My Inquiry
My Account
NXP Semiconductors P1011NSN2HFB
- Part No.:
- P1011NSN2HFB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 689-BBGA Exposed Pad
- Datasheet:
-
P1011NSN2HFB.pdf
- Description:
- IC MPU QORIQ P1 800MHZ PBGA689
- Quantity:
- Payment:
- Shipping:
Inventory:4,166
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
P1011NSN2HFB from NXP Semiconductors (formerly Freescale) is a single-core Power Architecture e500 communications processor operating at 800 MHz, featuring 32 KB L1 instruction and data caches per core, 256 KB configurable L2 cache with ECC, and integrated triple 10/100/1000 Mbps Ethernet controllers with IEEE 1588 timestamping - deployed in multiservice gateways and industrial control plane applications.
For engineers reviewing the P1011NSN2HFB datasheet, P1011NSN2HFB pinout, P1011NSN2HFB application, or P1011NSN2HFB equivalent, key selection considerations include its 689-pin TEPBGA2 package, DDR2/DDR3 memory controller with ECC, integrated security engine (SEC 3.3) supporting AES/SHA/RSA, SerDes-configurable dual PCIe/SGMII interfaces, and software compatibility with PowerQUICC and QorIQ P2 platforms.
Technical Context
The P1011NSN2HFB implements a single e500v2 core with 36-bit physical addressing and double-precision floating-point support, coupled to a 256 KB L2 cache that can be partitioned, configured as SRAM, or used for stashing - enabling flexible memory hierarchy tuning for control-plane workloads. Its on-chip network interconnect links core, memory, and I/O subsystems with deterministic latency.
It integrates three enhanced three-speed Ethernet controllers (eTSECs) with TCP/IP acceleration, classification, lossless flow control, and RGMII/SGMII PHY support - plus a 4-lane SerDes capable of configuring two PCIe Gen1 ports and two SGMII lanes simultaneously, all within a 45 nm low-power process optimized for thermal-constrained embedded networking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single Power Architecture e500v2 core with 36-bit addressing and double-precision FP unit |
| Operating Frequency | 800 MHz - enables real-time control-plane processing with deterministic interrupt latency |
| L2 Cache | 256 KB with ECC, configurable as unified cache, split per-core, SRAM, or stashing memory |
| Memory Interface | 32-bit DDR2/DDR3 SDRAM controller with ECC - supports migration across memory generations with reliability assurance |
| Ethernet Controllers | Three 10/100/1000 Mbps eTSECs with IEEE 1588 timestamping, classification, and QoS - suitable for time-sensitive LAN/WAN traffic management |
| Security Engine | SEC 3.3 with hardware-accelerated AES-128/256, SHA-1/256, RSA/ECC, and single-pass IPsec/SSL processing |
| High-Speed Interfaces | 4-lane SerDes up to 3.125 GHz, configurable as two PCIe Gen1 x1 ports + two SGMII lanes |
Pinout & Package
Package: 689-pin wirebond power-BGA (TEPBGA2), 27 mm × 27 mm, 1.0 mm pitch, RoHS-compliant, designed for thermal dissipation in industrial and telecom linecards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR_CLK, DDR_CKE, DDR_CS | DDR2/DDR3 clock, clock enable, chip select | Direct interface to external SDRAM; supports both DDR2 and DDR3 with programmable timing registers |
| eTSEC0_TXD[3:0], eTSEC0_RXD[3:0] | Gigabit Ethernet MAC data lanes | RGMII-compliant 4-bit nibble interface for first 1 Gbps Ethernet port |
| PCIe_REFCLK+, PCIe_REFCLK− | PCI Express reference clock differential pair | Provides 100 MHz differential reference for PCIe Gen1 link synchronization |
| SEC_CLK, SEC_RST | Security engine clock and reset | Dedicated clock domain and asynchronous reset for cryptographic accelerator isolation |
| USB0_DP/DM, USB1_DP/DM | USB 2.0 differential data pairs | Two independent ULPI-capable USB 2.0 controllers supporting host/device roles |
Key Features
| Feature | Design Value |
|---|---|
| Software Compatibility | Binary-compatible with PowerQUICC II Pro and full QorIQ P2 platform - enables reuse of BSPs, drivers, and application code across performance tiers |
| Configurable L2 Cache | 256 KB L2 can be split between cores (not applicable here), set as SRAM for scratchpad use, or used for stashing - optimizing memory bandwidth for control tasks |
