NXP Semiconductors P1011NXE2DFB
- Part No.:
- P1011NXE2DFB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 689-BBGA Exposed Pad
- Datasheet:
-
P1011NXE2DFB.pdf
- Description:
- IC MPU 533MHZ PBGA689
- Quantity:
- Payment:

- Shipping:

Inventory:2,275
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Product details
Overview
P1011NXE2DFB from NXP Semiconductors (formerly Freescale) is a single-core Power Architecture e500 communications processor designed for control-plane and data-plane processing in embedded networking systems. It operates at 800 MHz, integrates 256 KB L2 cache with ECC, supports DDR2/DDR3 SDRAM, and features three 10/100/1000 Mbps Ethernet controllers with IEEE 1588 timestamping-used in multiservice gateways and industrial edge routers.
For engineers reviewing the P1011NXE2DFB datasheet, P1011NXE2DFB pinout, P1011NXE2DFB application, or P1011NXE2DFB equivalent, key selection criteria include its 689-pin TEPBGA2 package, e500 core software compatibility with PowerQUICC, SerDes lane allocation flexibility (PCIe/SGMII), integrated SEC 3.3 crypto engine, and –40°C to +125°C junction temperature rating for harsh-environment deployment.
Technical Context
The P1011NXE2DFB implements a single e500v2 core with 36-bit physical addressing and double-precision floating-point support. Its on-chip memory subsystem includes separate 32 KB L1 instruction and 32 KB L1 data caches per core, plus a shared 256 KB L2 cache configurable as SRAM or stashing memory with ECC protection.
Networking functionality is delivered via three enhanced three-speed Ethernet controllers (eTSECs) supporting RGMII/SGMII, TCP/IP acceleration, lossless flow control, and IEEE 1588v2 hardware timestamping. The 4-lane SerDes supports multiprotocol operation up to 3.125 GHz, allocated across two PCIe 1.1 ports and two SGMII interfaces-enabling simultaneous WAN/LAN and wireless backhaul connectivity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single e500v2 Power Architecture core with 36-bit addressing and double-precision FP unit |
| Operating Frequency | 800 MHz core clock-determines maximum instruction throughput and real-time response latency |
| L2 Cache | 256 KB with ECC, configurable as SRAM or stashing memory for deterministic packet buffering |
| Memory Interface | 32-bit DDR2/DDR3 SDRAM controller with ECC-supports migration between memory generations without redesign |
| Ethernet Controllers | Three 10/100/1000 Mbps eTSECs with IEEE 1588 timestamping, classification, and QoS for time-sensitive traffic management |
| Security Engine | SEC 3.3 with AES/3DES/RSA/ECC/SHA/MD5-enables single-pass IPsec/SSL encryption and authentication in control-plane firmware |
| SerDes Configuration | 4-lane multiprotocol SerDes up to 3.125 GHz-allocatable as two PCIe 1.1 lanes + two SGMII lanes for hybrid wired/wireless gateway designs |
Pinout & Package
Package: 689-pin wirebond power-BGA (TEPBGA2), 27 mm × 27 mm, 1.0 mm pitch, RoHS-compliant, thermal lid-equipped for industrial temperature operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR_CLK, DDR_CKE, DDR_CS | DDR2/DDR3 clock, chip enable, chip select | Direct interface to external SDRAM; timing-critical signals requiring matched-length routing |
| eTSEC0_TXD[3:0], eTSEC0_RXD[3:0] | Gigabit Ethernet data lanes (RGMII) | 4-bit nibble interface for 1 Gbps LAN/WAN port; requires controlled impedance and length matching |
| PCIe_REFCLK+, PCIe_REFCLK− | Differential reference clock input | 25 MHz differential clock source for PCIe PHY synchronization; critical for link training stability |
| SEC_CLK, SEC_RST | Security engine clock and reset | Dedicated clock domain for cryptographic operations; isolated from main core clock for side-channel resistance |
| USB0_DP/DM, USB1_DP/DM | USB 2.0 differential data pairs | Support host/device mode via ULPI interface; second USB port usable as console or printer interface |
| TDM_CLK, TDM_FS, TDM_DIN/DOUT | Time-division multiplexing interface | Enables legacy voice channel support (e.g., E1/T1 framing) without external codec |
Key Features
| Feature | Design Value |
|---|---|
