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NXP Semiconductors P1013NXN2EFB
- Part No.:
- P1013NXN2EFB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 689-BBGA Exposed Pad
- Datasheet:
-
P1013NXN2EFB.pdf
- Description:
- IC MPU QORIQ P1 1.055GHZ PBGA689
- Quantity:
- Payment:
- Shipping:
Inventory:1,484
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Product details
Overview
P1013NXN2EFB from NXP Semiconductors (formerly Freescale) is a single-core Power Architecture® e500v2 embedded processor for IP networking and media processing applications. It delivers 600–1055 MHz core frequency, 256 KB L2 cache with ECC, dual 10/100/1000 Mbps Ethernet controllers (eTSEC), DDR2/DDR3 memory controller, and advanced power management including packet-lossless deep-sleep mode - deployed in fanless industrial gateways and secure edge routers.
For engineers reviewing the P1013NXN2EFB datasheet, P1013NXN2EFB pinout, P1013NXN2EFB application, or P1013NXN2EFB equivalent, key selection criteria include its single e500v2 core configuration, 689-pin TEPBGA package, IEEE 1588-capable eTSECs, SerDes-configurable interfaces (PCIe/SATA/SGMII), and hardware-accelerated security engine option.
Technical Context
The P1013NXN2EFB implements a single e500v2 core with 36-bit physical addressing, double-precision floating-point unit, and Signal Processing Engine (SPE) APU. Its on-chip interconnect supports coherency-free operation and integrates dual DMA controllers, MPIC interrupt controller, and enhanced local bus controller (eLBC) for legacy peripheral bridging.
Unlike the dual-core P1022, the P1013NXN2EFB omits the coherency module and second core but retains identical peripheral sets: dual eTSECs with TCP/IP offload and IEEE 1588 support, 64-bit DDR2/DDR3 controller with ECC, two USB 2.0 controllers (EHCI/ULPI), SD/MMC host, SPI, I²C, DUART, timers, and six SerDes lanes configurable as PCIe x1/x4, SATA, or SGMII.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single Power Architecture e500v2 core with SPE APU and double-precision FPU - enables deterministic real-time protocol stack execution without multicore synchronization overhead. |
| Core Frequency Range | 600 MHz to 1055 MHz - provides scalable performance for control-plane processing in Layer 3 switches and firewall appliances. |
| L2 Cache | 256 KB with ECC, configurable as SRAM/stashing memory - improves instruction/data hit rate for packet classification and encryption workloads. |
| Memory Interface | 64-bit DDR2/DDR3 SDRAM controller with ECC - supports up to 8 GB addressable memory with error correction for mission-critical routing tables. |
| Ethernet Controllers | Dual virtualized eTSECs with RGMII/SGMII, IEEE 1588 timestamping, and TCP/UDP/IP offload - enables precise time-synchronized packet forwarding in industrial automation networks. |
| High-Speed Interfaces | Six SerDes lanes supporting PCIe x1/x4, SATA II, and SGMII - allows flexible backplane connectivity or local storage integration without external switch chips. |
| Power Management | Packet-lossless deep-sleep, doze, nap, and jog (dynamic frequency scaling) modes - reduces idle power to <1 W while maintaining network link state and wake-on-LAN capability. |
Pinout & Package
Package: 689-pin Thermally Enhanced Plastic Ball Grid Array (TEPBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Designed for low-cost 6-layer PCB mounting with optimized signal integrity for DDR3 and SerDes routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A12, B1–B12, etc. (all 689 balls) | Ball grid array terminals | Includes dedicated VDD/VSS pairs per I/O bank, differential SerDes pairs (TX/RX), DDR3 DQ/DQS/CK/CKE, eTSEC RGMII signals, PCIe REFCLK, and PMC wakeup inputs - pinout validated per QP1022FS Rev 1 and P1013-specific package drawing. |
| DDR3_DQ[63:0], DDR3_DQS[7:0] | DDR3 data and strobe interface | 64-bit bidirectional data path with 8-byte strobes - supports 800–1066 MT/s DDR3 operation with on-die termination calibration. |
| eTSEC0_TXD[3:0], eTSEC0_RXD[3:0] | RGMII transmit/receive data | 4-bit nibble-aligned interface for 1000BASE-X PHY connection - eliminates need for external MII-to-RGMII glue logic. |
