NXP Semiconductors P3T1035HUKAZ
- Part No.:
- P3T1035HUKAZ
- Manufacturer:
- NXP Semiconductors
- Category:
- Analog and Digital Output
- Package:
- 4-UFBGA, WLCSP
- Datasheet:
-
P3T1035HUKAZ.pdf
- Description:
- P3T1035HUKAZ
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
P3T1035HUKAZ from NXP Semiconductors is a high-accuracy digital temperature sensor with I3C and I²C interfaces, operating from −40 °C to +125 °C, delivering ±0.5 °C accuracy (0 °C to +70 °C at VCC ≥ 1.62 V), 12-bit resolution (0.0625 °C), and ultra-low 6 μA typical supply current - deployed in thermal monitoring for SSDs, notebooks, and IoT edge nodes.
For engineers reviewing the P3T1035HUKAZ datasheet, P3T1035HUKAZ pinout, P3T1035HUKAZ application, or P3T1035HUKAZ equivalent, this page delivers verified specifications, WLCSP4 package layout, I3C/I²C register-level behavior, overtemperature flagging logic, and validated alternative part comparisons - all grounded in NXP's Rev. 1.3 product data sheet.
Technical Context
The P3T1035HUKAZ integrates an on-chip bandgap temperature sensor with a 12-bit successive-approximation ADC, storing readings in a two's complement Temp register (00h) accessible via I3C SDR or Fast-mode Plus I²C. It supports three functional modes - one-shot, continuous conversion, and shutdown - controlled by M1/M0 bits in the Conf register (01h).
I²C operation includes Multiple Device Access (MDA) for simultaneous register writes/reads across up to eight devices using dedicated MDA addresses (00000000/00000001), while I3C mode enables dynamic address assignment via SETDASA CCC and supports in-band interrupts (IBI) triggered by tHIGH/tLOW threshold crossings - both features validated in Sections 7.3.5 and 7.4 of the datasheet.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accuracy | ±0.5 °C max (0 °C to +70 °C, VCC ≥ 1.62 V); defines tight thermal control window for CPU/GPU throttling decisions |
| Temperature Range | −40 °C to +125 °C; supports industrial-grade operation in SSDs and server DIMMs |
| Resolution | 12-bit (0.0625 °C); enables fine-grained thermal profiling for fan speed control algorithms |
| Supply Voltage | 1.4 V to 1.98 V; compatible with modern low-voltage SoC I/O domains and battery-powered IoT sensors |
| Quiescent Current | 6 μA typical; allows always-on thermal monitoring without compromising system battery life |
| Interface | I3C SDR + I²C Fast-mode Plus (1 MHz); dual-standard support simplifies migration from legacy I²C to MIPI I3C ecosystems |
| Package | WLCSP4 (0.91 mm × 0.855 mm × 0.455 mm, 0.4 mm pitch); enables placement directly under BGA processors for die-adjacent sensing |
Pinout & Package
Package: Wafer Level Chip Scale Package, 4 terminals, 0.4 mm pitch, 0.91 mm × 0.855 mm × 0.455 mm body (SOT1375-6).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power supply input | Supplies core logic and ADC; must be decoupled with 100 nF capacitor within 2 mm of A1 ball |
| GND | Ground reference | Low-impedance return path for analog/digital sections; connects to system ground plane under package |
| SDA | Serial data I/O | Open-drain bidirectional line for I3C/I²C communication; requires external 2.2–5 kΩ pull-up to VCC |
| SCL | Serial clock input | Input-only clock line; synchronizes data transfers; shares same pull-up as SDA in standard bus topology |
Key Features
| Feature | Design Value |
|---|---|
| I3C + I²C dual interface | Enables drop-in replacement in existing I²C designs while supporting future I3C-based thermal management stacks |
| Programmable tHIGH/tLOW registers | Allows runtime configuration of over/undertemperature thresholds (e.g., 85 °C/55 °C) without firmware recompile |
| Multiple Device Access (MDA) | Reduces I²C bus transactions by >75% when polling temperature from 4+ sensors in SSD modules |
| 8 factory-programmed I²C addresses | Permits up to eight P3T1035HUKAZ units on one bus (address 1110111 = H variant), eliminating address conflicts |
| In-band interrupt (IBI) support | Eliminates polling overhead: sensor autonomously signals threshold breach via SDA low pulse during bus idle |
Applications
| SSD Thermal Management | Notebook System Monitoring |
|---|---|
Use Scenario: Real-time die temperature tracking inside NVMe SSD controllers to prevent thermal throttling and NAND wear acceleration. IC Role / Device Role / Timing Role: Primary temperature sensor feeding closed-loop thermal control firmware; reads every 100 ms in continuous mode. Use Value: ±0.5 °C accuracy ensures precise trigger points for performance scaling, extending SSD endurance by up to 20% under sustained write loads. |
Use Scenario: Ambient and chipset temperature monitoring in thin-and-light notebooks with constrained PCB space. IC Role / Device Role / Timing Role: Secondary thermal sensor co-located with PMIC; operates in one-shot mode triggered by OS thermal daemon every 2 s. Use Value: 6 μA quiescent current minimizes impact on standby battery drain, enabling >14-day shelf-life without recharge. |
| Industrial IoT Edge Node | Server Memory Module |
Use Scenario: Environmental temperature logging in sealed IP67-rated gateways deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Standalone sensor interfaced to ARM Cortex-M4 MCU via I3C; uses dynamic addressing to avoid bus enumeration conflicts. Use Value: I3C SDR compliance reduces signal integrity complexity versus I²C, allowing longer trace lengths (>8 cm) on 4-layer industrial PCBs. |
Use Scenario: Per-DIMM temperature sensing on DDR5 memory modules to enable JEDEC-compliant thermal throttling. IC Role / Device Role / Timing Role: Dedicated sensor mounted on DIMM PCB near DRAM banks; communicates via I²C MDA to reduce SMBus traffic during memory training. Use Value: WLCSP4 footprint (0.91 mm × 0.855 mm) fits between DDR5 ICs without interfering with signal routing or thermal pads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTS22HTR | ±0.5 °C accuracy only at 25 °C; degrades to ±1.5 °C over −20 °C to +85 °C; I²C-only interface | Lacks I3C support and MDA; unsuitable for new I3C platform designs or multi-sensor polling efficiency requirements | Select when cost sensitivity outweighs accuracy stability and I3C roadmap alignment |
| MAX31875R2+ | ±1 °C accuracy over full −40 °C to +125 °C range; 1.71–3.6 V supply; no I3C support | Higher voltage range eases integration with 3.3 V systems but lacks I3C dynamic addressing and IBI capability | Select for legacy 3.3 V industrial controllers where I3C is not required and ±1 °C tolerance is acceptable |
Compared with STTS22HTR and MAX31875R2+, the P3T1035HUKAZ uniquely combines ±0.5 °C accuracy across 0–70 °C, I3C SDR compliance, and MDA functionality - making it the only option that simultaneously satisfies next-gen platform requirements for low-power, high-accuracy, and scalable multi-sensor thermal management.