| Software compatibility with PowerQUICC | Enables reuse of existing BSPs, drivers, and application code-reducing porting effort and validation time |
| IEEE 1588v2 hardware timestamping | Sub-microsecond time synchronization accuracy for industrial automation and telecom timing applications |
| Configurable L2 cache partitioning | Allows dedicated cache space for real-time tasks while reserving bandwidth for background services |
| Integrated XOR acceleration | Offloads RAID parity calculations and data scrubbing from CPU-improving storage subsystem efficiency |
| eLBC with programmable timing | Supports NOR/NAND flash, SRAM, and FPGA configuration without glue logic-simplifying boot and expansion design |
Applications
| Industrial Edge Router | Multiservice Business Gateway |
|---|---|
Use Scenario: Compact DIN-rail-mounted router managing fieldbus-to-IP bridging in factory automation. IC Role / Device Role / Timing Role: Control-plane processor executing routing protocols and real-time I/O supervision; IEEE 1588 timestamping synchronizes PLC clocks. Use Value: Single-chip integration of Ethernet, SerDes, and security eliminates external switch fabric and crypto ASIC-reducing BOM cost and board area by 32%. | Use Scenario: Small-office gateway aggregating VoIP, Wi-Fi, and broadband uplink with firewall and VPN termination. IC Role / Device Role / Timing Role: Dual-role processor handling SIP signaling (control plane) and encrypted media path (data plane) using SEC 3.3 offload. Use Value: Integrated eTSECs with classification/QoS ensure jitter-free voice delivery; USB2.0 host port enables local printer sharing without hub IC. |
| Defense Communications Node | Outdoor Wireless Backhaul Controller |
Use Scenario: Ruggedized tactical radio node performing secure mesh networking in mobile command vehicles. IC Role / Device Role / Timing Role: High-assurance crypto processor running FIPS-validated IPsec stack; operates across –40°C to +125°C junction range. Use Value: SEC 3.3 supports AES-256-GCM and RSA-3072 in single pass-meeting NSA Suite B requirements without external HSM. | Use Scenario: Pole-mounted base station controller linking remote sensors via 802.11n radios and fiber uplink. IC Role / Device Role / Timing Role: PCIe-connected radio controller managing MAC layer; SGMII links to optical transceiver for fronthaul. Use Value: Two independent PCIe 1.1 lanes allow concurrent Wi-Fi AP and fiber uplink operation-eliminating need for external PCIe switch. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548CVMAGDB | PowerPC e500v2 core at 1.33 GHz, 512 KB L2 cache, no integrated SerDes, requires external PCIe switch | Lacks native SerDes and integrated security engine-requires discrete crypto and PHY components | Choose when higher raw CPU throughput is prioritized over integration density and crypto offload |
| LX2160A | ARM Cortex-A72 16-core, 2.0 GHz, DPAA2 packet acceleration, built-in 10G Ethernet, no TDM interface | Targeted at high-throughput data-plane forwarding; lacks legacy TDM and Power Architecture toolchain continuity | Choose for new ARM-based designs requiring >10 Gbps line-rate processing and modern Linux ecosystem support |
Compared with MPC8548CVMAGDB and LX2160A, the P1011NXE2DFB delivers optimal balance of Power Architecture software continuity, integrated SerDes/SEC, and industrial temperature support-making it uniquely suited for cost-sensitive, thermally constrained control-plane deployments where legacy protocol support and crypto acceleration are mandatory.
Availability
P1011NXE2DFB is available at Aetrix Electronics and suitable for industrial edge routers, multiservice gateways, defense comms nodes, and outdoor wireless backhaul controllers requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for P1011NXE2DFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and networking applications, with roots in Freescale's PowerQUICC heritage.
The QorIQ P1 series-including P1011NXE2DFB-was engineered to deliver scalable, low-power communications processing for thermally constrained embedded systems requiring hardware-accelerated security and multi-protocol I/O without sacrificing software compatibility.
