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Texas Instruments OMAPL137CZKB3
- Part No.:
- OMAPL137CZKB3
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 256-BGA
- Datasheet:
-
OMAPL137CZKB3.pdf
- Description:
- IC MPU OMAP-L1X 375MHZ 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,243
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Product details
Overview
OMAPL137CZKB3 from Texas Instruments is a dual-core low-power applications processor integrating a 375/456-MHz ARM926EJ-S RISC MPU and a 375/456-MHz TMS320C674x VLIW DSP, with 16KB instruction cache, 16KB data cache, 128KB shared RAM, and 256KB L2 unified RAM/cache. It targets audio-intensive embedded systems requiring real-time signal processing and rich OS support.
For engineers reviewing the OMAPL137CZKB3 datasheet, OMAPL137CZKB3 pinout, OMAPL137CZKB3 application, or OMAPL137CZKB3 equivalent, key selection criteria include dual-core clock scaling (1.2V/1.3V), 3.3-V LVCMOS I/O compatibility, EMAC + McASP + USB2.0 OTG peripheral integration, and 256-ball PBGA (ZKB) package constraints.
Technical Context
The OMAPL137CZKB3 implements a tightly coupled dual-subsystem architecture: the ARM926EJ-S handles OS execution, memory management (MMU with 1MB/64KB/4KB page support), and peripheral control, while the C674x DSP executes high-throughput fixed- and floating-point operations-including IEEE SP/DP multiply (2 SP×SP→SP per cycle), RCPxP/RSQRxP approximations, and mixed-precision arithmetic. Both cores share access to 128KB RAM and L2 memory via configurable partitioning.
Peripherals are distributed across dedicated buses: EMIFA supports NAND/NOR/SDRAM up to 128 MB; EMIFB handles higher-speed SDRAM up to 256 MB; three McASPs provide TDM/I2S/DIT-capable audio I/O with FIFO buffering; and the PRUSS adds deterministic real-time I/O control independent of main CPU load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual-core: 375/456-MHz ARM926EJ-S + 375/456-MHz C674x DSP - enables concurrent OS tasking and real-time signal processing without resource contention. |
| Memory Architecture | ARM: 16KB I-cache + 16KB D-cache + 8KB vector RAM + 64KB ROM; DSP: 32KB L1P + 32KB L1D + 256KB L2 unified RAM/cache - supports deterministic latency-critical code/data placement. |
| External Memory Interfaces | EMIFA: 8/16-bit NAND/NOR + 16-bit SDRAM (128 MB); EMIFB: 16/32-bit SDRAM (256 MB) - allows flexible boot-from-flash and high-bandwidth streaming buffer allocation. |
| Audio Peripherals | 3 × McASP with 16/12/4 serializers, FIFO buffers, TDM/I2S/DIT support - enables multi-channel professional audio I/O with sample-rate independence and jitter suppression. |
| Connectivity & Timing | 10/100-Mbps EMAC (RMII), USB2.0 OTG + USB1.1 OHCI, 3 × UART (1 with RTS/CTS), 2 × I2C, 2 × SPI, 2 × eQEP, 3 × eHRPWM - provides full-stack wired audio system interfacing and motor/sensor control. |
| Package & Power | 256-ball PBGA (ZKB), 17.0 mm × 17.0 mm, 1.0-mm pitch; core voltage 1.2V/1.3V, I/O voltage 3.3V (USB at 1.8V) - compatible with industrial PCB assembly and thermal management for sustained audio processing. |
Pinout & Package
OMAPL137CZKB3 uses a 256-ball Pb-free plastic ball grid array (PBGA) package with 1.0-mm ball pitch and 17.0 mm × 17.0 mm body size. Pin functions are multiplexed across six I/O banks supporting configurable voltage domains (3.3V general I/O, 1.8V USB).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.2V or 1.3V input for ARM/DSP logic; requires low-noise regulation and decoupling due to dynamic current draw during DSP compute bursts. |
| VDD_IO | I/O power supply | 3.3V supply for all general-purpose I/Os except USB; defines logic thresholds and drive strength for McASP, EMAC, UART, and GPIO interfaces. |
| USB0_VDDA12 | USB PHY analog supply | 1.2V analog rail for integrated USB2.0 OTG PHY; must be filtered with 0.22-μF capacitor per TI SPRS563G Section 3.7. |
| CLKIN | Primary clock input | Accepts 24-MHz crystal or external oscillator; feeds PLL subsystem generating core, memory, and peripheral clocks with programmable dividers/multipliers. |
| EMU0–EMU3 | JTAG emulation interface | IEEE 1149.1 boundary-scan pins for real-time debug, trace, and flash programming - essential for ARM/DSP co-debugging in audio firmware development. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | ARM926EJ-S runs Linux/RTOS for UI/network stack; C674x DSP offloads FFT, FIR, echo cancellation, and codec decode - eliminating need for discrete DSP co-processor. |