| PCIe_CLKREQ#, PCIe_WAKE# | PCI Express power management | Asynchronous wake signaling and clock request handshake - enables L1 substates and autonomous entry/exit from low-power PCIe link states. |
| PMC_WKUP[3:0] | Power Management Controller wakeup | Dedicated GPIO pins for filtered LAN activity, USB connect, or external interrupt-triggered resume from deep-sleep - ensures deterministic wake latency under 100 µs. |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1588 Precision Time Protocol support | Hardware timestamping in eTSECs enables sub-microsecond clock synchronization for industrial Ethernet and telecom timing applications. |
| Virtualized Ethernet controllers (eTSEC) | Per-port VLAN tagging, flow control, and classification offload reduce CPU load by >40% in multi-tenant edge router deployments. |
| Configurable SerDes lanes | Runtime reassignment of six SerDes lanes across PCIe, SATA, and SGMII protocols allows single-BOM flexibility for multiple product SKUs. |
| Packet-lossless deep-sleep mode | Power gating of core, L2 cache, and most peripherals while preserving DDR self-refresh and eTSEC link state - maintains network presence during low-traffic periods. |
| Enhanced Local Bus Controller (eLBC) | Supports NAND/NOR flash, SRAM, and FPGA boot devices with programmable timing - simplifies migration from legacy PowerQUICC-based designs. |
Applications
| Industrial Ethernet Gateway | Secure Edge Firewall |
|---|---|
Use Scenario: Connecting Modbus/TCP field devices to cloud SCADA systems over encrypted tunnels. IC Role / Device Role / Timing Role: Control-plane processor executing Linux-based routing, firewall, and protocol translation stacks with IEEE 1588 time sync for deterministic PLC communication. Use Value: Dual eTSECs with hardware TCP offload sustain 950 Mbps throughput at <5% CPU utilization; deep-sleep mode cuts standby power to 0.8 W. | Use Scenario: Deploying zero-trust microsegmentation in distributed retail branches with TLS inspection and IPS. IC Role / Device Role / Timing Role: Single-core application processor hosting Snort/ClamAV with optional integrated security engine for AES-256/GCM and SHA-256 acceleration. Use Value: Hardware crypto engine processes 450 Mbps IPsec traffic at line rate; DDR3 ECC prevents silent memory corruption in long-running security services. |
| Media-Enabled VoIP Appliance | Storage-Attached Network Appliance |
Use Scenario: Unified communications gateway supporting 128-channel VoIP with HD audio and video conferencing. IC Role / Device Role / Timing Role: Real-time media processor running DSP algorithms via SPE APU, interfacing to TDM and I2S codecs with LCD display output. Use Value: TDM interface handles 128 channels at 8 kHz sampling; I2S supports 192 kHz stereo playback; LCD controller drives 1280×1024@60 Hz UI. | Use Scenario: Compact NAS device with dual SATA II ports, USB 2.0 host, and SMB/CIFS file sharing. IC Role / Device Role / Timing Role: Embedded storage controller managing RAID 1 mirroring, SMART monitoring, and USB mass storage bridging. Use Value: Dual SATA II interfaces deliver 3 Gbps aggregate bandwidth; SD/MMC host boots OS from removable card; eLBC connects NOR flash for firmware redundancy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548ECVTAJDB | Single e500 core, 1.33 GHz max, no integrated SerDes; uses separate PLB/OPB buses instead of on-chip network; lacks IEEE 1588 and packet-lossless sleep. | Targeted at legacy PowerQUICC III migration; suitable for non-time-sensitive control-plane tasks without high-speed SerDes dependency. | Select when migrating older designs with PLB peripherals and no need for modern low-power modes or hardware time sync. |
| LX2160A | 16-core ARM Cortex-A72, 2.0 GHz, integrated 10G/25G Ethernet, no Power Architecture compatibility; requires full software porting. | Designed for cloud-native edge compute; supports DPDK, containerized services, and AI inference - not drop-in compatible. | Select for new greenfield deployments requiring higher throughput, virtualization, or cloud orchestration - not for binary-compatible replacement. |
Compared with MPC8548ECVTAJDB, the P1013NXN2EFB offers IEEE 1588, SerDes flexibility, and deeper power states; versus LX2160A, it provides Power Architecture toolchain continuity and lower entry-level power but less raw throughput and no native virtualization support.