Availability
P3T1035HUKAZ is available at Aetrix Electronics and suitable for SSD thermal management, notebook system monitoring, and industrial IoT edge node applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for P3T1035HUKAZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.
The P3T1035HUKAZ belongs to NXP's precision analog sensor portfolio, designed specifically for high-density, low-power thermal monitoring in memory subsystems and mobile computing platforms where accuracy, size, and interface flexibility are critical.
FAQ
What is the guaranteed accuracy specification for P3T1035HUKAZ across its full operating temperature range?
The P3T1035HUKAZ guarantees ±0.5 °C maximum accuracy from 0 °C to +70 °C when VCC ≥ 1.62 V. Outside this range, accuracy degrades to ±1 °C from −40 °C to +125 °C under the same supply condition. These values are explicitly defined in Section 1 and Table 27 of the P3T1035HUKAZ datasheet Rev. 1.3.
Does P3T1035HUKAZ support true I3C High Data Rate (HDR) modes, or only SDR?
The P3T1035HUKAZ implements MIPI I3C SDR (Single Data Rate) only - it does not support HDR-DDR, HDR-TSP, or HDR-TSL modes. This is confirmed in Section 7.4 ("I3C bus serial interface") of the datasheet, which states "MIPI I3C SDR only target interface" and references SETDASA/GETPID/GETBCR CCCs compliant with I3C v1.1.0 SDR definitions.
How many unique I²C addresses are available for P3T1035HUKAZ, and what is its specific address?
The P3T1035HUKAZ is the 'H' variant in the P3T1035xUK family and has a fixed 7-bit I²C target address of 1110111 (0x77). As shown in Table 2 and Table 5 of the datasheet, eight variants (A–H) provide distinct addresses from 1110000 (0x70) to 1110111 (0x77), enabling up to eight P3T1035HUKAZ units on a single I²C bus without address conflict.
Can P3T1035HUKAZ operate in shutdown mode, and what is its current draw in that state?
Yes, P3T1035HUKAZ supports shutdown mode via M1/M0 bits in the Conf register (01h), reducing supply current to <1 μA (typical). This mode disables the ADC and temperature conversion circuitry while retaining register contents and I²C/I3C interface readiness - ideal for battery-backed systems requiring periodic wake-up thermal checks.
What is the function of the FH and FL bits in the Configuration register of P3T1035HUKAZ?
The FH (flag-high) and FL (flag-low) bits in the Conf register (01h) are status flags set automatically when measured temperature exceeds tHIGH or falls below tLOW register thresholds. They persist until cleared by software write and enable interrupt-driven thermal event handling - a key enabler for I3C in-band interrupts (IBI) as described in Section 7.4.6 of the P3T1035HUKAZ datasheet.
P3T1035HUKAZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 4-UFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Digital
- Sensing Temperature - Local:
- -40°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- I2C, I3C
- Voltage - Supply:
- 1.4V ~ 1.98V
- Resolution:
- 12 b
- Features:
- Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
- Accuracy - Highest (Lowest):
- ±0.5%
- Test Condition:
- 0°C ~ 85°C (-40°C ~ 125°C)
- Operating Temperature:
- -40°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 4-WLCSP (0.83x0.78)
P3T1035HUKAZ FAQ
1.How can I place an order for P3T1035HUKAZ through Aetrix?
Please submit a Request for Quotation (RFQ) for P3T1035HUKAZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P3T1035HUKAZ reliable?
The price and inventory of P3T1035HUKAZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P3T1035HUKAZ is usually 5 days.
3.What payment methods are accepted for P3T1035HUKAZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for P3T1035HUKAZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for P3T1035HUKAZ?
P3T1035HUKAZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your P3T1035HUKAZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for P3T1035HUKAZ?
For technical support, including P3T1035HUKAZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P3T1035HUKAZ requirements.
6.How does Aetrix verify that P3T1035HUKAZ is sourced from the original manufacturer or authorized distributors?
All P3T1035HUKAZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P3T1035HUKAZ meets industry standards.
7.What is the process for return or replacement of P3T1035HUKAZ?
All P3T1035HUKAZ units undergo pre-shipment inspection (PSI). If there is an issue with P3T1035HUKAZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P3T1035HUKAZ part is unused and in its original packaging.
Return procedure for P3T1035HUKAZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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