My Inquiry
My Account
NXP Semiconductors P1022NXN2HFB
- Part No.:
- P1022NXN2HFB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 689-BBGA Exposed Pad
- Datasheet:
-
P1022NXN2HFB.pdf
- Description:
- IC MPU QORIQ P1 1.055GHZ PBGA689
- Quantity:
- Payment:
- Shipping:
Inventory:1,342
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
P1022NXN2HFB from NXP Semiconductors (formerly Freescale) is a dual-core Power Architecture® e500v2 communications processor designed for embedded IP networking and media processing systems. It delivers up to 1055 MHz core frequency, 256 KB L2 cache with ECC, dual 10/100/1000 Mbps Ethernet controllers with IEEE 1588 support, and integrated DDR2/DDR3 memory controller - enabling control-plane and protocol-processing roles in fanless enterprise routers and industrial gateways.
For engineers reviewing the P1022NXN2HFB datasheet, P1022NXN2HFB pinout, P1022NXN2HFB application, or P1022NXN2HFB equivalent, key selection considerations include its 689-pin TEPBGA package, virtualized eTSECs with TCP/IP offload, optional security acceleration engine, jog-mode dynamic frequency scaling, and support for six SerDes lanes multiplexed across PCIe/SATA/SGMII.
Technical Context
The P1022NXN2HFB implements two coherent e500v2 cores with 36-bit physical addressing, double-precision floating-point units, and Signal Processing Engine (SPE) APU. Its on-chip coherency module enables cache-coherent multiprocessing, while the 256 KB L2 cache operates in ECC-protected mode or configurable as SRAM/stashing memory.
It integrates a 64-bit DDR2/DDR3 SDRAM controller with ECC, dual enhanced three-speed Ethernet controllers (eTSECs) supporting RGMII/SGMII, and a flexible SerDes subsystem offering one x4 + two x1 PCIe interfaces, two SATA ports, and two SGMII links - all time-multiplexed across six lanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e500v2 cores on Power Architecture®, 36-bit physical addressing, SPE APU |
| Max Core Frequency | 1055 MHz - enables near-2 GHz equivalent single-thread performance in asymmetric workloads |
| L2 Cache | 256 KB with ECC; configurable as SRAM or stashing memory for deterministic latency-critical tasks |
| Memory Interface | 64-bit DDR2/DDR3 SDRAM controller with ECC - supports up to 8 GB addressable memory |
| Ethernet Controllers | Two virtualized eTSECs with IEEE 1588 timestamping, TCP/IP offload, and lossless flow control |
| SerDes Configuration | Six lanes supporting PCIe x4 + x1 + x1, or SATA ×2 + SGMII ×2, or mixed protocols via time-division multiplexing |
| Power Management | Doze, nap, jog (dynamic frequency scaling), and packet-lossless deep-sleep modes - enables fanless operation in industrial environments |
Pinout & Package
Package: 689-pin Thermally Enhanced Plastic Ball Grid Array (TEPBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A20, B1–B20, etc. (689 total) | Ball grid array interconnects | Signal, power, ground, and reference balls mapped per QP1022FS Rev 1 pinout diagram; includes dedicated VDD_DDR, VDD_CORE, VDD_IO banks with separate decoupling requirements |
| DDR_CLK, DDR_CKE, DDR_CS | DDR2/DDR3 memory interface control | Timing-critical signals requiring matched trace lengths and controlled impedance (50 Ω ±10%) for stable 800 MT/s operation |
| ETSEC0_TXD[3:0], ETSEC0_RXD[3:0] | Gigabit Ethernet RGMII interface | Source-synchronous 2.5 V I/O with 1.6 ns setup/hold margin at 125 MHz; requires internal delay calibration |
| PCIe_REFCLK+, PCIe_REFCLK− | Differential reference clock input | 25 MHz or 100 MHz differential LVDS input for PCIe PHY synchronization; must meet jitter <1.5 ps RMS |
| USB0_DP/DM, USB1_DP/DM | USB 2.0 high-speed differential pairs | ULPI-compliant 3.3 V interface; routed as controlled-impedance 90 Ω differential traces with <5 mil spacing |
Key Features
| Feature | Design Value |
|---|---|
| Dual e500v2 Cores with Coherency Module | Enables symmetric multiprocessing (SMP) OS support and cache-coherent shared memory without external logic |