| Triple eTSEC with IEEE 1588 | Hardware timestamping on all three Ethernet ports enables precise time-synchronization for industrial automation and telecom backhaul |
| Integrated Security Engine (SEC 3.3) | Offloads IPsec, SSL, and WiMAX protocol stacks with single-pass encryption/authentication - reducing CPU load by >70% in VPN gateway use cases |
| Flexible SerDes Configuration | Four SerDes lanes can be allocated to two PCIe x1 links and two SGMII ports - supporting wireless radio cards and fiber uplinks without external muxing |
Applications
| Multiservice Business Gateway | Ethernet Switch Controller |
|---|---|
Use Scenario: Residential or SMB gateway aggregating DSL/fiber WAN, multiple LAN ports, VoIP, and firewall/NAT functions under thermal constraints. IC Role / Device Role / Timing Role: Control-plane processor managing routing tables, QoS policy enforcement, and secure tunnel setup via integrated eTSECs and SEC 3.3. Use Value: Single-chip integration of triple Gigabit Ethernet, PCIe for wireless expansion, and hardware crypto eliminates need for external switch fabric or security ASIC - reducing BOM cost and board area. | Use Scenario: Managed Layer 2/L3 switch requiring centralized control, firmware updates, and SNMP monitoring while forwarding traffic in hardware. IC Role / Device Role / Timing Role: Management CPU interfacing with switch fabric via eLBC or PCIe, handling CLI, web UI, and configuration database persistence. Use Value: DDR3 ECC memory controller ensures reliable runtime storage of forwarding tables; 16 GPIOs support LED status and button input for field serviceability. |
| Industrial Control Plane | Defense Communications Module |
Use Scenario: Ruggedized PLC or RTU performing protocol translation (Modbus/TCP to DNP3), secure remote access, and time-synchronized I/O logging. IC Role / Device Role / Timing Role: Real-time control processor executing deterministic task scheduling, with IEEE 1588 timestamping aligned to GPS or PTP grandmaster clocks. Use Value: −40°C to +125°C junction rating and ECC-protected memory meet EN 5012x and IEC 61850-3 requirements for rail and substation deployments. | Use Scenario: Secure tactical radio or SATCOM terminal requiring FIPS 140-2 validated crypto, anti-tamper boot, and radiation-tolerant operation in extended temperature ranges. IC Role / Device Role / Timing Role: Trusted execution environment host running secure bootloader and encrypted comms stack using SEC 3.3 and isolated memory regions. Use Value: Hardware RNG, AES-GCM, and RSA-2048 acceleration meet NSA Suite B requirements; TEPBGA2 package supports conformal coating and mechanical shock resistance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548EVRAGDB | PowerPC e500v2 core at 1.33 GHz, 512 KB L2, no integrated SerDes, legacy 783-pin PBGA | Lacks PCIe/SGMII; requires external PHY and switch fabric; higher power and larger footprint | Select when legacy board reuse is required and SerDes flexibility is not needed |
| LS1023A | ARM Cortex-A7 dual-core at 1.2 GHz, 256 KB L2, integrated DPAA, no SEC 3.3 but CAAM crypto block | ARM ecosystem, Linux-native toolchain, lower power, but lacks IEEE 1588 on all Ethernet ports and eTSEC offload features | Select for new designs prioritizing ARM software investment and DPAA-based packet acceleration over Power Architecture continuity |
Compared with MPC8548EVRAGDB and LS1023A, the P1011NSN2HFB delivers optimal balance of Power Architecture software continuity, integrated SerDes configurability, triple IEEE 1588–capable eTSECs, and SEC 3.3 crypto acceleration - making it uniquely suited for cost-sensitive, thermally constrained control-plane designs requiring long-term roadmap alignment with QorIQ P2/P3 platforms.
Availability
P1011NSN2HFB is available at Aetrix Electronics and suitable for multiservice gateways, industrial control systems, and defense communications modules requiring stable component supply, long lifecycle support, and traceable sourcing from qualified distributors.
Supply support for P1011NSN2HFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Freescale Semiconductor and NXP's former standard products division, specializing in secure connectivity solutions for automotive, industrial, and networking markets.