FAQ
What is the maximum operating junction temperature for P1011NXE2DFB?
The P1011NXE2DFB is rated for a junction temperature range of –40°C to +125°C. This specification enables deployment in uncontrolled environments such as outdoor telecom cabinets and military vehicle enclosures. Thermal design must maintain case-to-ambient thermal resistance below 1.2°C/W using the integrated thermal lid and recommended PCB copper pour layout per AN3986. The P1011NXE2DFB datasheet defines derating curves above 105°C ambient.
Does P1011NXE2DFB support DDR3 memory, and what are the key timing constraints?
Yes, the P1011NXE2DFB supports both DDR2 and DDR3 SDRAM via its 32-bit memory controller with ECC. Key timing constraints include tRCD = 12 ns, tRP = 12 ns, and tRAS = 32 ns for DDR3-800 operation. The controller supports programmable drive strength and on-die termination calibration, and requires strict trace length matching (<5 mm skew) across DQ/DQS groups. Reference designs use 16-layer PCBs with dedicated memory planes to meet signal integrity requirements for P1011NXE2DFB.
How many PCIe lanes does P1011NXE2DFB provide, and can they operate simultaneously with SGMII?
The P1011NXE2DFB integrates a 4-lane SerDes block that can be configured as two PCIe 1.1 lanes and two SGMII lanes concurrently. This allocation is fixed in hardware and supported in the P1011NXE2DFB reference manual Rev. 6. Each PCIe lane operates at 2.5 GT/s, and each SGMII lane at 1.25 Gbps. No arbitration or time-division multiplexing is required-the SerDes lanes function independently once configured during reset.
Is P1011NXE2DFB pin-compatible with other QorIQ processors, and which ones?
Yes, the P1011NXE2DFB is pin-compatible with the P1020, P2010, and P2020 processors in the same 689-pin TEPBGA2 package footprint. This allows hardware reuse across performance tiers-from 800 MHz single-core (P1011NXE2DFB) to 1.2 GHz dual-core (P2020). Pin compatibility covers power, ground, DDR, PCIe, and eTSEC signals; however, SerDes lane mapping and security engine register layout differ between P1 and P2 families, requiring firmware adaptation.
What cryptographic algorithms does the integrated SEC 3.3 engine in P1011NXE2DFB support?
The SEC 3.3 engine in P1011NXE2DFB supports AES-128/192/256 (ECB/CBC/CTR/GCM), 3DES-EDE, RSA up to 4096-bit, ECC NIST P-256/P-384, SHA-1/224/256/384/512, MD5, ARC4, Snow3G, and FIPS-compliant deterministic random number generation. It performs single-pass IPsec ESP/AH and SSL/TLS record processing, enabling full TLS 1.2 handshake offload in firmware stacks like OpenSSL and wolfSSL when integrated with P1011NXE2DFB.
P1011NXE2DFB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 689-BBGA Exposed Pad
- Series:
- *
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 689-TEPBGA II (31x31)
- Additional Interfaces:
- -
P1011NXE2DFB FAQ
1.How can I place an order for P1011NXE2DFB through Aetrix?
Please submit a Request for Quotation (RFQ) for P1011NXE2DFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P1011NXE2DFB reliable?
The price and inventory of P1011NXE2DFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P1011NXE2DFB is usually 5 days.
3.What payment methods are accepted for P1011NXE2DFB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P1011NXE2DFB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P1011NXE2DFB?
P1011NXE2DFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P1011NXE2DFB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P1011NXE2DFB?
For technical support, including P1011NXE2DFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P1011NXE2DFB requirements.
6.How does Aetrix verify that P1011NXE2DFB is sourced from the original manufacturer or authorized distributors?
All P1011NXE2DFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P1011NXE2DFB meets industry standards.
7.What is the process for return or replacement of P1011NXE2DFB?
All P1011NXE2DFB units undergo pre-shipment inspection (PSI). If there is an issue with P1011NXE2DFB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P1011NXE2DFB part is unused and in its original packaging.
Return procedure for P1011NXE2DFB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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