Texas Instruments OPA2373AIDGST

Overview

OPA2373AIDGST from Texas Instruments is a dual-channel, rail-to-rail input/output CMOS operational amplifier with shutdown control, optimized for low-power portable and battery-powered systems. It delivers 6.5-MHz gain-bandwidth, 5-V/µs slew rate, 585-µA quiescent current per channel, and operates from 2.3 V to 5.5 V single supply - enabling high-precision signal conditioning in space-constrained, energy-sensitive applications such as sensor front-ends and portable data acquisition.

For engineers reviewing the OPA2373AIDGST datasheet, OPA2373AIDGST pinout, OPA2373AIDGST application, or OPA2373AIDGST equivalent, key selection criteria include its dual-channel shutdown capability, ±10-pA max input bias current, 5-mV max input offset voltage, rail-to-rail I/O swing within 25 mV of rails, and guaranteed operation up to +125°C - all in a 10-pin VSON (3 mm × 3 mm) thermally enhanced package.

Technical Context

The OPA2373AIDGST implements a complementary input stage (N- and P-channel differential pairs) enabling rail-to-rail input common-mode range extending 200 mV beyond both supply rails. Its class AB output stage supports rail-to-rail output swing - typically within 18 mV of rails at light loads (100 kΩ) and 125 mV at 5-kΩ loads across –40°C to +125°C.

Each channel features independent logic-controlled shutdown (Enable A/B pins), reducing quiescent current to <1 µA per amplifier. The device maintains unity-gain stability while driving capacitive loads up to 250 pF in G = +1 configuration, with 1-µs 0.1% settling time on a 2-V step - making it suitable for driving SAR ADC inputs and active filter stages without external compensation.

Key Specifications

Pinout & Package

OPA2373AIDGST is housed in a 10-pin VSON package (3.00 mm × 3.00 mm, 0.5-mm pitch) with exposed thermal pad (connected to V–) for enhanced thermal performance. The package supports automated optical inspection and offers low thermal resistance (R_θJA = 170.6°C/W, R_θJB = 91°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel rail-to-rail op amp applications.

Compared with OPA2373AIDGST, OPA2374AIDR trades shutdown capability for identical AC performance in a slightly less thermally efficient package, while MCP6V82-E/MS sacrifices bandwidth and power efficiency to achieve microvolt-level offset stability - making OPA2373AIDGST the optimal balance of speed, power, precision, and controllability for portable mixed-signal systems.

Availability

OPA2373AIDGST is available at Aetrix Electronics and suitable for portable medical sensors, battery-powered data loggers, and active audio filters requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for OPA2373AIDGST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision op amps, data converters, and power management ICs.

The OPAx373 family was designed specifically for low-power, high-speed signal conditioning in space- and energy-constrained applications - emphasizing rail-to-rail operation, shutdown flexibility, and robust performance across extended temperature ranges.

FAQ

What is the maximum capacitive load the OPA2373AIDGST can drive stably in unity-gain configuration?

The OPA2373AIDGST maintains unity-gain stability with capacitive loads up to 250 pF when configured as a voltage follower. This capability eliminates the need for external isolation resistors in many ADC driver and filter applications. For loads exceeding 250 pF, a small series resistor (10–20 Ω) between the output and capacitive load restores phase margin. The device's internal compensation is optimized for this behavior, as confirmed in TI's SBOS279F datasheet Figure 17.

Does the OPA2373AIDGST require external power-supply decoupling capacitors?

Yes - a 0.1-µF ceramic capacitor placed as close as possible to the V+ (Pin 10) and V– (Pin 4) pins is required for stable operation. The exposed thermal pad on the VSON package must be soldered to a PCB ground plane to serve as both thermal relief and low-inductance return path. Additional bulk capacitance (e.g., 1–10 µF tantalum) is recommended if the supply traces are long or share routing with noisy digital circuits.

How does the shutdown feature of the OPA2373AIDGST affect quiescent current?

When either Enable A (Pin 5) or Enable B (Pin 6) is driven low (< (V–) + 0.8 V), the corresponding amplifier enters shutdown mode with quiescent current reduced to <1 µA per channel. Both channels can be disabled simultaneously, reducing total device current to <2 µA. Full functionality resumes within 12 µs after the enable pin rises above (V–) + 2 V, as specified in the Electrical Characteristics table of the OPA2373AIDGST datasheet.

Can the OPA2373AIDGST operate from a 2.3-V supply, and what performance trade-offs occur?

Yes - the OPA2373AIDGST is fully specified from 2.3 V to 5.5 V. At 2.3 V, the output swing remains rail-to-rail (within 25 mV of rails), but GBW drops to ~5.2 MHz and slew rate decreases to ~3.8 V/µs versus 6.5 MHz and 5 V/µs at 5 V. Input offset voltage and bias current remain within datasheet limits. This makes the OPA2373AIDGST viable for single-cell Li-ion (2.7–4.2 V) and alkaline (2.3–3.2 V) systems without performance compromise.

Is the OPA2373AIDGST pin-compatible with other devices in the OPAx373 family?

No - the OPA2373AIDGST uses a 10-pin VSON package with dedicated Enable A/B pins, while OPA373 (single-channel) uses 6-pin or 8-pin SOT-23/SOIC packages without shutdown, and OPA2374 (dual-channel, no shutdown) shares the same 10-pin VSSOP footprint but differs in pin mapping and thermal pad connection. Direct substitution requires PCB layout revision; functional equivalence exists only at the schematic level with appropriate enable logic handling.