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Texas Instruments OPA1633DGNR
- Part No.:
- OPA1633DGNR
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 8-PowerTSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
OPA1633DGNR.pdf
- Description:
- IC DIFFERENTIAL 1 CIRCUIT 8TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,789
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Product details
Overview
OPA1633DGNR from Texas Instruments is a fully differential audio operational amplifier designed to drive high-performance audio ADCs (e.g., PCM1804) or serve as a predriver for Class-D amplifiers. It delivers 132 dB THD+N at 1 kHz, 1.1 nV/√Hz input voltage noise, 80 V/μs slew rate, and operates from ±2.5 V to ±17.5 V supplies in an HVSSOP-8 PowerPAD™ package.
For engineers reviewing the OPA1633DGNR datasheet, OPA1633DGNR pinout, OPA1633DGNR application, or OPA1633DGNR equivalent, this page provides verified specifications, thermal-aware package details, differential signal conversion capability, shutdown functionality, and real-world audio system integration guidance - all specific to the DGN (HVSSOP-8) variant.
Technical Context
The OPA1633DGNR implements a voltage-feedback fully differential architecture with independent VOCM control, enabling precise single-ended-to-differential conversion while suppressing even-order harmonics and common-mode noise. Its internal output buffers support rail-to-rail differential swing up to 40 VPP into 2 kΩ with <0.01% THD.
It features active-high enable logic referenced to V−, with defined turn-on (0.12 μs) and turn-off (0.03 μs) delays, and integrates a thermally enhanced HVSSOP-8 PowerPAD™ package requiring soldered thermal pad connection to ground or power plane for junction temperature control - RθJB = 30.0 °C/W confirmed.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| THD+N | 132 dB at 1 kHz, 3 VRMS, RL = 2 kΩ - enables ultra-low distortion professional audio signal chains |
| Input Voltage Noise | 1.1 nV/√Hz at 10 kHz - preserves dynamic range in low-level microphone and instrument preamp stages |
| Slew Rate | 80 V/μs - supports clean transient response for wideband audio signals up to 200 MHz small-signal bandwidth |
| Supply Range | ±2.5 V to ±17.5 V dual supply - accommodates line-level, mic-level, and high-headroom studio applications |
| Shutdown Current | 0.77 mA at ±5 V - reduces idle power in multi-channel systems without compromising startup latency |
| Junction-to-Board Thermal Resistance | 30.0 °C/W (HVSSOP-8) - mandates thermal pad soldering to PCB ground plane for reliable >100 mW dissipation |
| Enable Threshold | VEN > (V−) + 1.45 V for activation - ensures robust logic-level compatibility with analog system control rails |
Pinout & Package
HVSSOP-8 PowerPAD™ package (3 mm × 4.9 mm), thermally enhanced with exposed bottom thermal pad electrically isolated but requiring solder connection to PCB ground or power plane for thermal management (RθJB = 30.0 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN− (1) | Negative input | Differential input node; matched impedance critical for balance error < −80 dB |
| VOCM (2) | Output common-mode control | DC bias reference input; sets average output voltage (e.g., 2.5 V for PCM1804 interface) |
| V+ (3) | Positive supply | Connects to +VS rail; requires local 10 nF ceramic bypass to ground |
| OUT+ (4) | Positive differential output | Delivers inverted-phase signal relative to OUT−; drives one leg of balanced ADC input |
| OUT− (5) | Negative differential output | Delivers non-inverted-phase signal; forms true differential pair with OUT+ |
| V− (6) | Negative supply | Connects to −VS rail; reference for Enable threshold and internal biasing |
| Enable (7) | Active-high shutdown control | Logic input referenced to V−; floating defaults to enabled via internal pullup |
| IN+ (8) | Positive input | Differential input node; used with IN− for balanced input or alone for single-ended input |
Key Features
| Feature | Design Value |
|---|---|
| Fully differential architecture | Converts single-ended inputs to balanced differential outputs with >100 dB CMRR, reducing even-order harmonics and EMI susceptibility |
