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NXP Semiconductors P1013NSN2EFB
- Part No.:
- P1013NSN2EFB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 689-BBGA Exposed Pad
- Datasheet:
-
P1013NSN2EFB.pdf
- Description:
- IC MPU QORIQ P1 1.055GHZ PBGA689
- Quantity:
- Payment:
- Shipping:
Inventory:4,373
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Product details
Overview
P1013NSN2EFB from NXP Semiconductors (formerly Freescale) is a single-core Power Architecture® e500v2 embedded processor for IP networking and media processing applications. It features 600 MHz core frequency, 256 KB L2 cache with ECC, DDR2/DDR3 memory controller, dual Gigabit Ethernet (eTSEC), and advanced power management including packet-lossless deep-sleep mode.
For engineers reviewing the P1013NSN2EFB datasheet, P1013NSN2EFB pinout, P1013NSN2EFB application, or P1013NSN2EFB equivalent, key selection criteria include its single e500v2 core performance envelope, TEPBGA-689 package compatibility, IEEE 1588 support in eTSEC, SerDes lane allocation (x4 PCIe + x2 SGMII), and absence of LCD/I2S/TDM interfaces compared to P1022.
Technical Context
The P1013NSN2EFB implements a single e500v2 core with 36-bit physical addressing, double-precision floating-point unit, and Signal Processing Engine (SPE) APU. Its memory subsystem includes a 64-bit DDR2/DDR3 SDRAM controller with ECC and 256 KB configurable L2 cache supporting SRAM/stashing modes.
Connectivity is delivered via two virtualized enhanced three-speed Ethernet controllers (eTSEC) with TCP/IP offload and IEEE 1588 timestamping, six SerDes lanes multiplexed across PCIe (x4 + two x1), SGMII, and SATA, plus dual USB 2.0, SD/MMC, SPI, I²C, DUART, and eLBC - but excludes LCD, I2S, and TDM interfaces present in the dual-core P1022.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single Power Architecture e500v2 core with SPE APU and double-precision FPU |
| Core Frequency | 600 MHz - fixed clock speed defining real-time deterministic throughput |
| L2 Cache | 256 KB with ECC, configurable as SRAM or stashing memory for latency-critical buffers |
| Memory Interface | 64-bit DDR2/DDR3 SDRAM controller with ECC - supports up to 8 GB addressable memory |
| Ethernet Controllers | Dual eTSEC with RGMII/SGMII, IEEE 1588 timestamping, and TCP/IP classification offload |
| SerDes Configuration | Six lanes: one x4 PCIe, two x1 PCIe, two SGMII - no SATA or LCD interface support |
| Power Management | Packet-lossless deep-sleep, doze, nap, and jog (dynamic frequency scaling) modes |
Pinout & Package
Package: 689-pin TEPBGA (Thermally Enhanced Plastic Ball Grid Array), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant, designed for 6-layer PCB routing with fanless thermal operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Primary reference clock input | Accepts 33–100 MHz differential or single-ended clock for system timing synchronization |
| RGMII0_TXD[3:0] | Gigabit Ethernet TX data bus | Drives 4-bit parallel data at 125 MHz for first eTSEC interface in RGMII mode |
| PCIe_RXP/N[0:3] | PCIe Gen1 differential receive pair | Supports x4 link on lanes 0–3; used for high-bandwidth host/device interconnect |
| DDR_DQ[63:0] | DDR2/DDR3 data bus | 64-bit bidirectional data path with DQS strobes for burst-mode memory access |
| USB0_DP/DM | USB 2.0 differential data pair | ULPI-compliant interface to external PHY for host/device enumeration and 480 Mbps transfer |
| GPIO_0–GPIO_86 | General-purpose I/O bank | 87 configurable signals for board-level control, status monitoring, and peripheral enable logic |
Key Features
| Feature | Design Value |
|---|---|
| Single e500v2 core with SPE APU | Enables real-time signal processing tasks (e.g., VoIP echo cancellation, packet classification) without dual-core OS overhead |
| Packet-lossless deep-sleep mode | Removes power from major logic blocks while preserving packet buffer state - critical for low-latency wake-on-LAN in security gateways |
| Dual eTSEC with IEEE 1588 | Provides hardware timestamping accuracy <±50 ns for time-sensitive industrial Ethernet and telecom synchronization |
| Configurable 256 KB L2 cache | Can be partitioned as 128 KB cache + 128 KB SRAM for deterministic DMA buffer storage in storage controllers |
| 64-bit DDR3 memory controller with ECC | Supports error detection/correction for mission-critical control plane firmware execution in enterprise routers |
Applications
| Enterprise Router Control Plane | Industrial Ethernet Gateway |
|---|---|
Use Scenario: Managing routing tables, BGP/OSPF protocol stacks, and CLI configuration in compact 1U rack-mounted routers. IC Role / Device Role / Timing Role: Single-core application processor executing Linux-based control software with deterministic interrupt latency under 5 µs. Use Value: Integrated eTSEC and PCIe eliminate external switch ICs; deep-sleep mode reduces idle power to <1.2 W for energy-certified deployments. | Use Scenario: Bridging PROFINET, EtherNet/IP, and Modbus TCP networks in factory automation cabinets. IC Role / Device Role / Timing Role: Real-time protocol translation engine using eTSEC timestamping and GPIO-triggered event logging. Use Value: IEEE 1588 support enables sub-microsecond clock synchronization across distributed I/O nodes without external grandmaster clocks. |
| Secure Remote Access Appliance | Media Streaming Edge Node |
