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Texas Instruments OPA211AIDRG4

Part No.:
OPA211AIDRG4
Manufacturer:
Texas Instruments
Category:
Instrumentation, Op Amps, Buffer Amps
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixOPA211AIDRG4.pdf
Description:
IC OPAMP GP 1 CIRCUIT 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,099

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Product details

Overview

OPA211AIDRG4 from Texas Instruments is a dual-channel, precision operational amplifier with 1.1 nV/√Hz input voltage noise density at 1 kHz, 80 MHz gain-bandwidth product (G = 100), 27 V/μs slew rate, and rail-to-rail output swing. It operates from ±2.25 V to ±18 V supplies and delivers 16-bit settling in 700 ns across 10-V output swings-ideal for high-resolution data acquisition driving 16-bit ADCs.

For engineers reviewing the OPA211AIDRG4 datasheet, OPA211AIDRG4 pinout, OPA211AIDRG4 application, or OPA211AIDRG4 equivalent, key selection considerations include low-noise performance in precision analog front-ends, thermal management via exposed thermal pad, shutdown functionality, and compatibility with wide-supply industrial and test instrumentation systems.

Technical Context

The OPA211AIDRG4 implements a fully differential input stage optimized for ultra-low voltage noise and low input bias current (±60 nA typical), enabling high-impedance sensor interfacing without significant DC error. Its internal architecture supports unity-gain stability while maintaining 45 MHz bandwidth at G = 1.

It integrates an active shutdown pin (Pin 8) that places the output in high-impedance state when driven ≥(V+) – 0.35 V, with turn-on/turn-off times of 2 μs and 3 μs respectively. The exposed thermal pad must be soldered to V– for specified thermal performance and electrical stability.

Key Specifications

ParameterValue and Actual Design Meaning
Voltage Noise Density1.1 nV/√Hz at 1 kHz - enables sub-μV signal resolution in low-frequency precision measurement paths
Gain-Bandwidth Product80 MHz at G = 100 - supports fast closed-loop response in high-gain filter or conditioning stages
Slew Rate27 V/μs - ensures faithful reproduction of fast transient signals up to ~1.7 MHz full-power bandwidth
16-Bit Settling Time700 ns over 10-V swing - meets timing budget for high-speed 16-bit SAR or sigma-delta ADC drivers
Input Offset Voltage±125 μV max - minimizes DC error in precision transducer amplification and offset-sensitive circuits
Supply Range±2.25 V to ±18 V (or 4.5 V to 36 V single) - supports operation across industrial, lab, and test equipment rails
Shutdown Current1–20 μA - reduces system power during idle periods without compromising wake-up latency

Pinout & Package

OPA211AIDRG4 is housed in an 8-pin SON package (3 mm × 3 mm) with exposed thermal pad on underside, requiring solder connection to V– for thermal and electrical integrity.

Pin/TerminalCircuit RoleDesign Meaning
+IN A (Pin 3)Noninverting input, Channel AHigh-impedance node for reference or sensor signal routing; common-mode range extends to within 1.4 V of rails
–IN A (Pin 2)Inverting input, Channel AFeedback node for closed-loop configurations; matched to +IN A for CMRR >114 dB
OUT A (Pin 6)Output, Channel ARail-to-rail capable (V– + 0.2 V to V+ – 0.2 V @ 10 kΩ); drives 30 mA load
V– (Pin 4)Negative supplyReference for internal circuitry and thermal pad connection point; must tie exposed pad to this pin
V+ (Pin 7)Positive supplySupplies internal bias and output stage; supports wide dual- or single-supply operation
Shutdown (Pin 8)Active-high enable controlDrives ≥(V+) – 0.35 V to disable; leakage <1 μA; output enters high-Z state
NC (Pins 1, 5)No internal connectionMay be left floating or tied to any voltage between V– and V+; no functional impact