| Ultra-low THD+N | 132 dB at 1 kHz enables transparent signal reproduction in mastering-grade audio paths |
| Thermally optimized HVSSOP-8 | PowerPAD™ thermal pad lowers junction-to-board resistance to 30.0 °C/W - essential for sustained 85°C ambient operation |
| Programmable VOCM | Allows direct DC bias setting of differential output common-mode voltage (e.g., 2.5 V for PCM1804 ADC interface) |
| Fast enable/disable timing | 0.12 μs turn-on / 0.03 μs turn-off delays support dynamic channel muting in multi-channel mixers |
Applications
| Professional Audio ADC Driver | Studio Microphone Preamp |
|---|---|
Use Scenario: Driving the differential input of PCM1804 or similar high-resolution audio ADCs in recording interfaces. IC Role / Device Role / Timing Role: Fully differential voltage buffer and level shifter, converting line/mic-level signals to matched differential pairs with precise VOCM control. Use Value: Achieves 132 dB THD+N and 1.1 nV/√Hz noise floor - preserving full 24-bit dynamic range without dithering. |
Use Scenario: Low-noise gain stage for condenser microphones in broadcast mixing consoles. IC Role / Device Role / Timing Role: Single-ended input → differential output converter with programmable common-mode offset for phantom-powered front ends. Use Value: Enables >130 dB SNR with 2 kΩ load and ±12 V supplies - meeting EBU R68 broadcast linearity requirements. |
| Class-D Amplifier Predriver | High-Fidelity Soundbar Signal Chain |
Use Scenario: Generating balanced gate-drive signals for half-bridge MOSFETs in compact Class-D amplifiers. IC Role / Device Role / Timing Role: High-slew-rate differential driver with fast settling (30 ns to 0.1%) ensuring accurate PWM edge fidelity. Use Value: 80 V/μs slew rate and 200 MHz bandwidth minimize switching distortion in 300–500 kHz modulation schemes. |
Use Scenario: Main stereo channel driver in premium soundbars requiring minimal external components and low heat generation. IC Role / Device Role / Timing Role: Dual-channel-capable FDA providing differential output to integrated DAC/amp ICs with shared VOCM reference. Use Value: HVSSOP-8 PowerPAD™ package enables 1.5 W dissipation in 12 mm × 12 mm board area - eliminating need for heatsinks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fully differential amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| OPA1632DGNR | Lower slew rate (35 V/μs), lower bandwidth (110 MHz), no shutdown pin - pin-compatible but not functionally identical | Lacks enable control and thermal performance margin; unsuitable for high-headroom or power-gated designs | Select only if legacy design reuse is required and shutdown, speed, or thermal headroom are not needed |
| THS4561IRGET | Higher quiescent current (22 mA vs 13.2 mA), lower THD+N (128 dB), same HVSSOP-8 package - not pin-compatible | Requires PCB redesign; better suited for DC-coupled instrumentation than AC-coupled audio | Prefer when ultra-low offset drift (±0.3 μV/°C) outweighs audio-specific noise and distortion performance |
Compared with OPA1632DGNR, the OPA1633DGNR adds shutdown control, doubles slew rate, improves THD+N by 4 dB, and enhances thermal dissipation - making it superior for new audio system designs. Versus THS4561IRGET, OPA1633DGNR delivers lower noise, higher linearity, and lower power - at the cost of slightly less precision DC performance.
Availability
OPA1633DGNR is available at Aetrix Electronics and suitable for professional audio mixer development, studio microphone preamplifier design, and high-fidelity soundbar production requiring stable component supply and long-term manufacturability.
Supply support for OPA1633DGNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with over 50 years of innovation in precision amplifiers and audio signal chain solutions.
The OPA1633 belongs to TI's OPA high-fidelity audio op amp family, engineered specifically for professional audio equipment where ultra-low distortion, wide bandwidth, and thermal reliability are mandatory - not general-purpose signal conditioning.
