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NXP Semiconductors P1013NSN2MHB
- Part No.:
- P1013NSN2MHB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 689-BBGA Exposed Pad
- Datasheet:
-
P1013NSN2MHB.pdf
- Description:
- IC MPU QORIQ P1 1.055GHZ PBGA689
- Quantity:
- Payment:
- Shipping:
Inventory:3,094
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Product details
Overview
P1013NSN2MHB from NXP Semiconductors (formerly Freescale) is a single-core Power Architecture® e500v2 embedded processor designed for energy-efficient IP networking and media processing applications. It delivers 600–1055 MHz core frequency, 256 KB L2 cache with ECC, dual 10/100/1000 Mbps Ethernet controllers (eTSEC), DDR2/DDR3 memory controller with ECC, and advanced power management including packet-lossless deep-sleep mode.
For engineers reviewing the P1013NSN2MHB datasheet, P1013NSN2MHB pinout, P1013NSN2MHB application, or P1013NSN2MHB equivalent, key selection considerations include its single e500v2 core configuration, 689-pin TEPBGA package, IEEE 1588 support, TCP/IP offload capability, and compatibility with QorIQ P1-series software and toolchain ecosystems.
Technical Context
The P1013NSN2MHB implements a single e500v2 core with 36-bit physical addressing, double-precision floating-point unit, and Signal Processing Engine (SPE) APU. Its on-chip interconnect supports coherency-aware system bus arbitration and integrates dual-channel DMA, enhanced local bus controller (eLBC), and programmable interrupt controller compliant with Open-PIC standard.
It features a 64-bit DDR2/DDR3 SDRAM controller with ECC, two virtualized enhanced three-speed Ethernet controllers (eTSEC) supporting RGMII/SGMII, and six SerDes lanes multiplexed across PCI Express®, SATA, and SGMII interfaces - though SATA and LCD/DIU are not present on P1013 variants per official block diagram.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single Power Architecture® e500v2 core with SPE APU and double-precision FPU |
| Core Frequency Range | 600 MHz to 1055 MHz - enables scalable performance tuning for thermal/power-constrained designs |
| L2 Cache | 256 KB with ECC - configurable as SRAM or stashing memory for deterministic real-time access |
| Memory Controller | 64-bit DDR2/DDR3 with ECC support - ensures data integrity in industrial and networking systems |
| Ethernet Interfaces | Dual 10/100/1000 Mbps eTSEC with IEEE 1588, TCP/IP offload, and RGMII/SGMII - reduces host CPU load in time-sensitive protocols |
| Power Management | Doze, nap, jog (DFS), and packet-lossless deep-sleep modes - meets ENERGY STAR and EU ErP Lot 9 requirements |
| Package | 689-pin TEPBGA (27 mm × 27 mm, 1.0 mm pitch) - optimized for 6-layer PCB routing and fanless operation |
Pinout & Package
Package: 689-pin Thermally Enhanced Plastic Ball Grid Array (TEPBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR_CLK, DDR_DQS | DDR2/DDR3 clock and strobe signals | Timing-critical interface requiring matched trace lengths for reliable 800 MT/s operation |
| RGMII_TXD[3:0], RGMII_RXD[3:0] | Gigabit Ethernet data lanes | Supports 10/100/1000 Mbps RGMII PHY interface with <1 ns skew tolerance |
| PCIe_REFCLK+, PCIe_REFCLK− | Differential reference clock input | Required for x1 PCI Express Gen1 link initialization; must meet ±50 ppm stability |
| USB_DP, USB_DM | USB 2.0 differential data pair | Complies with ULPI v1.1 timing; supports host/device mode via internal transceiver control |
| SD_CMD, SD_CLK, SD_DAT[3:0] | Secure Digital host interface | Enables boot-from-SD/MMC and field firmware updates without external SPI flash |
| GPIO_0–GPIO_86 | General-purpose I/O signals | Configurable pull-up/down, slew rate, and drive strength; 3.3 V tolerant with 5 V-safe options |
Key Features
| Feature | Design Value |
|---|---|
| Single e500v2 core with SPE APU | Enables real-time signal processing tasks (e.g., VoIP echo cancellation, audio codec acceleration) without multicore OS complexity |
| IEEE 1588 Precision Time Protocol support | Allows sub-microsecond time synchronization across distributed Ethernet nodes in industrial automation and telecom timing applications |
| Packet-lossless deep-sleep mode | Reduces dynamic power to <50 mW while preserving full packet buffer state and enabling wake-on-LAN/USB/GPIO |
| Virtualized eTSEC with TCP/IP offload | Offloads checksum calculation, segmentation, and classification from main CPU - freeing >15% core cycles in high-throughput routing |
| 64-bit DDR2/DDR3 controller with ECC | Supports up to 8 GB addressable memory with single-bit error correction and double-bit error detection for mission-critical uptime |
Applications
| Industrial Ethernet Gateway | Secure Remote Access Appliance |
|---|---|
Use Scenario: Connecting legacy Modbus/PROFIBUS devices to cloud-based SCADA over secure TLS tunnels. IC Role / Device Role / Timing Role: Control-plane processor handling protocol translation, TLS handshake, and real-time Ethernet frame scheduling. Use Value: IEEE 1588 synchronization ensures deterministic latency for motion control traffic; eTSEC offload maintains 950 Mbps throughput under encryption load. | Use Scenario: Deploying zero-trust edge firewalls in branch offices with integrated VPN, intrusion prevention, and content filtering. IC Role / Device Role / Timing Role: Application processor executing Linux-based security stack while managing dual-Gigabit WAN/LAN interfaces. Use Value: Hardware-accelerated crypto engine (AES/SHA/RSA) enables 300+ Mbps IPsec throughput; DDR3 ECC prevents silent corruption in long-running sessions. |
| Media Streaming Bridge | Energy-Efficient Network Attached Storage |
