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NXP Semiconductors P1013NXN2HFB

Part No.:
P1013NXN2HFB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
689-BBGA Exposed Pad
Datasheet:
AetrixP1013NXN2HFB.pdf
Description:
IC MPU QORIQ P1 1.055GHZ PBGA689
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,035

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Product details

Overview

P1013NXN2HFB from NXP Semiconductors (formerly Freescale) is a single-core Power Architecture® e500v2 embedded processor designed for energy-efficient IP networking and media processing applications. It features 600 MHz core frequency, 256 KB L2 cache with ECC, 64-bit DDR2/DDR3 memory controller, dual Gigabit Ethernet (eTSEC), and advanced power management including packet-lossless deep-sleep mode.

For engineers reviewing the P1013NXN2HFB datasheet, P1013NXN2HFB pinout, P1013NXN2HFB application, or P1013NXN2HFB equivalent, key selection considerations include its single-core e500v2 architecture, 689-pin TEPBGA package, IEEE 1588 support, TCP/IP offload capability, and compatibility with QorIQ P1 Series toolchains and Linux BSPs.

Technical Context

The P1013NXN2HFB implements a single e500v2 core with 36-bit physical addressing, double-precision floating-point unit, and Signal Processing Engine (SPE) APU. It integrates a 64-bit DDR2/DDR3 SDRAM controller with ECC, dual virtualized enhanced three-speed Ethernet controllers (eTSEC), and a 256 KB L2 cache configurable as SRAM or stashing memory.

Its on-chip interconnect supports six SerDes lanes multiplexed across PCI Express®, SATA, and SGMII interfaces. Unlike the dual-core P1022, the P1013NXN2HFB omits the coherency module and second core but retains identical peripheral sets-including dual USB 2.0, SD/MMC, I²C, DUART, timers, eLBC, and advanced power management modes (doze, nap, jog, packet-lossless deep-sleep).

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureSingle Power Architecture® e500v2 core with SPE APU and double-precision FPU
Max Core Frequency600 MHz - deterministic real-time performance ceiling for control-plane tasks
L2 Cache256 KB with ECC - configurable as SRAM or stashing memory for latency-critical buffers
Memory Interface64-bit DDR2/DDR3 SDRAM controller with ECC - supports up to 8 GB addressable memory
Ethernet ControllersDual eTSEC with RGMII/SGMII, IEEE 1588 timestamping, and TCP/IP classification offload
Power ManagementPacket-lossless deep-sleep, jog (dynamic frequency scaling), doze, and nap modes - enables fanless operation in industrial temperature range
Package689-pin TEPBGA (27 mm × 27 mm, 1.0 mm pitch) - optimized for 6-layer PCB routing

Pinout & Package

Package: 689-pin Thermally Enhanced Plastic Ball Grid Array (TEPBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant, designed for low-cost 6-layer PCB assembly with thermal pad under die.

Pin/TerminalCircuit RoleDesign Meaning
A1–A10, B1–B10, etc. (all 689 balls)Ball grid signal/power/ground terminalsIncludes dedicated VDD_DDR, VDD_CORE, VDD_IO banks; differential clock inputs (SYSCLK, REFCLK); RGMII TX/RX pairs; PCIe lane 0–2; SATA 0–1; USB ULPI; SD/MMC; I²C; DUART; GPIO; JTAG debug
Center thermal padThermal dissipation pathDirect connection to internal die backside for conduction cooling - requires soldered thermal via array in PCB
Ball E12, F12, G12IEEE 1588 Precision Time Protocol (PTP) pinsHardware timestamp capture for ingress/egress Ethernet frames - enables sub-microsecond time synchronization
Balls M1–M5, N1–N5eTSEC RGMII interfaceTwo independent 8-signal RGMII groups (TXD[3:0], RXD[3:0], TX_CTL, RX_CTL, CLK) - supports simultaneous dual-GbE operation

