Texas Instruments OPA2313IDRGT

Overview

OPA2313IDRGT from Texas Instruments is a dual-channel, rail-to-rail input/output, micro-power CMOS operational amplifier optimized for battery-powered and low-voltage precision signal conditioning. It delivers 1-MHz gain bandwidth, 50 µA/ch quiescent current, 25 nV/√Hz input voltage noise at 1 kHz, 0.5 mV typical offset voltage, and operates from 1.8 V to 5.5 V - enabling high-accuracy sensor interfacing in portable medical devices and wireless sensor nodes.

For engineers reviewing the OPA2313IDRGT datasheet, OPA2313IDRGT pinout, OPA2313IDRGT application, or OPA2313IDRGT equivalent, this page provides verified specifications, package-validated pin functions, real-world use cases in loop-powered transmitters and ADC drivers, and two confirmed alternative parts with documented functional and application-level differences.

Technical Context

The OPA2313IDRGT employs a complementary differential input stage (N- and P-channel pairs) enabling true rail-to-rail common-mode input range extending 200 mV beyond both supply rails - critical for single-supply operation down to +1.8 V. Its class AB output stage drives ≥10-kΩ loads while maintaining rail-to-rail swing.

It integrates an internal RF/EMI rejection filter (–3 dB at ~35 MHz) and features unity-gain stability with capacitive loads up to 150 pF, no phase reversal under overdrive, and 4-kV HBM ESD protection - making it robust in noisy industrial and portable environments without external filtering or layout mitigation.

Key Specifications

Pinout & Package

OPA2313IDRGT is housed in an 8-pin DFN (DRG) package with exposed thermal pad on underside, measuring 2.0 mm × 2.0 mm × 0.75 mm (0.65-mm pitch). The thermal pad must be soldered to V– for optimal thermal performance (θJB = 20.1°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar op amp applications.

Compared with MCP6002T-I/SN and LMV358IDR, OPA2313IDRGT uniquely combines micro-power operation, rail-to-rail I/O, integrated EMI filtering, and –40°C to +125°C qualification - making it the only choice for next-generation battery-powered industrial and medical edge sensors demanding long life, small size, and robustness.

Availability

OPA2313IDRGT is available at Aetrix Electronics and suitable for portable medical devices, loop-powered industrial transmitters, and wireless sensor nodes requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for OPA2313IDRGT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.

The OPA2313IDRGT belongs to TI's Precision Value Line op amp family - engineered specifically for cost-sensitive, battery-constrained applications needing reliable DC accuracy, low-noise AC performance, and robust operation from 1.8 V without design compromises.

FAQ

What is the maximum capacitive load the OPA2313IDRGT can drive while remaining stable?

The OPA2313IDRGT is unity-gain stable with capacitive loads up to 150 pF, as confirmed in the datasheet's Phase Margin vs Capacitive Load plot (Figure 21). This allows direct connection to ADC input capacitors, long PCB traces, or RC filters without external isolation resistors - reducing component count and board space in compact sensor modules. For loads exceeding 150 pF, a series resistor (≥10 Ω) between amplifier output and capacitance restores stability without degrading DC accuracy. OPA2313IDRGT's internal compensation eliminates need for external compensation networks.

Does the OPA2313IDRGT support true rail-to-rail input at 1.8-V supply?

Yes, the OPA2313IDRGT supports rail-to-rail input operation at 1.8 V: its common-mode input range extends from (V–) – 0.2 V to (V+) + 0.2 V, meaning it accepts signals from –0.2 V to +2.0 V when powered from 1.8 V. This is enabled by its complementary N/P-channel input stage. However, CMRR and PSRR degrade slightly within the transition region near (V+) – 1.3 V (i.e., ~0.5 V at 1.8 V), so for highest accuracy, keep common-mode voltage below 0.4 V or above 1.4 V. OPA2313IDRGT's specification tables explicitly confirm rail-to-rail input at 1.8 V.

How does the internal EMI filter in the OPA2313IDRGT improve system-level robustness?

The OPA2313IDRGT integrates a dedicated on-chip low-pass filter (–3 dB at ~35 MHz) on both inputs to suppress RF rectification effects that cause DC offset shifts in presence of ambient RF (e.g., 2.4-GHz Wi-Fi/Bluetooth). Measured EMIRR IN+ exceeds 100 dB at 100 MHz, preventing spurious offsets in sensitive sensor front-ends without requiring external LC filters or shielded enclosures. This feature is validated in Figure 33 of the SBOS649C datasheet and directly improves long-term measurement stability in wireless-connected devices. OPA2313IDRGT's EMI rejection is intrinsic and requires no layout changes.

Can the OPA2313IDRGT be used in a single-supply 1.8-V configuration to drive a 12-bit ADC with full-scale range?

Yes, OPA2313IDRGT is fully specified for 1.8-V operation and delivers rail-to-rail output swing within 75 mV of each rail (RL = 100 kΩ), enabling ≥92% of full-scale utilization for a 12-bit ADC with 0–1.8 V input range. Its 0.5 mV typical offset contributes only 1.1 LSB error, and 25 nV/√Hz noise ensures >70 dB SNR. The device's guaranteed operation from –40°C to +125°C and 1-MHz bandwidth further support precision acquisition in compact, battery-powered data loggers. OPA2313IDRGT's Electrical Characteristics table explicitly lists all key parameters at 1.8 V.

What thermal considerations apply to the OPA2313IDRGT's DFN-8 (DRG) package?

The OPA2313IDRGT in DRG package has θJA = 53.8°C/W and θJB = 20.1°C/W - among the lowest junction-to-board thermal resistances in its class - but only when the exposed thermal pad is soldered to a solid V– copper plane. Failure to connect the pad increases θJB by >5×, risking thermal shutdown at 85°C ambient with 10-mA output current. TI's thermal metrics report (SPRA953) confirms the pad must be tied to V– (not floating or grounded separately) to achieve rated 20.1°C/W. OPA2313IDRGT's thermal performance is validated in the SBOS649C datasheet's Thermal Information section.