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Texas Instruments OMAPL137DZKBT3

Part No.:
OMAPL137DZKBT3
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
256-BGA
Datasheet:
AetrixOMAPL137DZKBT3.pdf
Description:
IC MPU OMAP-L1X 375MHZ 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,250

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Product details

Overview

OMAPL137DZKBT3 from Texas Instruments is a dual-core low-power applications processor integrating a 375/456-MHz ARM926EJ-S RISC MPU and a 375/456-MHz TMS320C674x VLIW DSP core, with 16KB instruction cache, 16KB data cache, 128KB shared RAM, and 256KB L2 unified RAM/cache. It targets real-time audio processing in resource-constrained embedded systems requiring deterministic DSP compute and rich OS support.

For engineers reviewing the OMAPL137DZKBT3 datasheet, OMAPL137DZKBT3 pinout, OMAPL137DZKBT3 application, or OMAPL137DZKBT3 equivalent, key selection criteria include dual-core clock scaling (1.2V/1.3V), 256-ball PBGA (ZKB) package compatibility, McASP audio interface timing, EMAC RMII Ethernet integration, and PRUSS real-time peripheral control capability.

Technical Context

The OMAPL137DZKBT3 implements a tightly coupled dual-subsystem architecture: the ARM926EJ-S executes Linux or RTOS-based system control and UI tasks using ARMv5TEJ instructions, MMU, and 16KB I/D caches, while the C674x DSP handles real-time signal processing with IEEE SP/DP floating-point, 32KB L1P/L1D caches, and 256KB L2 unified memory. Both subsystems share 128KB RAM and access peripherals via a configurable AHB/AXI interconnect.

Peripherals are partitioned across two external memory interfaces (EMIFA for NAND/NOR/SDRAM; EMIFB for high-speed SDRAM), three McASPs supporting TDM/I2S/DIT with FIFO buffering, dual USB (2.0 OTG + 1.1 OHCI), 10/100 EMAC with RMII, and programmable PRUSS for hardware-accelerated I/O timing - all synchronized under a unified PSC power-gating domain.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual-core: 375/456-MHz ARM926EJ-S + 375/456-MHz C674x VLIW DSP - enables concurrent OS execution and real-time audio algorithm offload.
Memory 16KB I-cache + 16KB D-cache (ARM); 32KB L1P + 32KB L1D + 256KB L2 (DSP); 128KB shared RAM - supports low-latency cache-coherent data exchange between cores.
Audio Interface 3× McASP with 16/12/4 serializers, FIFO buffers, TDM/I2S/DIT support - delivers multi-channel digital audio I/O for A/V receivers and soundbars without external codec buffering.
Connectivity 10/100 EMAC (RMII), USB 2.0 OTG + USB 1.1 OHCI, 2× I2C, 3× UART (one with RTS/CTS), 2× SPI - provides full network, host, and peripheral control in compact audio systems.
Real-Time Peripherals PRUSS with two 32-bit RISC cores, 3× eHRPWM, 3× eCAP, 2× eQEP - enables precise PWM-driven amplifier control, encoder feedback, and hardware-timed GPIO without CPU intervention.
Package 256-ball PBGA (ZKB), 17.0 mm × 17.0 mm, 1.0-mm ball pitch - matches standard BGA reflow profiles and supports high-density PCB layouts for consumer audio modules.
Supply Voltage Core: 1.2V (375 MHz) or 1.3V (456 MHz); I/O: 3.3V (LVCMOS), 1.8V (USB only) - requires dual-rail power design with independent core/I/O regulation.

Pinout & Package

OMAPL137DZKBT3 uses a 256-ball Pb-free plastic BGA (PBGA) package with ZKB suffix, 17.0 mm × 17.0 mm body size and 1.0-mm ball pitch. Pin functions follow TI's OMAP-L137 pin assignment specification (SPRS563G, Section 3.6–3.7), with multiplexed I/O supporting dynamic peripheral configuration.