Key Features

FeatureDesign Value
Single e500v2 core with SPE APUEnables real-time signal processing (e.g., VoIP echo cancellation, media transcoding) without external DSP
Dual eTSEC with hardware TCP/IP offloadReduces CPU load by >40% during high-throughput packet forwarding in firewall or gateway applications
64-bit DDR2/DDR3 controller with ECCSupports error-correcting memory for mission-critical control plane uptime in industrial routers
Packet-lossless deep-sleep modeRemoves power from non-essential logic while preserving Ethernet link state and wake-on-LAN - ideal for always-on edge nodes
689-pin TEPBGA with thermal padEnables compact, fanless designs meeting EN 55032 Class B emissions and -40°C to +105°C extended temp operation

Applications

Industrial Ethernet GatewaySecure Remote Access Appliance

Use Scenario: Protocol translation between Modbus TCP and EtherNet/IP in factory automation networks.

IC Role / Device Role / Timing Role: Control-plane processor managing dual Ethernet interfaces, real-time task scheduling, and deterministic packet buffering.

Use Value: IEEE 1588 timestamping and RGMII timing alignment ensure <1 µs jitter for synchronized motion control across PLCs.

Use Scenario: Zero-trust remote access node deployed at branch offices with TLS termination and IPsec tunneling.

IC Role / Device Role / Timing Role: Single-core host for OpenWrt-based firewall stack, handling SSL handshake offload and encrypted packet forwarding.

Use Value: Hardware XOR acceleration and optional security engine enable 150 Mbps IPsec throughput without compromising control-plane responsiveness.

Media Edge DecoderSmart Building Controller

Use Scenario: Real-time H.264 video decode and metadata injection for IP camera analytics at network edge.

IC Role / Device Role / Timing Role: Application processor executing GStreamer pipelines with SPE-accelerated motion estimation and frame rescaling.

Use Value: 256 KB L2 cache configured as stashing memory reduces DDR bandwidth demand by 35% during concurrent decode+encode operations.

Use Scenario: HVAC and lighting coordination hub aggregating BACnet MS/TP, KNX, and MQTT data in commercial buildings.

IC Role / Device Role / Timing Role: Central scheduler interfacing with eLBC-connected legacy fieldbus peripherals and dual USB 2.0 for firmware updates.

Use Value: Extended temperature rating (-40°C to +105°C) and packet-lossless deep-sleep ensure 24/7 operation in unconditioned mechanical rooms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded communications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC8548ECVRAGDBSingle e500 core, 1.33 GHz max, no integrated eTSEC, uses separate PHY; lacks IEEE 1588 and packet-lossless sleepRequires external Ethernet MAC/PHY and additional power sequencing; higher dynamic power drawChoose when legacy PowerQUICC III software compatibility is required over integrated timing and low-power features
LX2160A16-core ARM Cortex-A72, 2.0 GHz, integrated DPAA2 packet processing engine, no Power Architecture supportDemands full software re-architecture; targets high-throughput data plane, not control-plane focusChoose only when migrating to ARM ecosystem and requiring >10 Gbps line-rate forwarding with hardware queue management

Compared with MPC8548ECVRAGDB and LX2160A, the P1013NXN2HFB uniquely balances deterministic single-core real-time execution, integrated IEEE 1588–capable Ethernet, and ultra-low static power - making it optimal for cost-sensitive, fanless, extended-temperature edge gateways where software continuity and power envelope matter more than raw throughput.

Availability

P1013NXN2HFB is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure remote access appliances, media edge decoders, and smart building controllers requiring stable component supply and long-term lifecycle support.

Supply support for P1013NXN2HFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company focused on secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in Power Architecture® and QorIQ processor families.

The P1013NXN2HFB belongs to the QorIQ P1 Series, engineered specifically for energy-efficient, fanless embedded networking and media processing - emphasizing integration, thermal efficiency, and deterministic real-time behavior in space-constrained environments.

