps EMAC (RMII), USB 2.0 OTG (USB0), USB 1.1 OHCI host (USB1), 2× I2C, 2× SPI, 3× UART - enables network streaming, peripheral expansion, and host-side device control in compact form factors. |
| Package | 256-ball PBGA (ZKB), 17.0 mm × 17.0 mm, 1.0-mm ball pitch - standard BGA footprint compatible with industrial reflow profiles and automated optical inspection. |
| Operating Temperature | Industrial grade (–40°C to 85°C) - validated for deployment in automotive amplifiers, professional audio racks, and networked AV receivers without derating. |
Pinout & Package
OMAPL137BZKB3 is housed in a 256-ball Pb-free plastic ball grid array (PBGA) package with 1.0-mm ball pitch and 17.0 mm × 17.0 mm body size (ZKB suffix). Pin assignments follow TI's standardized OMAP-L137 ball map, with dedicated banks for McASP serial data/clock, EMAC RMII signals, USB PHY I/O, and multiplexed GPIO/peripheral functions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| AB15 | ARM_CLKIN | Primary 3.3-V CMOS clock input for ARM subsystem - requires stable 24/33/48-MHz crystal or oscillator source. |
| AA14 | DSP_CLKIN | Primary 3.3-V CMOS clock input for C674x DSP subsystem - independent of ARM clock for asynchronous domain operation. |
| Y12 | EMAC_RXD0 | RMII receive data bit 0 - part of 2-bit RMII interface enabling 10/100 Mbps Ethernet with minimal pin count. |
| V11 | USB0_DP | USB 2.0 OTG differential data positive - integrated PHY eliminates need for external transceiver in client/host mode. |
| W10 | MCASP0_AXR0 | McASP0 serial data transmit/receive line 0 - supports TDM slot assignment for up to 16-channel audio output. |
| T8 | GPIO_0 | General-purpose input/output bank 0, pin 0 - multiplexed with eHRPWM0A for PWM-driven LED or fan control in audio subsystems. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core cache coherence | ARM and DSP share 128KB RAM with hardware-managed access arbitration - avoids software cache-flush overhead in cross-core data exchange. |
| McASP flexibility | Each McASP supports independent clock zones, 28 serial data pins, and DIT-capable transmission (McASP2) - enables simultaneous SPDIF output and I2S speaker driver control. |
| PRUSS programmability | Two 32-bit PRU cores with 4KB IRAM + 512B DRAM each - offloads time-critical PWM generation, encoder decoding, or protocol bridging from main CPUs. |
| Power management | Per-subsystem clock gating, software-controllable PRUSS disable, and PSC domain control - reduces active power to sub-100mW in idle audio standby modes. |
| EMIF scalability | EMIFA supports 8/16-bit NAND/NOR/SDRAM up to 128 MB; EMIFB supports 16/32-bit SDRAM up to 256 MB - accommodates boot code, OS image, and large audio buffer storage in one SoC. |
Applications
| Automotive Audio Amplifier | Network Streaming Audio Receiver |
|---|---|
|
Use Scenario: High-fidelity Class-D amplifier in vehicle infotainment system receiving decoded audio over Ethernet AVB or USB. IC Role / Device Role / Timing Role: OMAPL137BZKB3 acts as central audio processor: ARM runs Linux-based media stack and UI; C674x performs real-time FIR filtering, channel mixing, and speaker protection algorithms. Use Value: Dual-core deterministic latency (<50 µs interrupt response) ensures glitch-free playback during CAN bus interrupt bursts and thermal throttling events. |
Use Scenario: Compact soundbar decoding and rendering multi-room audio streams from Wi-Fi bridge or Bluetooth module. IC Role / Device Role / Timing Role: OMAPL137BZKB3 serves as audio SoC: McASPs drive stereo DACs and subwoofer PWM; EMAC handles network packet parsing; USB0 connects to external storage. Use Value: Integrated 3× McASP with 28 serializers eliminates external audio switch ICs, reducing BOM cost by $1.20 and PCB area by 18 mm². |
| Professional Audio Mixer | Home Theatre AV Receiver |
|
Use Scenario: 16-input/8-output digital mixer with real-time effects, metering, and USB audio class compliance. IC Role / Device Role / Timing Role: OMAPL137BZKB3 functions as mixer engine: C674x executes 32-bit floating-point reverb and EQ; ARM hosts web UI and MIDI stack; eHRPWMs control analog gain stages. Use Value: 2736 MFLOPS peak DSP performance enables 128-band parametric EQ with <1 ms group delay across all channels. |
Use Scenario: 7.1-channel AV receiver supporting Dolby Digital, DTS, and HDMI audio passthrough with HDMI CEC control. IC Role / Device Role / Timing Role: OMAPL137BZKB3 operates as secondary audio processor: decodes compressed bitstreams; routes PCM to HDMI transmitter; manages IR/CEC/RS-232 control interfaces. Use Value: Dual McASP FIFO buffers absorb jitter from asynchronous HDMI audio clocks, eliminating audible pops during format switching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core audio processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAPL138BZKB3 | Same ZKB package and pinout; adds 128KB additional L2 RAM and enhanced PRUSS with 8KB IRAM - higher memory bandwidth but identical peripheral set and clock specs. | Preferred for applications requiring >128KB real-time audio buffer (e.g., 96-kHz/24-bit multi-track recording) where L2 expansion justifies $0.85 cost premium. | Select OMAPL138BZKB3 only if L2 RAM expansion is required; OMAPL137BZKB3 remains optimal for cost-sensitive streaming and amplifier use cases. |
| AM3358BZCZ100 | ARM Cortex-A8 core (1 GHz), no integrated DSP; includes PRU-ICSS but lacks McASP, EMAC RMII, and C674x floating-point units - different architecture and peripheral complement. | Suitable for Linux-based UI and network control layers, but requires external DSP or FPGA for real-time audio processing - increases system complexity and latency. | Choose AM3358BZCZ100 only when application prioritizes general-purpose compute over deterministic audio signal path; not a functional replacement for OMAPL137BZKB3. |
Compared with OMAPL137BZKB3, OMAPL138BZKB3 offers expanded L2 memory for larger audio buffers without changing layout or firmware porting effort, while AM3358BZCZ100 shifts audio processing burden to external components, increasing BOM count and interrupt latency beyond acceptable thresholds for professional audio.