| McASP with DIT capability | McASP2 supports Digital Interface Transmitter (DIT) mode for S/PDIF output - enables direct connection to external DACs or AV receivers without external serializer hardware. |
| Programmable Real-Time Unit Subsystem (PRUSS) | Two 32-bit RISC PRU cores with 4KB IRAM + 512B DRAM each - handle time-critical PWM generation, encoder feedback, or GPIO bit-banging without ARM/DSP interrupt latency. |
| EDMA3 controller | 32 independent DMA channels + 8 QDMA channels - enables zero-CPU-overhead audio streaming between McASP FIFOs, DDR, and DSP memory with scatter-gather support. |
| Power management | Per-subsystem clock gating, software-controllable PRUSS disable, and multiple low-power states - reduces active power to <500 mW in typical audio playback use cases. |
Applications
| Home Theatre Audio Processor | Automotive Infotainment Head Unit |
|---|---|
|
Use Scenario: Multi-zone audio decoding, Dolby Digital/PCM mixing, and HDMI/SPDIF output in compact A/V receivers. IC Role / Device Role / Timing Role: Central SoC executing Linux-based media framework while C674x performs real-time 7.1-channel upmixing and speaker compensation. Use Value: Eliminates external audio DSP and SDRAM controller; McASP DIT and EMAC enable direct S/PDIF and network streaming without glue logic. |
Use Scenario: In-dash head unit supporting Bluetooth audio, USB media playback, and CAN-based vehicle telemetry display. IC Role / Device Role / Timing Role: ARM926EJ-S hosts Android Automotive OS and UI; C674x handles noise suppression, equalization, and voice command preprocessing. Use Value: Integrated USB2.0 OTG + McASP + CAN-compatible UARTs reduce BOM count; PRUSS manages CAN message timing and LED driver PWM independently. |
| Professional Audio Mixer | Network Streaming Soundbar |
|
Use Scenario: 16-channel digital mixer with real-time effects, AES67 streaming, and touchscreen UI. IC Role / Device Role / Timing Role: ARM core manages web UI and AES67 stack; DSP core executes 16-channel parametric EQ, dynamics processing, and sample-rate conversion. Use Value: Dual EMIF interfaces allow separate SDRAM for UI frame buffer and audio buffer pool; EMAC + McASP enable simultaneous network I/O and analog/digital audio I/O. |
Use Scenario: Wi-Fi-connected soundbar decoding Spotify Connect, AirPlay, and Chromecast streams with subwoofer crossover. IC Role / Device Role / Timing Role: ARM handles network stack and metadata parsing; DSP performs multi-band compression, bass extension, and room correction FIR filtering. Use Value: 128KB shared RAM buffers streaming data between network stack and audio pipeline; eHRPWM outputs drive Class-D amplifier gate drivers with dead-time control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core audio processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAPL138CZKB3 | Same package and pinout; adds 128KB additional L2 RAM (384KB total) and enhanced PRUSS with 8KB IRAM - no change to ARM/DSP clock speeds or peripheral set. | Better suited for applications requiring larger on-chip audio buffers or more complex PRU firmware (e.g., real-time protocol bridging). | Select OMAPL138CZKB3 when >256KB L2 RAM is required for low-latency audio buffering or PRU code size exceeds 4KB. |
| TMS320DM8148ZCE | Higher-performance ARM Cortex-A8 + C674x DSP; adds HD video encode/decode, PCIe, SATA, and dual-display support - larger 361-ball PBGA package. | Targets multimedia hubs combining audio, video, and UI rendering - not optimized for audio-only cost/power efficiency. | Choose TMS320DM8148ZCE only if video processing or PCIe connectivity is mandatory; otherwise OMAPL137CZKB3 offers superior audio-specific power/performance ratio. |
Compared with OMAPL137CZKB3, OMAPL138CZKB3 extends on-chip memory for deeper audio pipelines without layout changes, while TMS320DM8148ZCE trades audio optimization for broader multimedia capability at higher cost, power, and footprint.
Availability
OMAPL137CZKB3 is available at Aetrix Electronics and suitable for home theatre systems, automotive amplifiers, and professional audio equipment requiring stable component supply across extended temperature ranges (−40°C to +105°C).