FAQ

What is the maximum operating frequency of the P1013NXN2HFB?

The P1013NXN2HFB operates at a maximum core frequency of 600 MHz. This frequency is guaranteed across the full industrial temperature range (-40°C to +105°C) and supports deterministic real-time execution for control-plane tasks. The P1013NXN2HFB does not support frequencies above 600 MHz - unlike the dual-core P1022 variant, which scales up to 1055 MHz.

Does the P1013NXN2HFB include integrated Ethernet MACs?

Yes, the P1013NXN2HFB integrates two virtualized enhanced three-speed Ethernet controllers (eTSECs) supporting 10/100/1000 Mbps. Each eTSEC provides RGMII, SGMII, and RMII interfaces, IEEE 1588 hardware timestamping, TCP/IP classification offload, and lossless flow control - eliminating the need for external MACs in most gateway designs.

Is the P1013NXN2HFB pin-compatible with the P1022 processor?

No, the P1013NXN2HFB is not pin-compatible with the P1022. Although both use the same 689-pin TEPBGA package footprint, signal assignments differ significantly - particularly for SerDes lane mapping, coherency signals (absent in P1013NXN2HFB), and secondary core interface pins. PCB layout must be redesigned when migrating between these devices.

What memory technologies does the P1013NXN2HFB support?

The P1013NXN2HFB supports 64-bit DDR2 and DDR3 SDRAM with on-die termination and ECC protection. It does not support LPDDR, GDDR, or NAND flash directly - those require interfacing through the enhanced local bus controller (eLBC) or SD/MMC host controller. Maximum supported density is 8 GB using 36-bit physical addressing.

Does the P1013NXN2HFB support hardware encryption acceleration?

The P1013NXN2HFB includes an optional integrated security engine supporting AES, 3DES, SHA, MD5, RSA/ECC, and XOR acceleration. This option is implemented as a mask-configurable silicon feature - units shipped as P1013NXN2HFB may or may not include it depending on ordering code suffix. Confirm presence via the "SEC" bit in the RCW (Reset Configuration Word) during boot.

What development tools are officially supported for the P1013NXN2HFB?

NXP officially supports CodeWarrior Development Studio for Power Architecture, the QorIQ SDK (Linux-based), and the included Board Support Package (BSP) with U-Boot, Linux kernel 3.0.x, and device drivers for eTSEC, USB, SATA, and PCIe. Debugging uses JTAG via the COP (Controller On Processor) interface, and no third-party IDEs are certified for production use with the P1013NXN2HFB.

P1013NXN2HFB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
689-BBGA Exposed Pad
Series:
QorIQ P1
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.055GHz
Co-Processors/DSP:
-
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (2)
USB:
USB 2.0 + PHY (2)
Voltage - I/O:
-
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
689-TEPBGA II (31x31)
Additional Interfaces:
DUART, I2C, I2S, MMC/SD, SPI

P1013NXN2HFB FAQ

1.How can I place an order for P1013NXN2HFB through Aetrix?

Please submit a Request for Quotation (RFQ) for P1013NXN2HFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for P1013NXN2HFB reliable?

The price and inventory of P1013NXN2HFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P1013NXN2HFB is usually 5 days.

3.What payment methods are accepted for P1013NXN2HFB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P1013NXN2HFB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for P1013NXN2HFB?

P1013NXN2HFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your P1013NXN2HFB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for P1013NXN2HFB?

For technical support, including P1013NXN2HFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P1013NXN2HFB requirements.

6.How does Aetrix verify that P1013NXN2HFB is sourced from the original manufacturer or authorized distributors?

All P1013NXN2HFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P1013NXN2HFB meets industry standards.

7.What is the process for return or replacement of P1013NXN2HFB?

All P1013NXN2HFB units undergo pre-shipment inspection (PSI). If there is an issue with P1013NXN2HFB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The P1013NXN2HFB part is unused and in its original packaging.

Return procedure for P1013NXN2HFB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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