NXP Semiconductors P1013NSE2HFB
- Part No.:
- P1013NSE2HFB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 689-BBGA Exposed Pad
- Datasheet:
-
P1013NSE2HFB.pdf
- Description:
- IC MPU QORIQ P1 1.055GHZ PBGA689
- Quantity:
- Payment:

- Shipping:

Inventory:2,897
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Product details
Overview
P1013NSE2HFB from NXP Semiconductors (formerly Freescale) is a single-core Power Architecture® e500v2 embedded processor designed for energy-efficient IP networking and media processing applications. It features a 600 MHz–1055 MHz core clock, 256 KB L2 cache with ECC, dual Gigabit Ethernet controllers (eTSEC), DDR2/DDR3 memory controller, and advanced power management including packet-lossless deep-sleep mode.
For engineers reviewing the P1013NSE2HFB datasheet, P1013NSE2HFB pinout, P1013NSE2HFB application, or P1013NSE2HFB equivalent, key selection criteria include its single e500v2 core performance envelope, RGMII/SGMII Ethernet interface support, 689-pin TEPBGA package compatibility, and suitability for fanless industrial control plane and protocol processing designs.
Technical Context
The P1013NSE2HFB implements a single e500v2 core with 36-bit physical addressing, double-precision floating-point unit, and Signal Processing Engine (SPE) APU. Its on-chip interconnect supports coherency-aware DMA, virtualized Ethernet offload, and SerDes-lane multiplexing across SGMII, SATA, and PCIe interfaces.
Unlike the dual-core P1022, the P1013NSE2HFB omits the coherency module and second e500v2 core but retains identical peripheral integration-including dual USB 2.0 (EHCI/ULPI), SD/MMC host controller, eLBC, I²C, DUART, timers, and advanced power management with jog (dynamic frequency scaling) and packet-lossless deep-sleep wake sources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single Power Architecture® e500v2 core with SPE APU and double-precision FPU |
| Max Core Frequency | 1055 MHz - enables high-throughput protocol stack execution in compact thermal envelopes |
| L2 Cache | 256 KB with ECC - configurable as SRAM/stashing memory for deterministic real-time data buffering |
| Memory Interface | 64-bit DDR2/DDR3 SDRAM controller with ECC - supports up to 8 GB addressable memory for media buffering |
| Ethernet Interfaces | Dual 10/100/1000 Mbps eTSEC with RGMII/SGMII - enables simultaneous LAN/WAN or backplane/management port connectivity |
| Power Management | Packet-lossless deep-sleep, jog, doze, nap modes - allows sub-100 mW idle power while preserving packet context |
| Package | 689-pin TEPBGA (27 mm × 27 mm, 1.0 mm pitch) - optimized for 6-layer PCB routing and thermal dissipation |
Pinout & Package
689-pin Thermally Enhanced Plastic Ball Grid Array (TEPBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant, with exposed thermal pad. Designed for low-cost 6-layer board implementation and fanless operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Primary reference clock input | Accepts 33–100 MHz differential or single-ended clock for system timing synchronization |
| RGMII_TXD[3:0]/RGMII_RXD[3:0] | Gigabit Ethernet data lanes | Supports 10/100/1000 Mbps RGMII interface with 1.8 V I/O voltage for PHY interfacing |
| DDR_DQ[63:0]/DDR_DM[7:0] | DDR2/DDR3 data bus | 64-bit bidirectional data path with byte-level masking for ECC-capable memory transactions |
| USB0_DP/USB0_DM | USB 2.0 differential pair | EHCI-compliant host/device interface with ULPI PHY support for peripheral or OTG connectivity |
| SDCKE[1:0]/SDCS[1:0] | SD/MMC interface control | Enables dual-slot SDHC/SDXC card support with 4-bit or 8-bit wide data transfer |
Key Features
| Feature | Design Value |
|---|---|
| Single e500v2 core with SPE APU | Enables real-time signal processing (e.g., VoIP echo cancellation, media transcoding) without external DSP |
| Virtualized enhanced three-speed Ethernet (eTSEC) | Offloads TCP/IP checksum, classification, and IEEE 1588 timestamping to reduce CPU load by >40% in routing stacks |
| Packet-lossless deep-sleep mode | Maintains full Ethernet packet buffer state while powering down >90% of logic, enabling <50 µs wake latency |
| 64-bit DDR2/DDR3 controller with ECC | Supports error detection/correction for mission-critical control plane applications requiring >10⁹ MTBF |
| 689-pin TEPBGA with thermal pad | Enables 2.5 W typical power dissipation at 1055 MHz with passive heatsinking in industrial temperature range |
Applications
| Industrial Control Plane | Secure Remote Access Gateway |
|---|---|
Use Scenario: Real-time protocol translation between Modbus TCP and DNP3 in substation automation systems. IC Role / Device Role / Timing Role: Central control processor executing deterministic Linux RT kernel with hardware-accelerated crypto and time-sync via IEEE 1588. Use Value: Single-chip integration eliminates external crypto IC and timing IC, reducing BOM count by 3 components and PCB area by 28%. | Use Scenario: Low-power branch office firewall handling encrypted VPN tunnels and stateful packet inspection. IC Role / Device Role / Timing Role: Application processor managing OpenWrt with hardware-accelerated IPsec/SSL offload and dual-Gigabit Ethernet bridging. Use Value: Packet-lossless deep-sleep mode cuts standby power to 85 mW while maintaining always-on TLS session resumption capability. |
| Media Edge Node | Embedded Storage Controller |
Use Scenario: Video analytics edge node capturing and preprocessing HD streams from four IP cameras before cloud upload. IC Role / Device Role / Timing Role: Media processing engine running GStreamer pipelines with SPE-assisted H.264 encoding and RGMII-based camera streaming. Use Value: Dual eTSEC interfaces enable dedicated camera ingress and WAN egress paths, eliminating software switching bottlenecks. | Use Scenario: RAID-1 NAS controller with local SATA storage, remote SMB/CIFS access, and scheduled backup over Ethernet. IC Role / Device Role / Timing Role: Host controller managing two SATA II ports, DDR3 memory for write caching, and eLBC-connected flash for firmware storage. Use Value: Integrated XOR acceleration reduces RAID parity calculation latency by 65%, enabling sustained 110 MB/s sequential writes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548ECVRAGDB | Single e500 core, 1.33 GHz max, no integrated eTSEC, requires external PHY and memory controller | Lacks integrated Ethernet and DDR controller - demands additional silicon and layout complexity | Select when legacy PowerQUICC III software compatibility is required and system-level integration is handled externally |
| LX2160A | 16-core ARM Cortex-A72, 2.0 GHz, integrated 10GbE, no Power Architecture or SPE support | Requires full software re-architecture; lacks IEEE 1588 hardware timestamping and packet-lossless sleep | Select for new designs targeting higher throughput and ARM ecosystem tooling, not for migration from Power Architecture codebase |
Compared with MPC8548ECVRAGDB, P1013NSE2HFB reduces component count via integrated eTSEC and DDR controller; compared with LX2160A, it preserves Power Architecture toolchain continuity and deterministic low-power states critical for fanless edge deployment.