| Virtualized eTSECs with IEEE 1588 | Allows time-synchronized packet forwarding across multiple network domains for industrial automation and telecom timing |
| Configurable 256 KB L2 Cache | Can be partitioned as ECC-protected cache or lockable SRAM for real-time interrupt handlers or boot code |
| Time-Multiplexed SerDes | Reduces PCB layer count by consolidating PCIe, SATA, and SGMII onto six shared high-speed lanes |
| Packet-Lossless Deep-Sleep Mode | Shuts down >90% of chip power while preserving Ethernet link state and allowing wake-on-LAN without packet loss |
Applications
| Enterprise Network Router | Industrial Protocol Gateway |
|---|---|
Use Scenario: Aggregating Modbus TCP, PROFINET, and EtherNet/IP traffic in factory-floor edge nodes. IC Role / Device Role / Timing Role: Control-plane processor managing protocol translation, firewall rules, and real-time scheduling via MPIC. Use Value: Dual e500v2 cores execute deterministic protocol stacks concurrently while eTSECs maintain sub-10 µs packet latency with IEEE 1588 timestamping. | Use Scenario: Securely bridging legacy fieldbus networks to cloud-based SCADA systems with TLS termination. IC Role / Device Role / Timing Role: Application processor running Linux with OpenSSL offload via optional security engine for IPsec/SSL acceleration. Use Value: Hardware-accelerated AES-256 and SHA-256 reduce CPU load by >70% during encrypted tunnel establishment and data transfer. |
| Media Server Appliance | Office Automation Controller |
Use Scenario: Transcoding HD video streams for digital signage while rendering UI via integrated LCD controller. IC Role / Device Role / Timing Role: Media processing host with I2S audio output, LCD interface (1280×1024@60 Hz), and dual SATA for local storage RAID. Use Value: On-die XOR acceleration enables software RAID-5 parity calculation at line rate without degrading video decode throughput. | Use Scenario: Managing multi-function peripherals (print, scan, fax) in energy-conscious office equipment. IC Role / Device Role / Timing Role: System-on-chip host executing real-time print spooling, USB device enumeration, and power-aware sleep/wake coordination. Use Value: Jog-mode dynamic frequency scaling reduces average power by 42% during low-activity periods while maintaining USB 2.0 host responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8548CZQAGDB | Single e500 core, 1.33 GHz max, no integrated SerDes; uses parallel PCI-X instead of PCIe | Lacks virtualized eTSECs and IEEE 1588; limited to legacy backplane interconnects | Choose when PCIe/SATA/SGMII integration is unnecessary and legacy PCI-X infrastructure exists |
| LS1023A | ARM Cortex-A7 dual-core, 1.2 GHz, integrated DPAA for packet acceleration, no eTSECs | Uses DPAA-based packet forwarding instead of eTSEC virtualization; different toolchain and OS porting effort | Prefer for new ARM-based designs requiring hardware packet classification and QoS, not Power Architecture continuity |
Compared with MPC8548CZQAGDB and LS1023A, the P1022NXN2HFB uniquely combines Power Architecture compatibility, integrated SerDes flexibility, and eTSEC virtualization - making it optimal for brownfield upgrades requiring IEEE 1588 timing and mixed high-speed interface consolidation.
Availability
P1022NXN2HFB is available at Aetrix Electronics and suitable for enterprise networking, industrial protocol gateway, and secure media server applications requiring stable component supply and long-term lifecycle support.
Supply support for P1022NXN2HFB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The P1022NXN2HFB belongs to NXP's QorIQ P1 Series communications processors, engineered specifically for energy-efficient, high-integration embedded networking and media processing where Power Architecture compatibility, deterministic timing, and mixed high-speed interface consolidation are critical.
