NXP Semiconductors P2010NSN2HFC
- Part No.:
- P2010NSN2HFC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 689-BBGA Exposed Pad
- Datasheet:
-
P2010NSN2HFC.pdf
- Description:
- IC MPU 800MHZ PBGA689
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
P2010NSN2HFC from NXP Semiconductors (formerly Freescale) is a single-core Power Architecture® e500-based QorIQ integrated processor with 800 MHz to 1.33 GHz operation, 512 KB L2 cache with ECC, 64-bit DDR2/DDR3 memory controller, and three 10/100/1000 Mbps eTSEC Ethernet controllers supporting IEEE 1588 precision timing - deployed in industrial control gateways and telecom edge routers.
For engineers reviewing the P2010NSN2HFC datasheet, P2010NSN2HFC pinout, P2010NSN2HFC application, or P2010NSN2HFC equivalent, key selection considerations include its 689-pin WB-TePBGA package, triple eTSEC + IEEE 1588 support, SerDes-configurable high-speed interfaces (PCIe/SRIO/SGMII), integrated security acceleration (AES/RSA/ECC), and DDR3 ECC memory subsystem for deterministic real-time networking systems.
Technical Context
The P2010NSN2HFC implements a single e500v2 core with double-precision floating-point unit, 32 KB L1 instruction and 32 KB L1 data caches, and a coherency-enabled 512 KB L2 cache configurable as SRAM or stashing memory. Its memory subsystem supports 64-bit DDR2/DDR3 with full ECC protection and on-die termination control.
Networking is handled by three independent enhanced Three-Speed Ethernet Controllers (eTSECs), each supporting RGMII/SGMII/MII interfaces, TCP/IP offload, QoS classification, lossless flow control, and IEEE 1588 v2 timestamping with dedicated trigger/clock I/O. High-speed interconnects are routed through four SerDes lanes multiplexed across three PCIe Gen1 endpoints, two Serial RapidIO 1.2 ports, and two SGMII PHY interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e500v2 Power Architecture®, single-threaded, 36-bit physical addressing |
| Clock Frequency | 800 MHz to 1.33 GHz - enables scalable performance for real-time packet processing |
| L2 Cache | 512 KB with ECC - configurable as SRAM or stashing memory for deterministic latency |
| Memory Interface | 64-bit DDR2/DDR3 with ECC, 800 MT/s - supports error detection/correction in mission-critical buffers |
| Ethernet Controllers | Three eTSECs with IEEE 1588 v2 hardware timestamping - enables sub-microsecond time synchronization in TSN-capable gateways |
| Security Engine | Hardware-accelerated AES-128/256, RSA-2048, ECC, SHA-1/256, RNG - offloads TLS/SSL and IPsec processing |
| High-Speed Interfaces | Four SerDes lanes (≤3.125 GHz) shared across 3× PCIe Gen1, 2× SRIO, 2× SGMII - enables flexible backplane or PHY connectivity |
Pinout & Package
Package: 31 mm × 31 mm 689-pin Wire Bond Temperature-Enhanced Plastic BGA (WB-TePBGA II), RoHS-compliant, thermal pad exposed on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MDQ[00]–MDQ[63] | DDR3 Data Bus (64-bit) | Bi-directional DQ signals with per-byte MDQS strobes - supports 800 MT/s DDR3 with on-die termination calibration |
| MCK[00]–MCK[05] | DDR3 Clock & Complement | Differential clock pair per rank - enables precise timing closure for high-speed memory interface |
| TSEC1_TXD[00]–TSEC1_TXD[07] | eTSEC1 Transmit Data (RGMII) | 8-bit parallel transmit bus - used for 1 Gbps RGMII mode with TSEC1_TX_EN and TSEC1_TX_CLK |
| TSEC_1588_CLK_IN / TSEC_1588_CLK_OUT | IEEE 1588 Precision Clock I/O | Dedicated differential clock input/output pins - enables hardware timestamp alignment without software jitter |
| SD_TX[00]/SD_RX[00]–SD_TX[03]/SD_RX[03] | SerDes Lane 0–3 (differential) | Four 3.125 GHz differential pairs - configurable as PCIe, SRIO, or SGMII depending on strap settings and firmware |
Key Features
| Feature | Design Value |
|---|---|
| Triple eTSEC with IEEE 1588 v2 | Hardware timestamping engine with <100 ns resolution and dedicated TRIG_IN/ALARM_OUT pins for deterministic PTP slave/master operation |