FAQ
What is the maximum safe operating junction temperature for OPA1633DGNR?
The absolute maximum junction temperature for OPA1633DGNR is 150°C. However, for reliable long-term operation in professional audio applications, TI specifies operation up to +85°C ambient. The HVSSOP-8 PowerPAD™ package achieves RθJB = 30.0 °C/W only when the thermal pad is properly soldered to a PCB ground plane - failure to do so risks exceeding TJmax under 100 mW dissipation.
Can OPA1633DGNR operate from a single 5-V supply?
Yes, OPA1633DGNR supports single-supply operation from 4 V to 35 V per the Recommended Operating Conditions table. At 5 V, the output swing is limited to approximately 1.9 V below each rail (i.e., ~1.1 V to ~3.9 V), and shutdown current drops to 0.77 mA. VOCM must be set within the valid common-mode range - typically mid-rail (2.5 V) - using a low-impedance source.
How does the VOCM pin affect differential output balance in OPA1633DGNR?
The VOCM pin directly sets the average DC voltage of the differential outputs (VOUT+ + VOUT−)/2. Incorrect VOCM voltage or high-impedance source causes output imbalance, increasing common-mode error and degrading CMRR and THD+N. TI recommends buffering VOCM with a low-noise op amp (e.g., OPA134) and bypassing with 0.1 µF to ground - as shown in the PCM1804 reference design.
Is OPA1633DGNR pin-compatible with OPA1632DGNR?
Yes, OPA1633DGNR and OPA1632DGNR share identical HVSSOP-8 pinouts and footprint, including VOCM, Enable, and differential I/O assignments. However, OPA1633DGNR adds functional shutdown capability and improved AC performance - meaning OPA1632DGNR can be replaced by OPA1633DGNR in most layouts, but not vice versa without circuit modification.
What layout practices are mandatory for thermal reliability of OPA1633DGNR?
For thermal reliability, the OPA1633DGNR's exposed thermal pad must be soldered to a solid copper ground or power plane using five 13-mil vias - not webbed connections - with full circumferential plating. TI's SLMA002 technical brief confirms this prevents junction temperatures exceeding 150°C at 100 mW dissipation. Avoid floating the pad or using insufficient solder paste volume.
OPA1633DGNR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-PowerTSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- Standard
- Number of Circuits:
- 1
- Output Type:
- Differential
- Slew Rate:
- 80V/µs
- Gain Bandwidth Product:
- 200 MHz
- -3db Bandwidth:
- 200 MHz
- Current - Input Bias:
- 6.8 µA
- Voltage - Input Offset:
- 200 µV
- Current - Supply:
- 11mA
- Current - Output / Channel:
- 85 mA
- Voltage - Supply Span (Min):
- 4 V
- Voltage - Supply Span (Max):
- 35 V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-HVSSOP
OPA1633DGNR FAQ
1.How can I place an order for OPA1633DGNR through Aetrix?
Please submit a Request for Quotation (RFQ) for OPA1633DGNR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for OPA1633DGNR reliable?
The price and inventory of OPA1633DGNR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OPA1633DGNR is usually 5 days.
3.What payment methods are accepted for OPA1633DGNR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OPA1633DGNR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for OPA1633DGNR?
OPA1633DGNR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your OPA1633DGNR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for OPA1633DGNR?
For technical support, including OPA1633DGNR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OPA1633DGNR requirements.
6.How does Aetrix verify that OPA1633DGNR is sourced from the original manufacturer or authorized distributors?
All OPA1633DGNR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OPA1633DGNR meets industry standards.
7.What is the process for return or replacement of OPA1633DGNR?
All OPA1633DGNR units undergo pre-shipment inspection (PSI). If there is an issue with OPA1633DGNR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The OPA1633DGNR part is unused and in its original packaging.
Return procedure for OPA1633DGNR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
OPA1633DGNR Tags
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