Texas Instruments OMAPL138EZWTD4RW

Overview

OMAPL138EZWTD4RW from Texas Instruments is a dual-core C6000™ DSP + ARM® SoC integrating a 456-MHz ARM926EJ-S RISC MPU and a 456-MHz C674x VLIW DSP, with 256KB L2 unified RAM/cache, 128KB shared RAM, and support for DDR2/mDDR, EMAC, USB 2.0 OTG, SATA I/II, and PRUSS - deployed in industrial automation, smart grid protection, and remote radio units.

For engineers reviewing the OMAPL138EZWTD4RW datasheet, OMAPL138EZWTD4RW pinout, OMAPL138EZWTD4RW application, or OMAPL138EZWTD4RW equivalent, key selection considerations include dual-core clock synchronization, secure boot (AES-128/SHA-256), 361-ball PBGA package pitch compatibility, and peripheral coexistence constraints across EMIFA, McASP, and VPIF.

Technical Context

The OMAPL138EZWTD4RW implements a tightly coupled heterogeneous architecture: the ARM926EJ-S core handles OS services and UI tasks using 16KB I-cache and 16KB D-cache, while the C674x DSP executes real-time signal processing with 32KB L1P/L1D RAM/cache and IEEE SP/DP floating-point support. Both cores share access to 256KB L2 memory and 128KB dedicated shared RAM.

System-level coordination is managed via EDMA3 (64 independent channels), PRUSS (two 32-bit RISC coprocessors with 4KB IRAM each), and hardware-assisted SATA NCQ (32-entry queue). Clocking uses dual PLLs with configurable dividers, and security relies on TI Basic Secure Boot with device-specific 128-bit cipher key generation.

Key Specifications

Pinout & Package

OMAPL138EZWTD4RW is housed in a 361-ball NFBGA package with 0.80-mm ball pitch and 16.0 mm × 16.0 mm body size (ZWT suffix). The package supports 1.8-V or 3.3-V LVCMOS I/Os (excluding USB and DDR2 interfaces) and requires precise thermal management per TI's ZWT thermal data (θ_JA = 26.5°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core DSP+ARM applications.

Compared with OMAPL138ZCE, OMAPL138EZWTD4RW offers identical functionality but requires larger PCB pad spacing (0.80 mm vs. 0.65 mm), while AM1808ZCE0 eliminates DSP resources entirely - simplifying software development but removing capability for closed-loop control or spectral analysis.

Availability

OMAPL138EZWTD4RW is available at Aetrix Electronics and suitable for industrial automation, smart grid protection, and remote radio unit designs requiring stable component supply across extended product lifecycles.

Supply support for OMAPL138EZWTD4RW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company designing analog ICs, embedded processors, and digital signal processors for industrial, automotive, and communications markets.

The OMAP-L138 product line targets low-power, high-integration applications demanding both general-purpose computing and real-time signal processing - especially in infrastructure equipment where thermal efficiency and peripheral richness are critical.

FAQ

What is the maximum operating frequency of the OMAPL138EZWTD4RW?

The OMAPL138EZWTD4RW operates at 456 MHz for both the ARM926EJ-S core and the C674x DSP core when supplied with 1.3V core voltage. This frequency is validated under industrial temperature range (–40°C to 85°C) and requires adherence to TI's recommended power-on hours and thermal derating curves per SPRS586J Section 5.3.

Does the OMAPL138EZWTD4RW support secure boot, and what algorithms are used?

Yes, the OMAPL138EZWTD4RW implements TI Basic Secure Boot using AES-128 for boot image encryption and SHA-256 for authentication. A device-specific 128-bit cipher key, generated by an NIST-800-22 certified RNG, protects user keys - ensuring that only cryptographically signed firmware loads into the OMAPL138EZWTD4RW at power-on.

What package type and dimensions does the OMAPL138EZWTD4RW use?

The OMAPL138EZWTD4RW uses a 361-ball NFBGA package with 0.80-mm ball pitch and a 16.0 mm × 16.0 mm body size (ZWT suffix). Its thermal characteristics - including θ_JA = 26.5°C/W - are documented in TI's SPRS586J Section 8.2 and require 6-layer PCB with dedicated ground/power planes for reliable 456-MHz operation.

Can the OMAPL138EZWTD4RW interface directly with DDR2 SDRAM, and what are the key timing requirements?

Yes, the OMAPL138EZWTD4RW integrates a dedicated DDR2/mDDR memory controller supporting 16-bit bus width and 256MB address space. Key timing requirements include 150–156 MHz clock frequency, on-die termination calibration, and strict trace length matching (±5 mm) for DQ/DQS groups - all specified in SPRS586J Section 6.11.

How many independent DMA channels does the OMAPL138EZWTD4RW provide, and what is their primary use case?

The OMAPL138EZWTD4RW features an Enhanced Direct Memory Access Controller 3 (EDMA3) with 64 independent DMA channels and 16 Quick DMA channels. These are primarily used to offload data movement between peripherals (e.g., McASP audio buffers, EMAC descriptors, VPIF frame buffers) and internal memory - enabling zero-CPU-overhead streaming in OMAPL138EZWTD4RW-based machine vision or telecom systems.