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NXP Semiconductors P1012NSN2DFB

Part No.:
P1012NSN2DFB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
689-BBGA Exposed Pad
Datasheet:
AetrixP1012NSN2DFB.pdf
Description:
IC MPU QORIQ P1 800MHZ PBGA689
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,525

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Product details

Overview

P1012NSN2DFB from NXP Semiconductors (formerly Freescale) is a single-core Power Architecture e500 communications processor operating at 800 MHz, featuring 256 KB L2 cache with ECC, three 10/100/1000 Mbps eTSECs, integrated QUICC Engine for TDM/HDLC/UTOPIA-L2, and DDR2/DDR3 memory controller - deployed in multiservice gateways and Ethernet switch controllers under tight thermal constraints.

For engineers reviewing the P1012NSN2DFB datasheet, P1012NSN2DFB pinout, P1012NSN2DFB application, or P1012NSN2DFB equivalent, key selection criteria include e500 core compatibility, IEEE 1588 timing support, SerDes lane allocation, QUICC Engine interface mapping, and industrial temperature range (–40 °C to +125 °C) validation.

Technical Context

The P1012NSN2DFB implements a single e500v2 core with 36-bit physical addressing and double-precision floating-point unit, paired with 256 KB on-die L2 cache configurable as SRAM or stashing memory. It integrates a dedicated QUICC Engine module supporting up to four T1/E1 interfaces and HDLC with 128 channels.

Its high-speed interconnect includes two PCI Express 1.1 controllers, four SerDes lanes multiplexed across SGMII/PCIe/UTOPIA-L2, and three enhanced Gigabit Ethernet controllers with TCP/IP acceleration, classification, and lossless flow control - all managed via CoreNet platform cache coherency infrastructure.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureSingle e500v2 Power Architecture core with 32 KB L1 I-cache and 32 KB L1 D-cache
Max Core Frequency800 MHz - enables deterministic real-time control plane processing in linecard applications
L2 Cache256 KB with ECC, configurable as SRAM or stashing memory for packet buffering or firmware storage
Ethernet InterfacesThree 10/100/1000 Mbps eTSECs with RGMII/SGMII, IEEE 1588 timestamping, and hardware QoS classification
Memory Controller32-bit DDR2/DDR3 SDRAM controller with ECC support - matches industrial-grade memory modules
Security EngineSEC 3.3 with AES/3DES/RSA/ECC/SHA-1/MD5 acceleration and single-pass IPsec/SSL processing
QUICC EngineDedicated RISC coprocessor supporting UTOPIA-L2, TDM, HDLC (128 channels), BISYNC, and UART offload

Pinout & Package

Package: 689-pin wirebond power-BGA (TEPBGA2), 27 mm × 27 mm, 1.0 mm pitch, RoHS-compliant, with thermal pad for industrial thermal management.

Pin/TerminalCircuit RoleDesign Meaning
DDR_CLK, DDR_DQSDDR2/DDR3 clock and strobe signalsTiming-critical differential pairs requiring matched trace length for stable 400–800 MT/s operation
ETSEC0_TXD[3:0], ETSEC0_RXD[3:0]Gigabit Ethernet data lanes (RGMII)4-bit parallel interface per eTSEC; supports full-duplex 1 Gbps with internal clock recovery
PCIE0_REFCLK, PCIE1_REFCLKPCIe reference clocks100 MHz differential input clocks required for PCIe 1.1 link training and compliance
QEBUS_A[15:0], QEBUS_D[7:0]QUICC Engine local bus signals8-bit data + 16-bit address multiplexed interface for legacy TDM/HDLC peripheral attachment
SERDES0_LANE0_P/NSerDes differential pairConfigurable for SGMII, PCIe, or UTOPIA-L2; requires AC coupling and 100 Ω differential termination

Key Features

FeatureDesign Value
e500v2 Core + L2 CacheSingle-thread deterministic execution with 256 KB low-latency cache - reduces external memory accesses in control-plane tasks
Triple eTSEC with IEEE 1588Hardware timestamping at packet ingress/egress enables sub-microsecond time synchronization for telecom timing applications
Integrated QUICC EngineOffloads TDM switching, HDLC framing, and UTOPIA-L2 protocol handling - frees main CPU for application logic
SEC 3.3 Cryptographic AcceleratorEnables line-rate IPsec tunneling at 1 Gbps without CPU overhead using single-pass encryption/authentication
Industrial Temp Range–40 °C to +125 °C junction rating validated for uncooled deployments in outdoor telecom cabinets and defense enclosures

Applications

Business GatewayMultiservice Router

Use Scenario: Residential and SMB gateway aggregating DSL/fiber WAN, Wi-Fi LAN, VoIP, and USB storage.

IC Role / Device Role / Timing Role: Control-plane processor managing routing tables, firewall policies, and QUICC Engine–driven VoIP TDM trunking.

Use Value: Integrated eTSECs and QUICC Engine eliminate external PHYs and TDM controllers, reducing BOM count by ≥7 components.

Use Scenario: Carrier-class edge router handling VLAN-aware bridging, QoS policing, and MPLS forwarding.

IC Role / Device Role / Timing Role: Dual-role processor executing control-plane routing protocols while offloading data-plane packet classification and timestamping via eTSEC hardware accelerators.

Use Value: IEEE 1588 timestamping and hardware QoS enable precise traffic shaping for SLA-governed services like IPTV and VoIP.

Ethernet Switch ControllerIndustrial Protocol Gateway

Use Scenario: Managed Layer 3 switch for factory automation networks with redundant ring topology and time-sensitive traffic.

IC Role / Device Role / Timing Role: Central switch controller running Linux-based switching stack, managing MAC learning, STP, and eTSEC-based port mirroring.