Use Scenario: Converting HDMI video streams to RTSP-over-IP for surveillance analytics at the network edge. IC Role / Device Role / Timing Role: Media processing node performing H.264 encoding, RTP packetization, and QoS-aware streaming. Use Value: SPE APU accelerates motion estimation by 3× vs. pure software; RGMII interfaces ensure jitter-free 1080p60 transport. | Use Scenario: Fanless NAS enclosure supporting SMB/CIFS, DLNA, and backup services for small business environments. IC Role / Device Role / Timing Role: System-on-chip host managing dual SATA drives, Gigabit Ethernet, and USB 2.0 peripherals. Use Value: Packet-lossless deep-sleep cuts idle power to 1.2 W; eLBC interface allows direct NOR flash boot for firmware resilience. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548EVRAGDB | Single e500 core, 1.33 GHz max, no integrated eTSEC or SerDes; requires external PHY and PCIe switch | Lacks IEEE 1588, TCP offload, and integrated SATA - increases BOM count and board area | Choose when legacy PowerQUICC III toolchain compatibility is mandatory and cost-per-function outweighs integration benefits |
| LX2160A | 16-core ARM Cortex-A72, 2.0 GHz, integrated DPAA2, 10 GbE, PCIe Gen4 - significantly higher performance and power envelope | Targets next-gen SD-WAN and 5G CPE; incompatible software stack and thermal design | Choose for new designs requiring >5 Gbps throughput and containerized service deployment; not a drop-in replacement |
Compared with MPC8548EVRAGDB, P1013NSN2MHB reduces component count via integrated eTSEC and SerDes; compared with LX2160A, it offers lower power (3–5 W vs. 15–25 W) and proven qualification for extended temperature industrial use cases.
Availability
P1013NSN2MHB is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure remote access appliances, and energy-efficient network attached storage requiring stable component supply, long-term lifecycle support, and qualified extended-temperature variants.
Supply support for P1013NSN2MHB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The P1013NSN2MHB belongs to the QorIQ P1 series - a family of energy-efficient, single- and dual-core communications processors targeting cost-sensitive, thermally constrained embedded networking and media applications.
FAQ
What is the maximum supported DDR3 data rate for P1013NSN2MHB?
The P1013NSN2MHB supports DDR3-1333 (667 MHz clock, 1333 MT/s) with 64-bit bus width and on-die termination. It requires JEDEC-compliant DDR3 SDRAM modules with 8 banks and CL9–CL11 timing; ECC functionality is enabled by default and cannot be disabled in hardware.
Does P1013NSN2MHB include an integrated security engine?
No, the P1013NSN2MHB does not include the optional integrated security engine found on P1022 variants. Security functions such as AES or SHA acceleration require external cryptographic co-processors or software-only implementation. The P1013NSN2MHB retains XOR acceleration and basic RNG capabilities within its PMC module.
Is P1013NSN2MHB pin-compatible with P1022 processors?
No, P1013NSN2MHB is not pin-compatible with any P1022 variant. Although both use the same 689-pin TEPBGA package footprint, signal assignments differ significantly - especially for SerDes lane mapping, SATA pins (absent on P1013), and coherency module signals (not implemented on P1013). PCB redesign is required for migration.
What operating systems are officially supported on P1013NSN2MHB?
NXP provides validated Board Support Packages (BSPs) for Linux (based on Yocto Project 2.2 and later), VxWorks 7, and Green Hills INTEGRITY 17. The P1013NSN2MHB BSP includes drivers for eTSEC, DDR controller, USB 2.0, SD/MMC, and I2C; real-time determinism is achievable using INTEGRITY's partitioned scheduling model.
What thermal specifications apply to P1013NSN2MHB in extended temperature operation?
The P1013NSN2MHB is qualified for extended temperature operation from –40 °C to +105 °C (junction) when ordered with suffix "-E". This variant uses enhanced thermal packaging and undergoes burn-in testing; maximum power dissipation remains 3.8 W at 1055 MHz under worst-case ambient conditions with 200 LFM airflow.
P1013NSN2MHB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 689-BBGA Exposed Pad
- Series:
- QorIQ P1
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500v2
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.055GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- SATA 3Gbps (2)
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 689-TEPBGA II (31x31)
- Additional Interfaces:
- DUART, I2C, I2S, MMC/SD, SPI
P1013NSN2MHB FAQ
1.How can I place an order for P1013NSN2MHB through Aetrix?
Please submit a Request for Quotation (RFQ) for P1013NSN2MHB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P1013NSN2MHB reliable?
The price and inventory of P1013NSN2MHB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P1013NSN2MHB is usually 5 days.
3.What payment methods are accepted for P1013NSN2MHB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P1013NSN2MHB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P1013NSN2MHB?
P1013NSN2MHB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P1013NSN2MHB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P1013NSN2MHB?
For technical support, including P1013NSN2MHB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P1013NSN2MHB requirements.
6.How does Aetrix verify that P1013NSN2MHB is sourced from the original manufacturer or authorized distributors?
All P1013NSN2MHB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P1013NSN2MHB meets industry standards.
7.What is the process for return or replacement of P1013NSN2MHB?
All P1013NSN2MHB units undergo pre-shipment inspection (PSI). If there is an issue with P1013NSN2MHB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P1013NSN2MHB part is unused and in its original packaging.
Return procedure for P1013NSN2MHB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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