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Texas Instruments OMAPL137BZKBD4
- Part No.:
- OMAPL137BZKBD4
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 256-BGA
- Datasheet:
-
OMAPL137BZKBD4.pdf
- Description:
- IC MPU OMAP-L1X 456MHZ 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,364
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Product details
Overview
OMAPL137BZKBD4 from Texas Instruments is a dual-core low-power applications processor integrating a 456-MHz ARM926EJ-S RISC MPU and a 456-MHz TMS320C674x VLIW DSP, with 128KB shared RAM, dual external memory interfaces (EMIFA/EMIFB), and integrated 10/100 Ethernet MAC - deployed in professional audio streaming systems requiring real-time audio processing and network connectivity.
For engineers reviewing the OMAPL137BZKBD4 datasheet, OMAPL137BZKBD4 pinout, OMAPL137BZKBD4 application, or OMAPL137BZKBD4 equivalent, key selection criteria include dual-core clock synchronization at 456 MHz, 256-ball PBGA (ZKB) package compatibility, EMAC RMII interface support, and McASP-based multichannel audio I/O capability.
Technical Context
The OMAPL137BZKBD4 implements tightly coupled ARM926EJ-S and C674x cores sharing L2 and 128KB RAM, with independent cache hierarchies: ARM side features 16KB I-cache + 16KB D-cache + 8KB vector RAM + 64KB ROM; DSP side includes 32KB L1P, 32KB L1D, and 256KB unified L2 RAM/cache. Both cores operate at identical 456-MHz frequency under 1.3-V core voltage.
Peripheral integration is routed through a centralized interconnect fabric: EMAC uses RMII with MDIO for PHY control; three McASPs support TDM/I2S with FIFO buffering and DIT capability; USB0 provides OTG (high/full/low-speed) with on-chip PHY; USB1 delivers OHCI host functionality; and dual EMIFs enable concurrent NAND/NOR/SDRAM access with up to 256MB address space on EMIFB.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual-core: ARM926EJ-S + TMS320C674x VLIW DSP, both running at 456 MHz - enables parallel execution of OS services (ARM) and real-time signal processing (DSP). |
| Core Voltage | 1.3 V - required for 456-MHz operation; distinct from 1.2-V 375-MHz variant; impacts power delivery design and thermal management. |
| I/O Voltage | 3.3 V LVCMOS (general), 1.8 V (USB only) - mandates level-shifting for USB PHY interfacing and separate power domain routing. |
| Memory Interfaces | EMIFA: 16-bit SDRAM (128 MB), NAND/NOR; EMIFB: 32-bit SDRAM (256 MB) - supports heterogeneous memory topology for boot code, OS, and real-time buffers. |
| Audio Peripherals | 3× McASP with 28 serializers, FIFO, TDM/I2S/DIT support - enables simultaneous multi-zone audio output (e.g., 7.1 + subwoofer + effects) without external codecs. |
| Ethernet Interface | 10/100 Mbps EMAC with RMII and MDIO - provides deterministic low-latency network streaming (e.g., AES67, Dante) and remote device management. |
| Package | 256-ball PBGA (ZKB), 17.0 mm × 17.0 mm, 1.0-mm pitch - requires 10-layer PCB with controlled-impedance routing and thermal vias under die. |
Pinout & Package
OMAPL137BZKBD4 is housed in a 256-ball Pb-free plastic ball grid array (PBGA) package with 1.0-mm ball pitch and 17.0 mm × 17.0 mm body size (ZKB suffix). Pin functions are multiplexed across 8 GPIO banks and dedicated peripheral balls including EMAC RMII, McASP serial data/clock, USB0/USB1 differential pairs, and EMIF address/data buses.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EMAC_RXD[1:0] | Ethernet receive data pair | RMII-compliant 2-bit data bus; requires 50-Ω single-ended trace impedance and <600-ps skew matching to EMAC_REF_CLK. |
| MCASP0_AXR[0:15] | McASP0 serial data lines | Configurable as transmit/receive; supports TDM slot widths up to 32 bits; each line must be terminated with 100-Ω series resistor near receiver. |
| USB0_DP / USB0_DM | USB 2.0 OTG differential pair | Full/high-speed signaling; requires 90-Ω differential impedance, <5-mil spacing, and ESD protection per IEC 61000-4-2 Level 4. |
| EMIFB_A[0:13] | EMIFB address bus | 14-bit address for 32-bit SDRAM; shares balls with GPIO and other peripherals; must be length-matched within ±5 mm to data bus. |