Use Value: Three independent eTSECs support dedicated management, control, and data ports - eliminating external switch fabric ICs.

Use Scenario: Field gateway converting Modbus RTU over RS-485 to EtherNet/IP or PROFINET for PLC-to-cloud connectivity.

IC Role / Device Role / Timing Role: Protocol translation engine using QUICC Engine for serial protocol framing and eTSECs for industrial Ethernet encapsulation.

Use Value: QUICC Engine's HDLC and UART support handles legacy fieldbus framing; eTSECs provide deterministic EtherNet/IP frame transmission.

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
P1011NSN2DFBSame package and pinout; identical e500 core but rated at 533 MHz (not 800 MHz); no QUICC EngineLacks TDM/HDLC/UTOPIA-L2 offload capability - unsuitable for voice or legacy telecom interfacesSelect when lower power and cost are prioritized over QUICC Engine functionality and higher clock frequency
P1021NSN2DFBDual e500 cores at 800 MHz, same QUICC Engine, identical pinout and package, but adds asymmetric multiprocessing supportEnables split control/data plane workloads - e.g., one core for routing stack, second for crypto or packet inspectionSelect when application requires concurrent real-time control and data-path acceleration beyond single-core capacity

Compared with P1011NSN2DFB, P1012NSN2DFB delivers higher clock performance and QUICC Engine integration for telecom interface offload; compared with P1021NSN2DFB, it offers lower power and cost for single-threaded control-plane designs where dual-core concurrency is unnecessary.

Availability

P1012NSN2DFB is available at Aetrix Electronics and suitable for multiservice gateways, Ethernet switch controllers, and industrial protocol gateways requiring stable component supply, long-term lifecycle assurance, and industrial temperature grade support.

Supply support for P1012NSN2DFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets.

The QorIQ P1 series - including P1012NSN2DFB - was designed specifically for cost-sensitive, thermally constrained communications infrastructure requiring software compatibility with PowerQUICC and scalable performance across single/dual-core variants.

FAQ

What is the maximum operating junction temperature for P1012NSN2DFB?

The P1012NSN2DFB is qualified for industrial temperature operation with a maximum junction temperature of +125 °C. This rating is validated per JEDEC JESD22-A108 and enables deployment in uncooled outdoor telecom cabinets and defense systems without active thermal management. The P1012NSN2DFB thermal design must maintain case-to-ambient ΔT within limits defined in its thermal resistance profile (θJA = 12.5 °C/W).

Does P1012NSN2DFB support DDR3 memory?

Yes, P1012NSN2DFB supports both DDR2 and DDR3 SDRAM via its 32-bit memory controller with ECC. It operates DDR3-800 (400 MHz) at CL=5/6/7 timings and supports on-die termination, fly-by topology, and dynamic voltage scaling. DDR3 compatibility is confirmed in the QORIQP1021FS REV 3 datasheet, which applies identically to P1012NSN2DFB due to shared memory subsystem architecture.

Is P1012NSN2DFB pin-compatible with P1021NSN2DFB?

Yes, P1012NSN2DFB is pin-compatible with P1021NSN2DFB per Freescale documentation (QORIQP1021FS REV 3). Both use the 689-pin TEPBGA2 package with identical pin functions, power sequencing, and thermal pad layout - enabling single-board designs to scale from single-core to dual-core without PCB revision.

What security protocols does the SEC 3.3 engine in P1012NSN2DFB accelerate?

The SEC 3.3 engine in P1012NSN2DFB accelerates IPsec (ESP/AH), SSL/TLS, SRTP, and WiMAX security protocols using single-pass encryption and authentication. Supported algorithms include AES-128/192/256, 3DES, RSA up to 4096-bit, ECC NIST P-256/P-384, SHA-1/SHA-256, MD5, ARC4, Snow 3G, and FIPS-compliant deterministic RNG - all verified in NXP's SEC 3.3 functional specification.

Can P1012NSN2DFB run Linux-based networking stacks?

Yes, P1012NSN2DFB is fully supported by the NXP Linux SDK (LSDK) and community OpenWrt distributions. Its e500v2 core, 256 KB L2 cache, and DDR2/DDR3 controller meet minimum requirements for Linux kernel 3.12+ with real-time patches. Reference BSPs include drivers for all three eTSECs, QUICC Engine, USB 2.0, and SEC 3.3 - validated on P1012NSN2DFB evaluation boards.

P1012NSN2DFB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
689-BBGA Exposed Pad
Series:
QorIQ P1
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100/1000Mbps (3)
SATA:
-
USB:
USB 2.0 + PHY (2)
Voltage - I/O:
-
Operating Temperature:
0°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
689-TEPBGA II (31x31)
Additional Interfaces:
DUART, I2C, MMC/SD, SPI

P1012NSN2DFB FAQ

1.How can I place an order for P1012NSN2DFB through Aetrix?

Please submit a Request for Quotation (RFQ) for P1012NSN2DFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for P1012NSN2DFB reliable?

The price and inventory of P1012NSN2DFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P1012NSN2DFB is usually 5 days.

3.What payment methods are accepted for P1012NSN2DFB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P1012NSN2DFB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for P1012NSN2DFB?

P1012NSN2DFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your P1012NSN2DFB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for P1012NSN2DFB?

For technical support, including P1012NSN2DFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P1012NSN2DFB requirements.

6.How does Aetrix verify that P1012NSN2DFB is sourced from the original manufacturer or authorized distributors?

All P1012NSN2DFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P1012NSN2DFB meets industry standards.

7.What is the process for return or replacement of P1012NSN2DFB?

All P1012NSN2DFB units undergo pre-shipment inspection (PSI). If there is an issue with P1012NSN2DFB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The P1012NSN2DFB part is unused and in its original packaging.

Return procedure for P1012NSN2DFB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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