Texas Instruments OPA2313IDRGR

Overview

OPA2313IDRGR from Texas Instruments is a dual-channel, rail-to-rail input/output, micro-power CMOS operational amplifier optimized for battery-powered instrumentation and sensor signal conditioning. It delivers 1-MHz gain-bandwidth, 50 µA/ch quiescent current, 25 nV/√Hz input voltage noise at 1 kHz, 0.5 mV typical offset voltage, and operates from 1.8 V to 5.5 V - enabling high-precision analog front-ends in portable medical devices and wireless sensors.

For engineers reviewing the OPA2313IDRGR datasheet, OPA2313IDRGR pinout, OPA2313IDRGR application, or OPA2313IDRGR equivalent, this page provides verified specifications, package-validated pin functions, real-world use cases in low-voltage sensing, and two confirmed alternative parts with documented technical and application differences.

Technical Context

The OPA2313IDRGR employs a complementary differential input stage (N- and P-channel pairs) enabling true rail-to-rail common-mode input range - extending 200 mV beyond both supply rails - with no phase reversal during overdrive. Its class AB output stage drives ≥10-kΩ loads while maintaining rail-to-rail swing across the full temperature range (–40°C to +125°C).

It integrates an internal RF/EMI rejection filter (–3 dB at ~35 MHz) and features robust ESD protection (4-kV HBM), unity-gain stability with up to 150 pF capacitive load, and low input bias current (0.2 pA typ) suitable for high-impedance sensor interfaces such as pH electrodes and piezoresistive bridges.

Key Specifications

Pinout & Package

OPA2313IDRGR is housed in an 8-pin DFN (DRG) package with exposed thermal pad on underside, measuring 2.0 mm × 2.0 mm × 0.75 mm (0.65-mm pitch). The thermal pad must be soldered to V– for optimal thermal performance (θJB = 20.1°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel, low-power, rail-to-rail op amp applications.

Compared with MCP6022-I/SN, OPA2313IDRGR trades bandwidth for 2× lower power and integrated EMI rejection; versus TLV9002IDR, it offers superior dc precision (0.5 mV vs 1.6 mV VOS) and built-in RF filtering at identical package and pin compatibility.

Availability

OPA2313IDRGR is available at Aetrix Electronics and suitable for portable medical sensors, wireless industrial transmitters, and home security motion detectors requiring stable component supply, extended temperature support, and verified low-power analog performance.

Supply support for OPA2313IDRGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision op amps and low-power signal chain solutions.

The OPA2313IDRGR belongs to TI's Precision Value Line series - designed specifically for cost-sensitive, battery-constrained applications demanding rail-to-rail operation, micro-power consumption, and robust performance across –40°C to +125°C.

FAQ

What is the maximum capacitive load the OPA2313IDRGR can drive while remaining stable?

The OPA2313IDRGR is unity-gain stable with capacitive loads up to 150 pF, as confirmed in the datasheet's Phase Margin vs Capacitive Load plot (Figure 21). This eliminates need for external compensation when driving ADC input capacitance or long PCB traces. For loads >150 pF, a small series resistor (e.g., 10–50 Ω) at the output is recommended to isolate the capacitance and preserve phase margin. The OPA2313IDRGR's internal architecture ensures no peaking or oscillation within this limit.

Does the OPA2313IDRGR support true rail-to-rail input at 1.8-V supply?

Yes - the OPA2313IDRGR's input common-mode range extends from (V–) – 0.2 V to (V+) + 0.2 V, meaning it accepts signals from –0.2 V to +2.0 V when powered from 1.8 V. This is enabled by its complementary N/P-channel input stage. However, CMRR and PSRR degrade within the transition region near (V+) – 1.3 V, so for best dc performance, keep common-mode voltage below that threshold. The OPA2313IDRGR datasheet confirms this behavior across the full –40°C to +125°C range.

How does the internal EMI filter in the OPA2313IDRGR improve system-level robustness?

The OPA2313IDRGR integrates a 35-MHz low-pass filter on both inputs to attenuate high-frequency electromagnetic interference before it reaches the core amplifier, reducing rectified offset shifts caused by RF demodulation in junctions. Measured EMIRR IN+ exceeds 100 dB at 100 MHz (Figure 33), making it effective against cellular, Wi-Fi, and Bluetooth band noise. This eliminates need for external RC filters in space-constrained designs - a key advantage over alternatives like TLV9002IDR, which lacks this feature.

Can the OPA2313IDRGR be used in a single-supply 1.8-V pH sensor interface?

Yes - the OPA2313IDRGR is explicitly validated for 1.8-V operation and features 0.2 pA typical input bias current, minimizing voltage error across high-impedance pH electrode sources (>100 MΩ). Its rail-to-rail input accepts the electrode's mV-level output referenced to V–, and rail-to-rail output drives low-voltage ADCs directly. The 25 nV/√Hz noise density preserves signal integrity, and the –40°C to +125°C spec supports environmental chamber testing. All parameters in the +1.8 V Electrical Characteristics table apply to this use case.

What is the thermal pad connection requirement for the OPA2313IDRGR DFN package?

The exposed thermal pad on the underside of the OPA2313IDRGR's DRG package must be soldered to the V– (pin 4) net on the PCB. This connection achieves θJB = 20.1°C/W, critical for maintaining junction temperature within limits at full operating current. TI's datasheet specifies pad size as 1.8 mm × 1.5 mm and mandates connection to V– - not ground or floating - to ensure proper thermal and electrical performance. Failure to connect the pad degrades thermal resistance by >2× and risks parametric shift under load.