| VDD_CORE | 1.3-V DSP/ARM core supply | Requires low-noise regulation (<10 mV p-p ripple), local 10-μF ceramic + bulk capacitance, and dedicated ground plane under package. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core clock synchronization | ARM926EJ-S and C674x DSP both run at identical 456 MHz - eliminates inter-core timing jitter in real-time audio frame handoff. |
| McASP DIT capability | McASP2 supports Digital Interface Transmitter (DIT) mode - enables direct S/PDIF output without external transceiver IC. |
| EDMA3 controller | 32 independent DMA channels + 8 QDMA channels - offloads CPU from high-bandwidth audio buffer transfers and Ethernet packet handling. |
| Programmable Real-Time Unit Subsystem (PRUSS) | Two 32-bit PRU cores with 4KB IRAM + 512B DRAM each - executes time-critical I/O tasks (e.g., PWM generation, encoder feedback) independently of ARM/DSP. |
| Boot flexibility | Supports NAND, NOR, MMC/SD, UART, and USB boot modes - simplifies field firmware recovery and enables secure over-the-air updates via SD card or network. |
Applications
| Professional Audio Streaming | Automotive Infotainment Head Unit |
|---|---|
|
Use Scenario: Network-connected digital mixer supporting AES67 and RAOP protocols with 32-channel I/O and real-time effects processing. IC Role / Device Role / Timing Role: OMAPL137BZKBD4 serves as main SoC - ARM handles Linux RTOS, network stack, and UI; DSP performs FIR filtering, dynamics, and sample-rate conversion with sub-100-μs latency. Use Value: Dual-core deterministic scheduling enables synchronized audio frame delivery across Ethernet and McASP outputs without buffer underrun. |
Use Scenario: In-vehicle head unit with AM/FM tuner, Bluetooth A2DP, HDMI input, and 10.1-inch LCD display. IC Role / Device Role / Timing Role: OMAPL137BZKBD4 acts as central media processor - ARM runs QNX OS and graphics stack; DSP decodes MP3/AAC/WMA; LCD controller drives display; eHRPWM manages backlight dimming. Use Value: Integrated LCD controller and eHRPWM eliminate external timing ICs; McASP interfaces directly to audio codec for reduced BOM cost. |
| Home Theatre AV Receiver | Networked Soundbar with Voice Assistant |
|
Use Scenario: 9.2-channel AV receiver supporting Dolby Atmos decoding, HDMI 2.0 passthrough, and multi-room audio distribution. IC Role / Device Role / Timing Role: OMAPL137BZKBD4 executes Dolby/DTS decoder libraries on DSP while ARM manages HDMI CEC, IR remote, and Wi-Fi coexistence. Use Value: 256KB L2 RAM enables full Atmos object metadata buffering; EMAC RMII ensures stable 100-Mbps streaming to zone amplifiers. |
Use Scenario: Premium soundbar with far-field microphone array, Alexa/Google Assistant voice processing, and Chromecast built-in. IC Role / Device Role / Timing Role: OMAPL137BZKBD4 hosts wake-word detection (DSP) and ASR inference (ARM); McASP captures 8-mic beamformed audio; USB0 connects to Wi-Fi/BT module. Use Value: On-chip PRUSS handles real-time mic sampling and noise suppression, freeing DSP cycles for neural net inference. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core audio/video applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAPL137BZKBD3 | Rated for 375 MHz at 1.2 V core voltage; identical pinout and peripheral set; lower thermal envelope. | Suitable for cost-sensitive consumer audio where 456-MHz throughput is unnecessary (e.g., stereo soundbars without Atmos). | Select OMAPL137BZKBD3 when thermal budget or BOM cost constraints preclude 1.3-V regulation and active cooling. |
| AM3358BZCZ100 | ARM Cortex-A8 single-core (1 GHz), no integrated DSP; PRU-ICSS instead of C674x; different McASP count (2 vs 3) and no DIT mode. | Better suited for HMI-centric industrial gateways than real-time audio signal processing; lacks native floating-point DSP acceleration. | Choose AM3358BZCZ100 only if application prioritizes Linux GUI performance over multichannel audio DSP load. |
Compared with OMAPL137BZKBD4, the OMAPL137BZKBD3 offers identical feature set at reduced clock speed and power, while the AM3358BZCZ100 trades DSP capability for higher ARM performance and PRU flexibility - making OMAPL137BZKBD4 uniquely balanced for mixed-signal embedded audio systems.
