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Texas Instruments OMAPL137DZKB3
- Part No.:
- OMAPL137DZKB3
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 256-BGA
- Datasheet:
-
OMAPL137DZKB3.pdf
- Description:
- IC MPU OMAP-L1X 375MHZ 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,690
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Product details
Overview
OMAPL137DZKB3 from Texas Instruments is a dual-core low-power applications processor integrating a 375/456-MHz ARM926EJ-S RISC MPU and a 375/456-MHz TMS320C674x VLIW DSP, with 16KB instruction cache, 16KB data cache, 128KB shared RAM, and 256KB L2 unified RAM/cache. It targets real-time audio processing in resource-constrained embedded systems.
For engineers reviewing the OMAPL137DZKB3 datasheet, OMAPL137DZKB3 pinout, OMAPL137DZKB3 application, or OMAPL137DZKB3 equivalent, key selection criteria include dual-core clock scaling (1.2V/1.3V), 3.3-V LVCMOS I/O compatibility, EMAC+RMII Ethernet support, McASP audio interface capability, and 256-ball ZKB PBGA package constraints.
Technical Context
The OMAPL137DZKB3 implements a tightly coupled dual-subsystem architecture: the ARM926EJ-S executes Linux-capable control software with MMU, 16KB I/D caches, and 8KB vector RAM, while the C674x DSP handles real-time signal processing using a two-level cache hierarchy (32KB L1P, 32KB L1D, 256KB L2) and mixed-precision IEEE floating-point arithmetic.
Peripherals are partitioned across subsystems: EMAC, McASP, eHRPWM/eCAP/eQEP, USB2.0 OTG/USB1.1 OHCI, and dual external memory interfaces (EMIFA for NAND/NOR/SDRAM; EMIFB for high-speed SDRAM) operate under shared AHB/AXI interconnect with EDMA3 controller managing 32 independent DMA channels and 8 QDMA channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core: 375/456-MHz ARM926EJ-S + 375/456-MHz TMS320C674x VLIW DSP - enables concurrent OS execution and real-time audio algorithm offload |
| Memory | 16KB I-cache + 16KB D-cache (ARM); 32KB L1P + 32KB L1D + 256KB L2 (DSP); 128KB shared RAM - supports deterministic latency-critical buffering without external DRAM dependency |
| External Memory | EMIFA: 8/16-bit NAND/NOR, 16-bit SDRAM up to 128MB; EMIFB: 16/32-bit SDRAM up to 256MB - allows flexible boot media and high-bandwidth streaming buffer expansion |
| Audio Interface | 3× McASP with 16/12/4 serializers, FIFO buffers, TDM/I2S/DIT support - enables multi-channel professional audio I/O with sample-rate independence and jitter resilience |
| Connectivity | 10/100-Mbps EMAC with RMII + MDIO; USB2.0 OTG + USB1.1 OHCI; 2× I2C; 3× UART (one with RTS/CTS); 2× SPI - provides full networked audio endpoint capability including firmware updates and host control |
| Package | 256-ball Pb-free PBGA (ZKB), 17.0 mm × 17.0 mm, 1.0-mm ball pitch - standard industrial BGA footprint compatible with automated assembly and thermal management per JEDEC J-STD-020 |
| Supply Voltage | Core: 1.2V or 1.3V (frequency-dependent); I/O: 3.3V (LVCMOS), 1.8V (USB only) - requires dual-rail power sequencing with voltage tracking for safe startup and frequency scaling |
Pinout & Package
OMAPL137DZKB3 uses a 256-ball Pb-free plastic ball grid array (PBGA) package with 1.0-mm ball pitch and 17.0 mm × 17.0 mm body size (ZKB suffix). Pin functions are multiplexed across 8 GPIO banks and dedicated peripheral balls as defined in TI SPRS563G Section 3.6–3.7.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.2V or 1.3V input for ARM/DSP cores - must be independently regulated with tight tolerance (±3%) and low noise (<10 mVpp) |
| VDD_IO | I/O power supply | 3.3V supply for all LVCMOS I/O banks except USB - decoupling required per TI layout guidelines to prevent signal integrity degradation |
| USB0_VDDA12 | USB analog supply | 1.2V analog supply for USB0 PHY - recommended 0.22-μF capacitor per TI SPRS563G Rev JUNE 2014 to meet USB2.0 eye diagram compliance |
| CLKIN | Primary oscillator input | Accepts 24-MHz crystal or external clock - feeds PLL subsystem generating core, memory, and peripheral clocks with programmable dividers/multipliers |
| EMU0–EMU3 | JTAG emulation interface | IEEE 1149.1 boundary-scan test and debug access - required for ICE-RT real-time debugging of both ARM and DSP cores simultaneously |