| Integrated Security Acceleration | Single-pass SSL/TLS offload via AES/RSA/ECC engines - reduces CPU load by >70% in encrypted tunnel applications |
| Configurable L2 Cache | 512 KB L2 usable as ECC-protected cache, SRAM scratchpad, or stashing memory - improves determinism in real-time control loops |
| Flexible High-Speed Interconnect | SerDes lane multiplexing allows simultaneous PCIe endpoint + SRIO switch + SGMII PHY - eliminates need for external bridging logic |
| DDR3 Memory Subsystem | 64-bit bus with per-bit DQS, on-die termination (MODT), and ECC - achieves >99.999% data integrity in 24/7 industrial deployments |
Applications
| Industrial Ethernet Gateway | Telecom Edge Router |
|---|---|
|
Use Scenario: Protocol translation between Modbus TCP, PROFINET, and EtherNet/IP in factory automation networks. IC Role / Device Role / Timing Role: Central protocol-aware packet processor with IEEE 1588 time-synchronized eTSECs for deterministic cycle timing. Use Value: Enables sub-100 µs jitter in synchronized motion control networks using hardware timestamping and low-latency DMA paths. |
Use Scenario: Small-footprint cellular backhaul node aggregating LTE fronthaul traffic over Gigabit Ethernet. IC Role / Device Role / Timing Role: Baseband-adjacent packet forwarding engine with triple eTSECs and hardware QoS classification. Use Value: Delivers 900+ Mbps line-rate forwarding with TCP/IP acceleration and IEEE 1588 phase alignment for CPRI transport. |
| Secure Network Appliance | Ruggedized Communications Controller |
|
Use Scenario: Firewall/NAT device for critical infrastructure SCADA networks requiring FIPS-validated crypto. IC Role / Device Role / Timing Role: Embedded security gateway with hardware-accelerated IPsec and TLS 1.2 termination. Use Value: Processes 250+ Mbps encrypted throughput at <5% CPU utilization, enabling headroom for deep packet inspection. |
Use Scenario: Avionics data concentrator interfacing ARINC 429, MIL-STD-1553, and Gigabit Ethernet in airborne platforms. IC Role / Device Role / Timing Role: Deterministic I/O hub with DDR3 ECC memory, watchdog timers, and -40°C to +105°C junction-rated BGA package. Use Value: Meets DO-254 DAL-B requirements via ECC memory, lockstep-capable peripherals, and qualified thermal derating profile. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| P2020NSN2HFC | Dual e500v2 cores, identical pinout and peripheral set, higher max frequency (1.2 GHz vs. 1.33 GHz), same 689-pin WB-TePBGA | Required when dual-threaded real-time OS scheduling or symmetric multiprocessing is needed | Select P2020NSN2HFC only if workload demands true SMP or >1.2 GHz sustained dual-core throughput |
| T1022NXE2KFB | QorIQ T1 series; dual e5500 cores, 1.2 GHz, 1 MB L2 cache, 64-bit DDR3, but no IEEE 1588 hardware support in eTSECs | Used where higher integer throughput and larger cache are prioritized over precision time sync | Choose T1022NXE2KFB when migrating to newer toolchains and when IEEE 1588 is handled externally or not required |
Compared with P2010NSN2HFC, the P2020NSN2HFC offers dual-core scalability within identical board layout and power envelope, while the T1022NXE2KFB provides modern e5500 architecture and larger cache at the cost of losing hardware IEEE 1588 support - making P2010NSN2HFC uniquely suited for time-sensitive industrial Ethernet deployments.
Availability
P2010NSN2HFC is available at Aetrix Electronics and suitable for industrial Ethernet gateways, telecom edge routers, secure network appliances, and ruggedized communications controllers requiring stable component supply across extended product lifecycles.
Supply support for P2010NSN2HFC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and continues to support the QorIQ portfolio for industrial, networking, and automotive applications with long-term product roadmaps and qualification programs.