Availability
OMAPL137BZKBD4 is available at Aetrix Electronics and suitable for professional audio streaming systems, automotive infotainment head units, and home theatre AV receivers requiring stable component supply across extended product lifecycles.
Supply support for OMAPL137BZKBD4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets.
The OMAP-L137 product line was engineered to deliver low-power, high-fidelity audio and video processing in resource-constrained embedded systems - targeting applications where real-time DSP compute and rich OS support must coexist on a single chip.
FAQ
What is the maximum operating frequency of the OMAPL137BZKBD4?
The OMAPL137BZKBD4 operates at a maximum frequency of 456 MHz for both the ARM926EJ-S and C674x DSP cores, achieved under 1.3-V core supply voltage and industrial temperature range conditions. This rating is confirmed in Section 3.1 of the SPRS563G datasheet and applies specifically to the 'D4' speed grade. Lower-speed variants (e.g., OMAPL137BZKBD3) are rated for 375 MHz at 1.2 V.
Does the OMAPL137BZKBD4 support booting from NAND flash?
Yes, the OMAPL137BZKBD4 supports NAND flash boot mode via its EMIFA interface, as documented in Section 4.1 of the SPRS563G datasheet. It accommodates both 8-bit and 16-bit NAND devices with hardware ECC support, enabling reliable firmware storage and recovery without external boot ROM. Boot configuration is controlled by strap pins during reset assertion.
How many McASP modules does the OMAPL137BZKBD4 integrate, and what audio formats do they support?
The OMAPL137BZKBD4 integrates three multichannel audio serial ports (McASP0–McASP2), each with configurable clock zones, 28 serial data pins, and FIFO buffering. They support TDM, I2S, and similar formats; McASP2 additionally supports Digital Interface Transmitter (DIT) mode for direct S/PDIF output. This is specified in Sections 1.1 and 6.16 of the SPRS563G datasheet.
Is the OMAPL137BZKBD4 pin-compatible with other OMAP-L137 speed grades?
Yes, the OMAPL137BZKBD4 is fully pin-compatible with all other OMAP-L137 variants (e.g., OMAPL137BZKBD3, OMAPL137BZKBD2) in the 256-ball ZKB PBGA package. Mechanical and electrical pin assignments - including power, ground, EMIF, McASP, and USB signals - are identical across speed grades, enabling drop-in replacement in existing designs when thermal and voltage conditions permit.
What development tools are officially supported for the OMAPL137BZKBD4?
Texas Instruments provides full toolchain support for OMAPL137BZKBD4, including Code Composer Studio (CCS) IDE, C6000 DSP compiler, ARM GNU toolchain, Chip Support Library (CSL), DSP Library, and TI DSP/BIOS real-time kernel. Debugging is enabled via JTAG using XDS100v3 or XDS200 emulators, as detailed in Section 7.1 of the SPRS563G documentation.
OMAPL137BZKBD4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 256-BGA
- Series:
- OMAP-L1x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM926EJ-S
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 456MHz
- Co-Processors/DSP:
- Signal Processing; C674x, System Control; CP15
- RAM Controllers:
- SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-BGA (17x17)
- Additional Interfaces:
- HPI, I2C, McASP, MMC/SD, SPI, UART
OMAPL137BZKBD4 FAQ
1.How can I place an order for OMAPL137BZKBD4 through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAPL137BZKBD4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAPL137BZKBD4 reliable?
The price and inventory of OMAPL137BZKBD4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAPL137BZKBD4 is usually 5 days.
3.What payment methods are accepted for OMAPL137BZKBD4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAPL137BZKBD4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAPL137BZKBD4?
OMAPL137BZKBD4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAPL137BZKBD4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAPL137BZKBD4?
For technical support, including OMAPL137BZKBD4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAPL137BZKBD4 requirements.
6.How does Aetrix verify that OMAPL137BZKBD4 is sourced from the original manufacturer or authorized distributors?
All OMAPL137BZKBD4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAPL137BZKBD4 meets industry standards.
7.What is the process for return or replacement of OMAPL137BZKBD4?
All OMAPL137BZKBD4 units undergo pre-shipment inspection (PSI). If there is an issue with OMAPL137BZKBD4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAPL137BZKBD4 part is unused and in its original packaging.
Return procedure for OMAPL137BZKBD4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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