Key Features

FeatureDesign Value
1.1-nV/√Hz noise at 1 kHzEnables detection of microvolt-level signals in ultrasound preamps and seismic DAQ without added noise floor degradation
Rail-to-rail output swingMaximizes dynamic range utilization across 10-V output spans, critical for full-scale ADC driver linearity
700-ns 16-bit settlingMeets timing constraints for multiplexed high-resolution data acquisition systems sampling at ≥1 MSPS
±0.35 μV/°C offset driftReduces calibration frequency in field-deployed instrumentation operating across –40°C to +125°C
Exposed thermal pad (SON)Lowers junction-to-board thermal resistance to 28.8°C/W, enabling stable operation at 3.6 mA/ch under continuous load

Applications

Ultrasound Scanner Front-EndSemiconductor Test Equipment

Use Scenario: Amplifying weak echo signals from piezoelectric transducers in portable and cart-based ultrasound systems.

IC Role / Device Role / Timing Role: Low-noise preamplifier and variable-gain stage before ADC digitization.

Use Value: 1.1 nV/√Hz noise density preserves SNR of sub-mV acoustic returns; 700-ns settling supports real-time beamforming latency budgets.

Use Scenario: Precision voltage/current sourcing and measurement in automated test equipment (ATE) for IC characterization.

IC Role / Device Role / Timing Role: Output buffer and feedback amplifier in SMU (source-measure unit) architectures.

Use Value: ±125 μV offset and 0.35 μV/°C drift minimize calibration drift; rail-to-rail swing enables full compliance range coverage.

X-Ray Detector Signal ChainLab Instrumentation DAQ

Use Scenario: Conditioning charge pulses from scintillation detectors or direct-conversion sensors in medical and industrial X-ray imaging.

IC Role / Device Role / Timing Role: Charge-to-voltage converter and pulse-shaping amplifier prior to high-speed digitization.

Use Value: 80 MHz GBW supports fast pulse rise-time preservation; low 1/f noise (80 nVPP, 0.1–10 Hz) maintains pulse amplitude fidelity.

Use Scenario: High-accuracy analog input conditioning in benchtop multimeters, power analyzers, and oscilloscope front-ends.

IC Role / Device Role / Timing Role: Precision gain stage and anti-aliasing filter driver for 16-bit+ ADCs.

Use Value: THD+N of –136 dB prevents harmonic contamination; wide supply range (±2.25 V to ±18 V) accommodates legacy and modern instrument rails.

Equivalent & Alternatives

The following parts are listed as comparable options for similar precision op-amp applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
OPA211AIDRSame silicon, SOIC-8 package (4.9 mm × 3.9 mm); no exposed thermal pad; RθJA = 122.2°C/W vs 125°C/W for DRGLower power density handling; suited for lower ambient temperature or forced-air-cooled PCBsSelect OPA211AIDR when board space allows larger footprint and thermal pad integration is impractical
OPA1612AIDRLower noise (1.1 nV/√Hz same), but higher quiescent current (4.2 mA/ch vs 3.6 mA); no shutdown pin; different pinoutOptimized for audio-grade linearity (THD+N –145 dB), not industrial DAQ; lacks shutdown controlChoose OPA1612AIDR only for audio-focused designs where shutdown and thermal pad are non-critical

Compared with OPA211AIDRG4, OPA211AIDR offers identical electrical performance in a larger, easier-to-solder package but sacrifices thermal efficiency, while OPA1612AIDR trades shutdown capability and industrial temp range for enhanced audio spectral purity-neither is pin-compatible.

Availability

OPA211AIDRG4 is available at Aetrix Electronics and suitable for ultrasound scanner front-ends, semiconductor test equipment, and X-ray detector signal chains requiring stable component supply, long-term manufacturability, and guaranteed TI production status.

Supply support for OPA211AIDRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision amplifiers, data converters, and power management ICs.