| MCASP0_AXR0–AXR15 | McASP0 serial data lines | 16 configurable serial data pins supporting TDM frames up to 32 slots - enable simultaneous 8-channel playback + 8-channel capture at 48 kHz |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core asymmetric processing | ARM926EJ-S handles Linux kernel, file system, UI, and network stack; C674x DSP executes real-time FIR/IIR filters, FFTs, and codec algorithms with cycle-accurate timing |
| McASP with DIT capability | McASP2 supports Digital Interface Transmitter (DIT) mode for S/PDIF output - eliminates need for external transceiver in consumer audio digital output designs |
| eHRPWM with dead-band generation | Three enhanced PWM modules provide 16-bit time-base resolution and hardware dead-band insertion - suitable for Class-D amplifier gate drive with shoot-through prevention |
| EDMA3 with QDMA | 32 independent DMA channels + 8 quick-DMA channels offload CPU from memory-mapped peripheral transfers - reduces ARM/DSP interrupt load during high-bandwidth McASP or EMAC streaming |
| PRUSS programmable subsystem | Two 32-bit PRU cores with 4KB IRAM + 512B DRAM each - execute deterministic real-time tasks (e.g., GPIO-triggered capture, protocol bridging) without ARM/DSP intervention |
Applications
| Home Theatre Audio Processor | Automotive Infotainment Head Unit |
|---|---|
Use Scenario: Real-time Dolby Digital decoding, speaker EQ, and multi-zone audio routing in compact AV receivers. IC Role / Device Role / Timing Role: OMAPL137DZKB3 serves as main SoC executing Linux-based middleware while C674x DSP performs fixed-point audio decoding and channel mixing with sub-100 μs latency. Use Value: Dual-core architecture avoids external DSP co-processor, reducing BOM cost and PCB area while maintaining certified audio codec performance. |
Use Scenario: Integrated head unit supporting Bluetooth A2DP streaming, AM/FM tuner interface, and rear-seat entertainment display. IC Role / Device Role / Timing Role: OMAPL137DZKB3 acts as central multimedia hub - ARM runs Android Automotive OS and UI, DSP handles adaptive noise cancellation and voice enhancement algorithms. Use Value: McASP + eHRPWM + LCD controller integration enables single-chip audio/video subsystem, eliminating discrete audio codec and display driver ICs. |
| Network Streaming Audio Endpoint | Professional Audio DSP Platform |
Use Scenario: High-fidelity Wi-Fi audio streamer with DLNA/UPnP support and local FLAC/WAV playback from USB storage. IC Role / Device Role / Timing Role: OMAPL137DZKB3 functions as networked audio endpoint - EMAC+RMII handles Ethernet streaming; McASP drives DAC via I2S; USB hosts mass storage. Use Value: 128KB shared RAM buffers network packets and audio samples, enabling gapless playback without external SDRAM in cost-sensitive designs. |
Use Scenario: Rack-mountable digital mixer with 32-in/32-out AES3 and Dante-over-Ethernet I/O. IC Role / Device Role / Timing Role: OMAPL137DZKB3 operates as real-time audio engine - C674x DSP runs 128-point FFTs and dynamic range compression; EMAC+MDIO configures external PHYs for synchronized audio transport. Use Value: EDMA3 QDMA channels sustain 64-channel 96-kHz audio I/O over McASP and EMAC simultaneously without CPU overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core audio processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OMAPL138DZKB3 | Same ZKB package and pinout; adds 128KB on-chip SRAM and enhanced PRUSS with 8KB IRAM - higher memory bandwidth but identical peripheral set | Preferred for designs requiring larger on-die scratchpad memory for FFT buffers or firmware overlays without external RAM | Select OMAPL138DZKB3 when deterministic low-latency memory access outweighs cost premium; otherwise OMAPL137DZKB3 suffices for most audio endpoints |
| TMS320DM8148ZCE | Higher-performance ARM Cortex-A8 + C674x DSP; 1GHz ARM, 720MHz DSP; includes HDVICP2 video coprocessor - not pin-compatible, larger 484-BGA package | Suitable for video-audio convergence (e.g., smart displays), but over-spec for pure audio applications due to higher power and cost | Choose TMS320DM8148ZCE only if video decode acceleration or >456-MHz DSP throughput is required; OMAPL137DZKB3 remains optimal for audio-first designs |
Compared with OMAPL137DZKB3, OMAPL138DZKB3 offers incremental on-chip memory headroom without layout changes, while TMS320DM8148ZCE delivers significantly higher compute density at the expense of power, cost, and board space - making OMAPL137DZKB3 the balanced choice for cost-sensitive, thermally constrained audio SoCs.