Availability
P1013NSE2HFB is available at Aetrix Electronics and suitable for industrial control plane, secure remote access gateway, and media edge node applications requiring stable component supply, long-term lifecycle assurance, and extended temperature grade availability.
Supply support for P1013NSE2HFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The P1013NSE2HFB belongs to NXP's QorIQ P1 Series, engineered specifically for energy-efficient, fanless embedded communications processing in space-constrained, thermally sensitive environments such as industrial gateways and edge media nodes.
FAQ
What is the maximum operating frequency of the P1013NSE2HFB?
The P1013NSE2HFB operates at a maximum core frequency of 1055 MHz. This speed is achievable under specified thermal and voltage conditions per the official NXP datasheet QP1022FS REV 1. The P1013NSE2HFB uses dynamic frequency scaling (jog mode) to adjust clock rate in real time based on workload, ensuring optimal performance-per-watt without exceeding thermal limits in fanless deployments.
Does the P1013NSE2HFB support IEEE 1588 Precision Time Protocol?
Yes, the P1013NSE2HFB supports IEEE 1588 hardware timestamping through its dual enhanced three-speed Ethernet controllers (eTSEC). Each eTSEC provides nanosecond-resolution timestamp insertion and extraction on transmit/receive paths, enabling sub-microsecond time synchronization in industrial automation and telecom timing applications without software overhead.
Is the P1013NSE2HFB pin-compatible with the P1022 processor?
No, the P1013NSE2HFB is not pin-compatible with the P1022. Although both use the same 689-pin TEPBGA package, the P1022 requires additional signals for its second e500v2 core, coherency module, and dual L2 cache banks - resulting in different pin assignments and power sequencing requirements. Board-level reuse is not possible without redesign.
What memory technologies does the P1013NSE2HFB support?
The P1013NSE2HFB supports DDR2 and DDR3 SDRAM via its integrated 64-bit memory controller with ECC. It does not support LPDDR, GDDR, or legacy SDR SDRAM. Maximum supported density is 8 GB using x8 or x16 DRAM devices, with configurable burst lengths, CAS latencies, and refresh rates aligned to JEDEC DDR2/DDR3 standards.
Does the P1013NSE2HFB include hardware encryption acceleration?
The P1013NSE2HFB does not integrate the optional Security Engine found in some P1022 variants. It lacks dedicated crypto accelerators for AES, SHA, RSA, or XOR. Encryption tasks must be performed in software or via external security ICs - a key differentiator from P1022 models marked "SEC" in their suffix.
P1013NSE2HFB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 689-BBGA Exposed Pad
- Series:
- QorIQ P1
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500v2
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.055GHz
- Co-Processors/DSP:
- Security; SEC
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- SATA 3Gbps (2)
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography, Random Number Generator
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 689-TEPBGA II (31x31)
- Additional Interfaces:
- DUART, I2C, I2S, MMC/SD, SPI
P1013NSE2HFB FAQ
1.How can I place an order for P1013NSE2HFB through Aetrix?
Please submit a Request for Quotation (RFQ) for P1013NSE2HFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P1013NSE2HFB reliable?
The price and inventory of P1013NSE2HFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P1013NSE2HFB is usually 5 days.
3.What payment methods are accepted for P1013NSE2HFB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P1013NSE2HFB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P1013NSE2HFB?
P1013NSE2HFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P1013NSE2HFB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P1013NSE2HFB?
For technical support, including P1013NSE2HFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P1013NSE2HFB requirements.
6.How does Aetrix verify that P1013NSE2HFB is sourced from the original manufacturer or authorized distributors?
All P1013NSE2HFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P1013NSE2HFB meets industry standards.
7.What is the process for return or replacement of P1013NSE2HFB?
All P1013NSE2HFB units undergo pre-shipment inspection (PSI). If there is an issue with P1013NSE2HFB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P1013NSE2HFB part is unused and in its original packaging.
Return procedure for P1013NSE2HFB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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