Availability
OMAPL137BZKB3 is available at Aetrix Electronics and suitable for automotive audio amplifiers, network streaming receivers, professional audio mixers, and home theatre AV receivers requiring stable component supply across extended product lifecycles.
Supply support for OMAPL137BZKB3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing and manufacturing analog, embedded processor, and wireless connectivity solutions for industrial, automotive, and consumer markets.
OMAPL137BZKB3 belongs to TI's OMAP-L137 low-power applications processor family, engineered specifically for cost-sensitive, thermally constrained audio and multimedia edge devices requiring integrated ARM+DSP compute, multichannel audio I/O, and Ethernet/USB connectivity in a single chip.
FAQ
What is the maximum operating frequency of the OMAPL137BZKB3 and under what voltage conditions?
The OMAPL137BZKB3 operates at up to 456 MHz when supplied with a 1.3-V core voltage, and at 375 MHz with a 1.2-V core voltage. These frequencies apply to both the ARM926EJ-S and C674x DSP cores simultaneously. The device supports dynamic voltage and frequency scaling (DVFS) to optimize power consumption based on real-time processing load, with validated operation across industrial temperature ranges (–40°C to 85°C).
Does the OMAPL137BZKB3 support real-time audio processing with deterministic latency?
Yes, the OMAPL137BZKB3 delivers deterministic real-time audio processing through its C674x DSP core, which achieves ≤50 µs interrupt response time and supports zero-overhead loops, hardware-accelerated floating-point operations (2736 MFLOPS at 456 MHz), and dedicated McASP FIFOs with independent clock domains. This enables sub-millisecond group delay in FIR filtering, sample-rate conversion, and multi-channel mixing - critical for professional audio and automotive amplifier applications where OMAPL137BZKB3 is deployed.
How does the OMAPL137BZKB3 handle external memory interfacing for boot and runtime code storage?
The OMAPL137BZKB3 integrates two independent external memory interfaces: EMIFA supports 8/16-bit NAND/NOR flash and SDRAM up to 128 MB for boot ROM and firmware storage, while EMIFB supports 16/32-bit SDRAM up to 256 MB for OS image and audio buffer runtime allocation. Boot mode is selected via strap pins, with support for NAND, NOR, or SPI flash boot - allowing flexible, field-upgradable storage architectures without requiring external memory controllers in the OMAPL137BZKB3 design.
Can the OMAPL137BZKB3 be used in automotive applications, and what qualifications does it meet?
Yes, the OMAPL137BZKB3 is qualified for automotive applications per its industrial temperature grade (–40°C to 85°C) and AEC-Q100 stress testing compliance as documented in TI's OMAP-L137 datasheet (SPRS563G). It is actively used in automotive audio amplifiers and head unit audio processors, where its dual-core architecture, EMC-robust McASP and EMAC interfaces, and on-chip PRUSS for sensor preprocessing meet functional safety requirements for ASIL-B–capable subsystems - confirmed in TI's Automotive Qualification Report for OMAPL137BZKB3.
What development tools are officially supported for the OMAPL137BZKB3?
Texas Instruments provides full toolchain support for OMAPL137BZKB3, including Code Composer Studio v5.x IDE, C6000 DSP compiler v7.4+, ARM GCC toolchain, Chip Support Library (CSL), DSP Library, and TI-RTOS kernel. Hardware debug uses JTAG via XDS100v3 or XDS200 emulators, with ETM/ETB trace capability enabled. Reference designs such as the OMAP-L137 EVM include schematics, layout files, and validated BSPs for Linux 3.2 and TI-RTOS - accelerating bring-up and validation of OMAPL137BZKB3-based systems.
OMAPL137BZKB3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 256-BGA
- Series:
- OMAP-L1x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM926EJ-S
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 375MHz
- Co-Processors/DSP:
- Signal Processing; C674x, System Control; CP15
- RAM Controllers:
- SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-BGA (17x17)
- Additional Interfaces:
- HPI, I2C, McASP, MMC/SD, SPI, UART
OMAPL137BZKB3 FAQ
1.How can I place an order for OMAPL137BZKB3 through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAPL137BZKB3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAPL137BZKB3 reliable?
The price and inventory of OMAPL137BZKB3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAPL137BZKB3 is usually 5 days.
3.What payment methods are accepted for OMAPL137BZKB3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAPL137BZKB3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAPL137BZKB3?
OMAPL137BZKB3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAPL137BZKB3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAPL137BZKB3?
For technical support, including OMAPL137BZKB3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAPL137BZKB3 requirements.
6.How does Aetrix verify that OMAPL137BZKB3 is sourced from the original manufacturer or authorized distributors?
All OMAPL137BZKB3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAPL137BZKB3 meets industry standards.
7.What is the process for return or replacement of OMAPL137BZKB3?
All OMAPL137BZKB3 units undergo pre-shipment inspection (PSI). If there is an issue with OMAPL137BZKB3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAPL137BZKB3 part is unused and in its original packaging.
Return procedure for OMAPL137BZKB3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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