Availability
OMAPL137DZKB3 is available at Aetrix Electronics and suitable for home theatre systems, automotive infotainment units, and networked audio endpoints requiring stable component supply across extended product lifecycles.
Supply support for OMAPL137DZKB3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing and manufacturing analog, embedded processing, and wireless chips for industrial, automotive, and consumer markets.
OMAPL137DZKB3 belongs to TI's OMAP-L13x low-power applications processor family, engineered specifically for audio-centric embedded systems requiring real-time DSP performance with ARM-based OS support and minimal power consumption.
FAQ
What is the maximum operating frequency of the OMAPL137DZKB3 ARM and DSP cores?
The OMAPL137DZKB3 supports two frequency grades: 375 MHz at 1.2V core voltage and 456 MHz at 1.3V core voltage for both the ARM926EJ-S and TMS320C674x cores. Frequency selection is determined by silicon revision and voltage rail configuration - the 456-MHz operation requires strict 1.3V ±3% regulation and thermal derating above 70°C ambient.
Does the OMAPL137DZKB3 support booting from NAND flash?
Yes, the OMAPL137DZKB3 supports NAND flash boot via its EMIFA interface with 8-bit or 16-bit bus width. The device includes a ROM bootloader that initializes NAND controller, reads first-stage loader (X-loader) from configured NAND pages, and passes execution to user-defined second-stage software - documented in TI SPRS563G Section 4.1.
Can the McASP peripherals on the OMAPL137DZKB3 be used for S/PDIF output?
Yes, McASP2 on the OMAPL137DZKB3 includes Digital Interface Transmitter (DIT) capability, enabling direct S/PDIF coaxial or optical output without external transceivers. This function requires specific register configuration of the DIT block and proper clock domain alignment between McASP bit clock and S/PDIF frame rate - detailed in TI SPRS563G Section 6.16.
What power supply sequencing is required for reliable OMAPL137DZKB3 startup?
The OMAPL137DZKB3 requires controlled power-up sequence: VDD_IO must be stable before VDD_CORE, and both must be within specification before releasing reset. TI recommends using a power management IC with programmable delay (e.g., TPS65023) to enforce tPU ≥ 100 μs between VDD_IO and VDD_CORE ramp - failure to observe this risks undefined state or boot failure per SPRS563G Section 5.4.
Is the OMAPL137DZKB3 pin-compatible with other OMAP-L13x variants like OMAPL137DZKBA?
No, OMAPL137DZKB3 is not pin-compatible with OMAPL137DZKBA. While both use the ZKB 256-ball PBGA package, the 'A' suffix denotes an earlier silicon revision with different electrical characteristics and undocumented pin function changes - TI explicitly states in SPRS563G Section 3.2 that "device compatibility applies only within same suffix group" and advises against PCB reuse across suffix variants.
OMAPL137DZKB3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 256-BGA
- Series:
- OMAP-L1x
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM926EJ-S
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 375MHz
- Co-Processors/DSP:
- Signal Processing; C674x, System Control; CP15
- RAM Controllers:
- SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- 0°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-BGA (17x17)
- Additional Interfaces:
- HPI, I2C, McASP, MMC/SD, SPI, UART
OMAPL137DZKB3 FAQ
1.How can I place an order for OMAPL137DZKB3 through Aetrix?
Please submit a Request for Quotation (RFQ) for OMAPL137DZKB3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OMAPL137DZKB3 reliable?
The price and inventory of OMAPL137DZKB3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAPL137DZKB3 is usually 5 days.
3.What payment methods are accepted for OMAPL137DZKB3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAPL137DZKB3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OMAPL137DZKB3?
OMAPL137DZKB3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OMAPL137DZKB3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OMAPL137DZKB3?
For technical support, including OMAPL137DZKB3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAPL137DZKB3 requirements.
6.How does Aetrix verify that OMAPL137DZKB3 is sourced from the original manufacturer or authorized distributors?
All OMAPL137DZKB3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAPL137DZKB3 meets industry standards.
7.What is the process for return or replacement of OMAPL137DZKB3?
All OMAPL137DZKB3 units undergo pre-shipment inspection (PSI). If there is an issue with OMAPL137DZKB3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OMAPL137DZKB3 part is unused and in its original packaging.
Return procedure for OMAPL137DZKB3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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