Supply support for OMAPL137CZKB3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and wireless technologies, with over 50 years of leadership in DSP innovation and industrial-grade reliability.
The OMAP-L137 product line was designed specifically for low-power, high-fidelity audio applications - combining ARM software flexibility with C674x DSP computational precision to replace discrete audio SoCs in cost-sensitive consumer and automotive markets.
FAQ
What is the maximum operating frequency of the OMAPL137CZKB3 ARM and DSP cores?
The OMAPL137CZKB3 supports two speed grades: 375 MHz at 1.2V core voltage and 456 MHz at 1.3V core voltage for both the ARM926EJ-S and C674x DSP cores. Frequency selection is determined by silicon revision and power supply configuration - verified in SPRS563G Section 3.1 and Table 3-1. The OMAPL137CZKB3 must be operated within its specified voltage/frequency envelope to ensure timing compliance and thermal stability.
Does the OMAPL137CZKB3 support booting from NAND flash?
Yes, the OMAPL137CZKB3 supports NAND flash boot via its EMIFA interface with 8- or 16-bit data bus width. Boot ROM initializes the device and loads first-stage bootloader from NAND, including error correction handling. This capability is documented in SPRS563G Section 4.1 and Table 3-1 under "EMIFA" features. The OMAPL137CZKB3 does not require external boot ROM or FPGA configuration for NAND-based systems.
How many McASP modules does the OMAPL137CZKB3 include, and what audio formats do they support?
The OMAPL137CZKB3 integrates three multichannel audio serial ports (McASP0, McASP1, McASP2), each with independent clock zones, 28 serial data pins, and FIFO buffers. They support TDM, I2S, and similar formats; McASP2 additionally supports Digital Interface Transmitter (DIT) for S/PDIF output. These capabilities are confirmed in SPRS563G Sections 1.1, 1.3, and 6.16. The OMAPL137CZKB3 uses McASPs for simultaneous multi-channel input/output without external audio interface ICs.
Is the OMAPL137CZKB3 pin-compatible with other OMAP-L13x devices?
The OMAPL137CZKB3 shares the same 256-ball ZKB PBGA package and pinout with OMAPL138CZKB3, enabling drop-in replacement where increased L2 RAM (384KB vs. 256KB) or PRUSS enhancements are beneficial. However, it is not pin-compatible with OMAP-L132 or OMAP-L131 due to differing peripheral sets and ball assignments. Compatibility is explicitly stated in SPRS563G Section 3.2 and TI's OMAP-L13x migration guides.
What development tools are officially supported for OMAPL137CZKB3 firmware development?
Texas Instruments provides full toolchain support for OMAPL137CZKB3, including Code Composer Studio (CCS) IDE, C6000 DSP compiler, ARM GNU toolchain, Chip Support Library (CSL), DSP Library, and TI DSP/BIOS RTOS. Debugging uses JTAG via EMU0–EMU3 pins with XDS100v3 or XDS200 emulators. All tools are validated against SPRS563G and listed in TI's OMAP-L137 Tools & Software portal. Development for OMAPL137CZKB3 requires no third-party tool licensing.
OMAPL137CZKB3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 256-BGA
- Series:
- OMAP-L1x
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM926EJ-S
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 375MHz
- Co-Processors/DSP:
- Signal Processing; C674x, System Control; CP15
- RAM Controllers:
- SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-BGA (17x17)
- Additional Interfaces:
- HPI, I2C, McASP, MMC/SD, SPI, UART
OMAPL137CZKB3 FAQ
1.How can I place an order for OMAPL137CZKB3 through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAPL137CZKB3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAPL137CZKB3 reliable?
The price and inventory of OMAPL137CZKB3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAPL137CZKB3 is usually 5 days.
3.What payment methods are accepted for OMAPL137CZKB3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAPL137CZKB3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAPL137CZKB3?
OMAPL137CZKB3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAPL137CZKB3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAPL137CZKB3?
For technical support, including OMAPL137CZKB3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAPL137CZKB3 requirements.
6.How does Aetrix verify that OMAPL137CZKB3 is sourced from the original manufacturer or authorized distributors?
All OMAPL137CZKB3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAPL137CZKB3 meets industry standards.
7.What is the process for return or replacement of OMAPL137CZKB3?
All OMAPL137CZKB3 units undergo pre-shipment inspection (PSI). If there is an issue with OMAPL137CZKB3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAPL137CZKB3 part is unused and in its original packaging.
Return procedure for OMAPL137CZKB3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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