The P2010NSN2HFC belongs to the QorIQ P1 series - designed specifically for cost-optimized, single-core control plane processing in space- and power-constrained networking equipment requiring IEEE 1588, hardware security, and DDR3 ECC reliability.
FAQ
What is the maximum supported DDR3 data rate for the P2010NSN2HFC?
The P2010NSN2HFC supports DDR3 up to 800 MT/s (400 MHz clock) with 64-bit bus width and full ECC protection. This is confirmed in Section 2.7 "DDR2 and DDR3 SDRAM" of the P2010EC Rev. 2 datasheet, which specifies tAC ≤ 0.45 ns and 8-bit DQS strobe alignment - enabling reliable operation in industrial temperature ranges with on-die termination calibration via MDIC pins.
Does the P2010NSN2HFC support IEEE 1588 hardware timestamping on all three eTSECs?
Yes, the P2010NSN2HFC supports full IEEE 1588 v2 hardware timestamping on all three eTSECs, with dedicated pins including TSEC_1588_CLK_IN, TSEC_1588_TRIG_IN[1:2], TSEC_1588_ALARM_OUT[01:02], and TSEC_1588_PULSE_OUT[01:02]. This capability is documented in Sections 2.10 and 1.2 of the P2010EC Rev. 2 specification and enables sub-100 ns timestamp resolution without CPU intervention.
What is the function of the MDIC[00] and MDIC[01] pins on the P2010NSN2HFC?
The MDIC[00] and MDIC[01] pins on the P2010NSN2HFC provide driver impedance calibration for the DDR3 memory interface, allowing dynamic adjustment of output drive strength to match PCB trace impedance. As specified in Table 1 Pinout Listing Note 18 and Section 2.7, these bidirectional GVDD-referenced pins enable on-die termination tuning during initialization - critical for signal integrity at 800 MT/s DDR3 speeds.
Can the SerDes lanes on the P2010NSN2HFC be configured simultaneously for PCIe, SRIO, and SGMII?
Yes, the P2010NSN2HFC's four SerDes lanes (SD_TX[00]–SD_TX[03] and SD_RX[00]–SD_RX[03]) can be independently assigned to PCIe, Serial RapidIO, or SGMII via configuration straps and firmware initialization. The P2010EC Rev. 2 datasheet confirms this multiplexing in Section 2.18 and Figure 1 block diagram - enabling concurrent use of one PCIe endpoint, one SRIO port, and one SGMII PHY without external retimers.
Is the P2010NSN2HFC pin-compatible with the P2020NSN2HFC?
Yes, the P2010NSN2HFC is pin-compatible with the P2020NSN2HFC: both use identical 31 mm × 31 mm 689-pin WB-TePBGA II packages, share identical ball maps, power domains, and peripheral pin assignments - verified in Tables 1 and 4 of the P2010EC Rev. 2 datasheet and the P2020EC documentation. This allows drop-in replacement where dual-core capability is later required.
P2010NSN2HFC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 689-BBGA Exposed Pad
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e500v2
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100/1000Mbps (3)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 689-TEPBGA II (31x31)
- Additional Interfaces:
- DMA, DUART, GPIO, I2C, MMC/SD, PCIe, SPI
P2010NSN2HFC FAQ
1.How can I place an order for P2010NSN2HFC through Aetrix?
Please submit a Request for Quotation (RFQ) for P2010NSN2HFC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P2010NSN2HFC reliable?
The price and inventory of P2010NSN2HFC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P2010NSN2HFC is usually 5 days.
3.What payment methods are accepted for P2010NSN2HFC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P2010NSN2HFC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P2010NSN2HFC?
P2010NSN2HFC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P2010NSN2HFC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P2010NSN2HFC?
For technical support, including P2010NSN2HFC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P2010NSN2HFC requirements.
6.How does Aetrix verify that P2010NSN2HFC is sourced from the original manufacturer or authorized distributors?
All P2010NSN2HFC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P2010NSN2HFC meets industry standards.
7.What is the process for return or replacement of P2010NSN2HFC?
All P2010NSN2HFC units undergo pre-shipment inspection (PSI). If there is an issue with P2010NSN2HFC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P2010NSN2HFC part is unused and in its original packaging.
Return procedure for P2010NSN2HFC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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