Use Scenario: SSL/TLS termination and firewall policy enforcement in branch office VPN concentrators. IC Role / Device Role / Timing Role: Embedded processor hosting OpenWrt with optional crypto acceleration engine enabled for IPsec packet processing. Use Value: Hardware XOR and AES engines offload 85% of encryption cycles, sustaining 350 Mbps encrypted throughput at <2 W total SoC power. | Use Scenario: Transcoding and multicast forwarding of HD video streams in digital signage controllers. IC Role / Device Role / Timing Role: Application processor running GStreamer pipelines with DMA-managed frame buffers via DDR3 interface. Use Value: 64-bit DDR3 bandwidth (up to 10.6 GB/s) sustains simultaneous decode of two 1080p@30 streams with zero frame drops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548ECVRAGDB | Single e500 core, 1.33 GHz, no integrated SerDes; requires external PCIe switch and PHYs | Lacks integrated eTSEC and SerDes - needs more board area and power for equivalent connectivity | Select when legacy PowerQUICC III toolchain compatibility is required over QorIQ energy efficiency |
| LX2160A | 16-core ARM Cortex-A72, 2.0 GHz, integrated 10GbE, no Power Architecture ISA support | Higher aggregate throughput but incompatible software stack; requires full OS porting | Select for new designs needing >10 Gbps line-rate processing where ARM ecosystem alignment outweighs ISA continuity |
Compared with MPC8548ECVRAGDB, P1013NSN2EFB reduces BOM count by integrating SerDes and eTSEC; versus LX2160A, it preserves Power Architecture toolchains and deterministic low-power states but trades raw core count for per-core efficiency in control-plane workloads.
Availability
P1013NSN2EFB is available at Aetrix Electronics and suitable for enterprise networking, industrial Ethernet gateways, and secure remote access appliances requiring stable component supply and long-term lifecycle support.
Supply support for P1013NSN2EFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The P1013NSN2EFB belongs to the QorIQ P1 Series, designed specifically for energy-efficient, single-core embedded communications processing in space-constrained, thermally sensitive networking equipment.
FAQ
What is the maximum DDR3 memory speed supported by P1013NSN2EFB?
The P1013NSN2EFB supports DDR3-1333 (667 MHz data rate) with 64-bit bus width and ECC capability. Its memory controller delivers up to 10.6 GB/s theoretical bandwidth, validated for use with Micron MT41K256M16TW-125 and Samsung K4B2G1646F-BCH9 modules in industrial temperature-grade configurations.
Does P1013NSN2EFB include an integrated security engine?
The P1013NSN2EFB supports an optional integrated security engine with hardware acceleration for AES, 3DES, SHA, and RSA operations. This module is factory-configurable and must be enabled during boot via RCW (Reset Configuration Word); it is not active by default and requires specific firmware initialization to perform IPsec or SSL offload.
Can P1013NSN2EFB operate in extended temperature range?
Yes, P1013NSN2EFB is available in an extended temperature grade (–40°C to +105°C) denoted by the "E" suffix in the part number. The NSN2EFB variant meets this specification and is qualified for deployment in outdoor telecom cabinets and industrial control enclosures without forced cooling.
Is P1013NSN2EFB pin-compatible with P1022 processors?
No, P1013NSN2EFB is not pin-compatible with any P1022 variant. Although both use the 689-pin TEPBGA package, pin functions differ significantly - notably, P1013 lacks LCD, I2S, and TDM interface pins present on P1022, and reallocates SerDes lane assignments. PCB layout must be redesigned for P1013NSN2EFB.
What boot sources are supported by P1013NSN2EFB?
P1013NSN2EFB supports boot from NOR flash (via eLBC), NAND flash (with BCH ECC), SD/MMC card, and serial peripheral interface (SPI) flash. Boot sequence is configured via strapping pins and RCW, with primary boot image loaded into internal SRAM before DDR initialization and Linux kernel decompression.
P1013NSN2EFB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 689-BBGA Exposed Pad
- Series:
- QorIQ P1
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500v2
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.055GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- SATA 3Gbps (2)
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 689-TEPBGA II (31x31)
- Additional Interfaces:
- DUART, I2C, I2S, MMC/SD, SPI
P1013NSN2EFB FAQ
1.How can I place an order for P1013NSN2EFB through Aetrix?
Please submit a Request for Quotation (RFQ) for P1013NSN2EFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P1013NSN2EFB reliable?
The price and inventory of P1013NSN2EFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P1013NSN2EFB is usually 5 days.
3.What payment methods are accepted for P1013NSN2EFB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P1013NSN2EFB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P1013NSN2EFB?
P1013NSN2EFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P1013NSN2EFB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P1013NSN2EFB?
For technical support, including P1013NSN2EFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P1013NSN2EFB requirements.
6.How does Aetrix verify that P1013NSN2EFB is sourced from the original manufacturer or authorized distributors?
All P1013NSN2EFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P1013NSN2EFB meets industry standards.
7.What is the process for return or replacement of P1013NSN2EFB?
All P1013NSN2EFB units undergo pre-shipment inspection (PSI). If there is an issue with P1013NSN2EFB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P1013NSN2EFB part is unused and in its original packaging.
Return procedure for P1013NSN2EFB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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