The OPAx211 series was designed for high-fidelity, low-noise signal conditioning in demanding test, measurement, and medical imaging applications-prioritizing voltage noise, speed, and DC accuracy over cost or integration density.

FAQ

What is the maximum operating temperature range for the OPA211AIDRG4?

The OPA211AIDRG4 is specified from –40°C to +125°C ambient temperature. This extended industrial range ensures reliable operation in harsh environments such as industrial PLC modules, automotive test rigs, and portable medical devices. Thermal performance relies on proper soldering of the exposed thermal pad to the V– plane per TI's layout guidelines.

Does the OPA211AIDRG4 support single-supply operation?

Yes, the OPA211AIDRG4 supports single-supply operation from 4.5 V to 36 V. Its rail-to-rail output and input common-mode range extending to within 1.4 V of the positive rail (V+ – 1.4 V) and 1.8 V of the negative rail (V– + 1.8 V) enable robust functionality in unipolar systems like battery-powered DAQ modules and portable instrumentation.

How does the shutdown feature of the OPA211AIDRG4 behave electrically?

When the shutdown pin (Pin 8) is driven ≥(V+) – 0.35 V, the OPA211AIDRG4 disables its output stage and enters high-impedance state with shutdown current ≤20 μA. Turn-on time is 2 μs; turn-off time is 3 μs. The pin exhibits <1 μA leakage and requires no external pull-up/down for normal operation.

Can the OPA211AIDRG4 drive capacitive loads without instability?

The OPA211AIDRG4 is unity-gain stable but exhibits increasing overshoot with capacitive loads >100 pF. Typical Characteristics (Figure 28) shows 20% overshoot at 100 pF in G = +1 configuration. For loads >100 pF, TI recommends isolating the output with a small series resistor (e.g., 10–50 Ω) or using a dedicated capacitive-load-compensated op-amp variant.

What is the significance of the exposed thermal pad on the OPA211AIDRG4 SON package?

The exposed thermal pad on the OPA211AIDRG4 must be soldered directly to the printed circuit board and connected to the V– net. Doing so reduces junction-to-board thermal resistance to 28.8°C/W-critical for maintaining <125°C junction temperature at full 3.6 mA/ch quiescent current. Omitting this connection degrades thermal performance and may cause parametric shift or reliability risk.

OPA211AIDRG4 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Amplifier Type:
General Purpose
Number of Circuits:
1
Output Type:
Rail-to-Rail
Slew Rate:
27V/µs
Gain Bandwidth Product:
80 MHz
-3db Bandwidth:
-
Current - Input Bias:
60 nA
Voltage - Input Offset:
30 µV
Current - Supply:
3.6mA
Current - Output / Channel:
-
Voltage - Supply Span (Min):
4.5 V
Voltage - Supply Span (Max):
36 V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

OPA211AIDRG4 FAQ

1.How can I place an order for OPA211AIDRG4 through Aetrix?

Please submit a Request for Quotation (RFQ) for OPA211AIDRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for OPA211AIDRG4 reliable?

The price and inventory of OPA211AIDRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for OPA211AIDRG4 is usually 5 days.

3.What payment methods are accepted for OPA211AIDRG4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for OPA211AIDRG4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for OPA211AIDRG4?

OPA211AIDRG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your OPA211AIDRG4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for OPA211AIDRG4?

For technical support, including OPA211AIDRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your OPA211AIDRG4 requirements.

6.How does Aetrix verify that OPA211AIDRG4 is sourced from the original manufacturer or authorized distributors?

All OPA211AIDRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that OPA211AIDRG4 meets industry standards.

7.What is the process for return or replacement of OPA211AIDRG4?

All OPA211AIDRG4 units undergo pre-shipment inspection (PSI). If there is an issue with OPA211AIDRG4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The OPA211AIDRG4 part is unused and in its original packaging.

Return procedure for OPA211AIDRG4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

OPA211AIDRG4 Tags

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