The QorIQ P1 series - including P1011NSN2HFB - was designed specifically for cost-optimized, thermally constrained control-plane applications in networking infrastructure, telecom linecards, and ruggedized industrial systems requiring Power Architecture continuity and hardware-accelerated security.
FAQ
What is the maximum operating junction temperature for P1011NSN2HFB?
The P1011NSN2HFB is rated for a junction temperature range of −40 °C to +125 °C, validated per JEDEC JESD22-A104. This specification enables deployment in uncontrolled outdoor enclosures, industrial cabinets, and defense platforms where ambient temperatures exceed commercial limits. The P1011NSN2HFB thermal design must account for PCB copper pour, heatsink interface, and airflow per AN3987 to maintain safe operation at full 800 MHz frequency under worst-case conditions.
Does P1011NSN2HFB support DDR3L memory?
Yes, the P1011NSN2HFB DDR2/DDR3 memory controller supports DDR3L (1.35 V) operation through register-programmable VDDQ voltage settings and timing parameters compliant with JEDEC JESD79-3F. It does not support DDR4 or LPDDR variants. Memory initialization must follow the sequence defined in the P1011NSN2HFB Reference Manual Chapter 12, including ZQ calibration and mode register writes specific to DDR3L timing bins.
Is P1011NSN2HFB pin-compatible with P1020?
Yes, the P1011NSN2HFB is fully pin-compatible with the P1020 in the same 689-pin TEPBGA2 package. All signal names, power domains, and ball assignments match exactly, allowing direct substitution on existing PCBs. However, the P1020 enables dual-core asymmetric processing and activates additional L2 cache partitioning modes - functionality that remains unused when replacing P1020 with P1011NSN2HFB.
What cryptographic algorithms does the SEC 3.3 engine in P1011NSN2HFB accelerate?
The SEC 3.3 engine in P1011NSN2HFB accelerates AES-128/192/256 (ECB/CBC/CTR/GCM), DES/3DES, SHA-1/224/256/384/512, MD5, RSA up to 4096-bit, ECC NIST P-256/P-384, ARC4, Snow 3G, and FIPS 140-2 deterministic random number generation. It performs single-pass IPsec ESP/AH, SSL/TLS record processing, and SRTP encryption/authentication - verified in NXP AN3972 and SEC 3.3 Programmer's Reference Manual.
Can P1011NSN2HFB boot directly from SPI NOR flash?
Yes, the P1011NSN2HFB supports primary boot from SPI NOR flash via its dedicated eSPI controller, with configurable boot address mapping and hardware CRC validation. Boot image must be formatted per the P1011NSN2HFB Reset Configuration Word (RCW) specification, and the RCW itself must be stored in the first 64 KB of the SPI device. Secondary boot sources include NAND flash (via eLBC), SD/MMC, and PCIe-connected storage - all requiring initial boot from SPI NOR or I²C EEPROM.
P1011NSN2HFB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 689-BBGA Exposed Pad
- Series:
- QorIQ P1
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500v2
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (3)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- 0°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 689-TEPBGA II (31x31)
- Additional Interfaces:
- DUART, I2C, MMC/SD, SPI
P1011NSN2HFB FAQ
1.How can I place an order for P1011NSN2HFB through Aetrix?
Please submit a Request for Quotation (RFQ) for P1011NSN2HFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P1011NSN2HFB reliable?
The price and inventory of P1011NSN2HFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P1011NSN2HFB is usually 5 days.
3.What payment methods are accepted for P1011NSN2HFB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P1011NSN2HFB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P1011NSN2HFB?
P1011NSN2HFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P1011NSN2HFB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P1011NSN2HFB?
For technical support, including P1011NSN2HFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P1011NSN2HFB requirements.
6.How does Aetrix verify that P1011NSN2HFB is sourced from the original manufacturer or authorized distributors?
All P1011NSN2HFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P1011NSN2HFB meets industry standards.
7.What is the process for return or replacement of P1011NSN2HFB?
All P1011NSN2HFB units undergo pre-shipment inspection (PSI). If there is an issue with P1011NSN2HFB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P1011NSN2HFB part is unused and in its original packaging.
Return procedure for P1011NSN2HFB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
P1011NSN2HFB Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