Availability
P1013NXN2EFB is available at Aetrix Electronics and suitable for industrial gateways, secure edge firewalls, and VoIP appliances requiring stable component supply, long-term lifecycle support, and extended temperature grade availability.
Supply support for P1013NXN2EFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The QorIQ P1 Series - including the P1013NXN2EFB - was designed to deliver energy-efficient, single- and dual-core Power Architecture processing for cost-sensitive, thermally constrained embedded networking and media applications.
FAQ
What is the maximum DDR3 speed supported by the P1013NXN2EFB?
The P1013NXN2EFB supports DDR3 memory up to 1066 MT/s using its 64-bit DDR2/DDR3 SDRAM controller with on-die termination calibration and ECC. This enables sustained bandwidth of 8.5 GB/s for packet buffering and routing table lookups, validated across industrial temperature ranges with JEDEC-compliant modules.
Does the P1013NXN2EFB include an integrated security engine?
The P1013NXN2EFB supports an optional integrated security engine with hardware acceleration for AES, 3DES, SHA, RSA/ECC, and IPsec/SSL protocols. The engine is factory-configurable - present in security-enabled variants like P1013NXN2EFB, but absent in base configurations unless explicitly ordered with security option enabled.
Can the P1013NXN2EFB operate in extended temperature conditions?
Yes, the P1013NXN2EFB is available in an extended temperature grade (–40°C to +105°C) variant, qualified per AEC-Q100 stress test standards. This version uses enhanced thermal packaging and process screening to ensure reliable operation in industrial control cabinets and outdoor telecom enclosures.
How many PCIe interfaces does the P1013NXN2EFB support simultaneously?
The P1013NXN2EFB features six SerDes lanes that can be configured as one PCIe x4 interface plus two PCIe x1 interfaces, or other combinations such as SATA + SGMII. All three PCIe endpoints share the same SerDes resource pool and cannot operate concurrently in full-width mode - configuration is fixed at boot via RCW settings.
Is the P1013NXN2EFB pin-compatible with the P1022 processor?
No, the P1013NXN2EFB is not pin-compatible with the P1022 despite sharing the same 689-pin TEPBGA package footprint. Key differences include missing coherency module signals, relocated SerDes lane assignments, and absence of second-core debug and cache coherency pins - requiring PCB redesign for migration.
P1013NXN2EFB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 689-BBGA Exposed Pad
- Series:
- QorIQ P1
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500v2
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.055GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- SATA 3Gbps (2)
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 689-TEPBGA II (31x31)
- Additional Interfaces:
- DUART, I2C, I2S, MMC/SD, SPI
P1013NXN2EFB FAQ
1.How can I place an order for P1013NXN2EFB through Aetrix?
Please submit a Request for Quotation (RFQ) for P1013NXN2EFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P1013NXN2EFB reliable?
The price and inventory of P1013NXN2EFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P1013NXN2EFB is usually 5 days.
3.What payment methods are accepted for P1013NXN2EFB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P1013NXN2EFB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P1013NXN2EFB?
P1013NXN2EFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P1013NXN2EFB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P1013NXN2EFB?
For technical support, including P1013NXN2EFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P1013NXN2EFB requirements.
6.How does Aetrix verify that P1013NXN2EFB is sourced from the original manufacturer or authorized distributors?
All P1013NXN2EFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P1013NXN2EFB meets industry standards.
7.What is the process for return or replacement of P1013NXN2EFB?
All P1013NXN2EFB units undergo pre-shipment inspection (PSI). If there is an issue with P1013NXN2EFB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P1013NXN2EFB part is unused and in its original packaging.
Return procedure for P1013NXN2EFB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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