Pin/Terminal Circuit Role Design Meaning
CLKIN Clock Input Accepts 24-MHz crystal or external oscillator for PLL reference; enables frequency synthesis for ARM/DSP/peri clocks.
USB0_VDDA12 Analog USB PHY Supply 1.2-V supply for integrated USB 2.0 OTG PHY; requires 0.22-μF decoupling per TI spec to ensure signal integrity.
EMAC_RXD[3:0] Ethernet Receive Data 4-bit RMII receive bus; must be length-matched to EMAC_REF_CLK for <1.5-ns skew to meet IEEE 802.3 timing.
MCASP0_AXR[15:0] McASP0 Serial Data 16-bit bidirectional serial data lines for TDM/I2S; supports up to 384-kbps sample rates with programmable frame sync.
HPI_A[15:0] Host-Port Interface Bus 16-bit multiplexed address/data bus for high-bandwidth host CPU access to internal memory/peripherals without ARM/DSP arbitration.

Key Features

Feature Design Value
Dual-core clock scaling ARM and DSP operate at identical frequencies (375 or 456 MHz) with shared PLL control - simplifies thermal management and power sequencing.
McASP FIFO buffering Transmit/receive FIFOs per McASP channel reduce CPU/DMA overhead for continuous audio streaming - enables gapless playback at 192-kHz/24-bit.
PRUSS real-time I/O Two independent 32-bit RISC PRU cores with dedicated interrupt controller and switched central resource - execute time-critical PWM, capture, or protocol logic without ARM/DSP context switching.
EDMA3 engine 32 independent DMA channels + 8 QDMA channels - enables zero-copy audio data movement between McASP, memory, and DSP L2 without CPU load.
EMAC RMII interface Integrated 10/100 Ethernet MAC with RMII physical layer support - eliminates external PHY for cost-sensitive networked audio devices.

Applications

A/V Receivers Home Theatre Systems

Use Scenario: Multi-zone audio decoding, HDMI audio extraction, and speaker-level DSP processing in compact home entertainment hubs.

IC Role / Device Role / Timing Role: OMAPL137DZKBT3 serves as main SoC - ARM runs Linux-based UI and network stack; C674x executes Dolby/DTS decode and room correction algorithms in real time.

Use Value: Integrated McASP and PRUSS eliminate external audio interface ICs; 128KB shared RAM enables low-latency buffer handoff between ARM and DSP threads.

Use Scenario: Synchronized multi-room audio distribution with local DSP tuning and wireless streaming (AirPlay, Chromecast Audio).

IC Role / Device Role / Timing Role: OMAPL137DZKBT3 acts as streaming endpoint and real-time audio processor - EMAC and USB handle network/audio input; McASP drives DACs with sub-10-μs jitter.

Use Value: Dual-core architecture allows concurrent streaming stack (ARM) and sample-rate conversion (DSP) without buffer underrun - critical for gapless multi-format playback.

Automotive Amplifiers Professional Audio

Use Scenario: High-fidelity Class-D amplifier control with CAN bus diagnostics, thermal monitoring, and adaptive EQ based on cabin acoustics.

IC Role / Device Role / Timing Role: OMAPL137DZKBT3 functions as amplifier controller - PRUSS manages PWM generation and fault detection; ARM handles CAN messaging and firmware updates.

Use Value: PRUSS trip-zone inputs and eHRPWM dead-band generation enable safe, fast-switching Class-D gate drive without software latency.

Use Scenario: Rack-mounted digital mixer with 32-channel I/O, real-time effects processing, and AES67 network audio transport.

IC Role / Device Role / Timing Role: OMAPL137DZKBT3 operates as audio processing node - McASP2 DIT mode transmits AES3 signals; EMAC supports AVB/PTP synchronization.

Use Value: Three McASPs with independent clock zones allow simultaneous AES3, I2S, and TDM streams - eliminates need for external serializer/deserializer chips.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core audio processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
OMAPL138DZKBT3 Same package and pinout; adds 128KB additional L2 RAM (384KB total) and enhanced PRUSS with 8KB instruction RAM per core. Better suited for complex multi-algorithm audio stacks requiring larger on-chip memory footprint and deeper real-time firmware. Select OMAPL138DZKBT3 when McASP channel count remains identical but L2 memory headroom or PRU code space is insufficient on OMAPL137DZKBT3.
TMS320C6748ZWT Single-core C674x DSP (456 MHz), no ARM; 128KB RAM, 256KB L2, same 256-BGA package but different pin mapping and peripheral set (no McASP, no EMAC). Targeted at pure DSP workloads (e.g., acoustic echo cancellation) without OS-level UI or network stack requirements. Choose TMS320C6748ZWT only if application omits ARM-dependent functions (Linux, USB host, Ethernet) and relies solely on C674x compute.