FAQ
What is the maximum operating temperature range for the P1022NXN2HFB?
The P1022NXN2HFB is specified for commercial temperature range (0 °C to +105 °C junction) and offers an extended temperature option (–40 °C to +125 °C) for harsh industrial environments. Thermal design must account for 12.5 W typical power dissipation using the 689-pin TEPBGA package's thermal pad and recommended PCB copper pour per QP1022FS Rev 1 layout guidelines. The P1022NXN2HFB supports fanless operation under defined airflow and board thermal constraints.
Does the P1022NXN2HFB support DDR3L memory?
Yes, the P1022NXN2HFB's DDR2/DDR3 memory controller supports DDR3L (1.35 V) operation in addition to standard DDR3 (1.5 V) and DDR2 (1.8 V). Voltage selection is configured via strap pins at reset, and timing parameters must comply with JEDEC JESD79-3F for DDR3 and JESD79-2F for DDR2. The P1022NXN2HFB requires board-level termination and calibrated ODT settings for stable 800 MT/s operation with DDR3L.
How many PCIe root complexes does the P1022NXN2HFB implement?
The P1022NXN2HFB implements three PCIe root complexes: one x4 and two x1 configurations, all time-multiplexed across its six SerDes lanes. Lane allocation is set at boot via configuration fuses or software register writes, and simultaneous use of all three interfaces requires proper SerDes lane assignment and clock routing per QP1022FS Rev 1. The P1022NXN2HFB does not support endpoint mode - only root complex operation.
Is the security acceleration engine enabled by default on the P1022NXN2HFB?
No, the security acceleration engine on the P1022NXN2HFB is optional and disabled by default; it must be enabled via fuse programming or boot-time configuration register writes. When activated, it supports single-pass encryption/authentication for IPsec, SSL, SRTP, and WiMAX protocols using AES, SHA, RSA/ECC, and 3DES algorithms. The P1022NXN2HFB's security engine operates independently of the e500v2 cores to offload crypto processing without impacting application throughput.
What boot sources are supported by the P1022NXN2HFB?
The P1022NXN2HFB supports booting from NOR flash (via eLBC), NAND flash (with BCH ECC), SD/MMC, SATA, and USB host devices. Boot sequence priority is configurable via hardware strapping pins or RCW (Reset Configuration Word) settings. The P1022NXN2HFB includes a built-in ROM bootloader that validates image integrity before execution and supports secure boot with hash-based authentication when the security engine is enabled.
P1022NXN2HFB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 689-BBGA Exposed Pad
- Series:
- QorIQ P1
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500v2
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.055GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- SATA 3Gbps (2)
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 689-TEPBGA II (31x31)
- Additional Interfaces:
- DUART, I2C, I2S, MMC/SD, SPI
P1022NXN2HFB FAQ
1.How can I place an order for P1022NXN2HFB through Aetrix?
Please submit a Request for Quotation (RFQ) for P1022NXN2HFB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P1022NXN2HFB reliable?
The price and inventory of P1022NXN2HFB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P1022NXN2HFB is usually 5 days.
3.What payment methods are accepted for P1022NXN2HFB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P1022NXN2HFB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P1022NXN2HFB?
P1022NXN2HFB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P1022NXN2HFB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P1022NXN2HFB?
For technical support, including P1022NXN2HFB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P1022NXN2HFB requirements.
6.How does Aetrix verify that P1022NXN2HFB is sourced from the original manufacturer or authorized distributors?
All P1022NXN2HFB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P1022NXN2HFB meets industry standards.
7.What is the process for return or replacement of P1022NXN2HFB?
All P1022NXN2HFB units undergo pre-shipment inspection (PSI). If there is an issue with P1022NXN2HFB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P1022NXN2HFB part is unused and in its original packaging.
Return procedure for P1022NXN2HFB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
P1022NXN2HFB Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