Compared with OMAPL137DZKBT3, OMAPL138DZKBT3 offers expanded on-chip memory for larger audio frameworks, while TMS320C6748ZWT sacrifices ARM functionality for lower cost and power in DSP-only roles - neither is pin-compatible without PCB redesign.

Availability

OMAPL137DZKBT3 is available at Aetrix Electronics and suitable for A/V receivers, home theatre systems, and automotive amplifiers requiring stable component supply across extended product lifecycles.

Supply support for OMAPL137DZKBT3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with leadership in low-power signal processing and industrial-grade SoCs.

The OMAP-L137 product line was designed for cost-sensitive, thermally constrained audio and multimedia applications requiring deterministic real-time DSP performance alongside robust OS support - bridging the gap between general-purpose processors and dedicated DSPs.

FAQ

What is the maximum operating frequency of the OMAPL137DZKBT3?

The OMAPL137DZKBT3 operates at either 375 MHz (with 1.2-V core supply) or 456 MHz (with 1.3-V core supply), as specified in the SPRS563G datasheet Section 3.1. Both the ARM926EJ-S and C674x DSP cores scale synchronously to the same frequency, and thermal validation confirms stable operation within commercial and industrial temperature ranges at these speeds.

Does the OMAPL137DZKBT3 support IEEE 802.3 Ethernet?

Yes, the OMAPL137DZKBT3 integrates a 10/100 Mbps Ethernet MAC (EMAC) compliant with IEEE 802.3, supporting both half- and full-duplex modes over RMII. It includes an MDIO module for external PHY configuration and requires no external MAC controller - the EMAC block is fully functional as described in Section 6.14 of the SPRS563G datasheet.

How many McASP interfaces does the OMAPL137DZKBT3 provide, and what audio formats do they support?

The OMAPL137DZKBT3 provides three multichannel audio serial ports (McASP0–McASP2), each supporting TDM, I2S, and similar formats with configurable clock zones and FIFO buffering. McASP2 additionally supports DIT mode for AES3 transmission. Each McASP has 16/12/4 serializers and independent transmit/receive data pins, enabling concurrent multi-format audio I/O as documented in Section 6.16.

Is the OMAPL137DZKBT3 pin-compatible with other OMAP-L13x devices?

The OMAPL137DZKBT3 shares the same 256-ball ZKB PBGA package and pinout with OMAPL138DZKBT3, enabling drop-in replacement where increased L2 RAM and PRUSS enhancements are acceptable. However, it is not pin-compatible with OMAPL132 or OMAPL131 due to differing peripheral allocations and ball function mappings - verified against TI's mechanical packaging documentation (Section 8.2).

What development tools are supported for the OMAPL137DZKBT3?

Texas Instruments provides full toolchain support for OMAPL137DZKBT3, including C compilers for ARM and C674x DSP, DSP assembly optimizer, Code Composer Studio IDE, and Windows debugger interface. Chip Support Library (CSL) and DSP Library deliver optimized drivers for McASP, EMAC, PRUSS, and EDMA3 - all referenced in Section 1.1 and Section 7 of the SPRS563G datasheet.

OMAPL137DZKBT3 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
256-BGA
Series:
OMAP-L1x
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
-
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (17x17)
Additional Interfaces:
HPI, I2C, McASP, MMC/SD, SPI, UART

OMAPL137DZKBT3 FAQ

1.How can I place an order for OMAPL137DZKBT3 through Aetrix?

Please submit a Request for Quotation (RFQ) for OMAPL137DZKBT3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OMAPL137DZKBT3 reliable?

The price and inventory of OMAPL137DZKBT3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OMAPL137DZKBT3 is usually 5 days.

3.What payment methods are accepted for OMAPL137DZKBT3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OMAPL137DZKBT3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OMAPL137DZKBT3?

OMAPL137DZKBT3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OMAPL137DZKBT3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OMAPL137DZKBT3?

For technical support, including OMAPL137DZKBT3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OMAPL137DZKBT3 requirements.

6.How does Aetrix verify that OMAPL137DZKBT3 is sourced from the original manufacturer or authorized distributors?

All OMAPL137DZKBT3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OMAPL137DZKBT3 meets industry standards.

7.What is the process for return or replacement of OMAPL137DZKBT3?

All OMAPL137DZKBT3 units undergo pre-shipment inspection (PSI). If there is an issue with OMAPL137DZKBT3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OMAPL137DZKBT3 part is unused and in its original packaging.

Return procedure for OMAPL137DZKBT3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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