NXP Semiconductors P89V51RB2FN,112
- Part No.:
- P89V51RB2FN,112
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 40-DIP (0.600", 15.24mm)
- Datasheet:
-
P89V51RB2FN,112.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 40DIP
- Quantity:
- Payment:

- Shipping:

Inventory:2,111
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Product details
Overview
P89V51RB2FN,112 from NXP Semiconductors is an 8-bit 80C51 microcontroller in DIP40 package with 16 kB flash program memory, 1024 B on-chip RAM, and support for both 12-clock and 6-clock (X2) machine cycle modes. It operates from 0 MHz to 40 MHz at 5 V and integrates SPI, enhanced UART, PCA with PWM/capture/compare, three 16-bit timers, and programmable watchdog - used in industrial control panels requiring field firmware updates via ISP.
For engineers reviewing the P89V51RB2FN,112 datasheet, P89V51RB2FN,112 pinout, P89V51RB2FN,112 application, or P89V51RB2FN,112 equivalent, key selection considerations include X2 mode throughput doubling, IAP capability during runtime, brownout detection at 2.35 V, DIP40 through-hole compatibility for prototyping, and 16 mA high-current drive on Port 1 pins P1.5–P1.7.
Technical Context
The P89V51RB2FN,112 implements a standard 80C51 CPU core with dual clock mode selection (12 clocks or 6 clocks per machine cycle), enabling either doubled performance at same frequency or halved EMI by reducing clock frequency while maintaining throughput. Its flash memory supports parallel programming and serial ISP, with dedicated boot block (Block 1) for in-system firmware updates.
It features a Programmable Counter Array (PCA) with five capture/compare modules mapped to Port 1 pins, integrated SPI controller with master/slave operation, and dual DPTR register for efficient external memory access. Brownout detection triggers reset at 2.35 V, and low-power idle/power-down modes support interrupt wake-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | 80C51 8-bit CPU with X2 mode (6-clock machine cycle) for 2× throughput or EMI reduction |
| Flash Memory | 16 kB user code flash with ISP/IAP support - enables field firmware update without removal |
| RAM | 1024 B on-chip data RAM, including 768 B expanded indirectly addressable RAM |
| Clock Range | 0 MHz to 40 MHz at 5 V - full-speed operation up to 40 MHz with standard TTL/CMOS logic levels |
| I/O Capability | Four 8-bit ports; P1.5–P1.7 support 16 mA high-current drive for direct LED/relay interface |
| Peripherals | SPI, enhanced UART, PCA with 5-channel PWM/capture/compare, three 16-bit timers, watchdog timer |
| Operating Temp | −40 °C to +85 °C - qualified for industrial ambient environments |
Pinout & Package
DIP40 plastic dual in-line package (600 mil width), through-hole mountable, compatible with standard 0.1″ pitch breadboards and PCB sockets. Pin count and layout conform to JEDEC MS-026AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0/AD0 – P0.7/AD7 | Port 0 bidirectional I/O / multiplexed address/data bus | Open-drain outputs with internal pull-ups; used for external memory interfacing or general-purpose I/O |
| P1.0/T2 – P1.7/SPICLK/CEX4 | Port 1 bidirectional I/O with alternate functions | Includes Timer2 I/O (P1.0), PCA channels CEX0–CEX4 (P1.3–P1.7), SPI signals, and ECI clock input |
| P2.0/A8 – P2.7/A15 | Port 2 bidirectional I/O / high-order address bus | Provides A8–A15 during external memory access; internal pull-ups enable use as general I/O |
| P3.0/RXD – P3.7/RD | Port 3 bidirectional I/O with hardware functions | Serial RX/TX, INT0/INT1, T0/T1, WR/RD strobes - essential for UART communication and external memory control |
| RST | Active-high reset input | Two-machine-cycle HIGH pulse required for reset; also enters external host mode when combined with PSEN transition |
| EA | External Access Enable | Must be tied to VDD for internal flash execution; VSS enables external program memory fetch |
| ALE/PROG | Address Latch Enable / programming pulse | Latches P0 address bits during external memory access; serves as PROG signal during flash programming |
| XTAL1/XTAL2 | Crystal oscillator inputs | Supports quartz crystal or ceramic resonator; ALE frequency is 1/6 crystal freq (1/3 in X2 mode) |
Key Features
| Feature | Design Value |
|---|---|
| X2 Mode Selection | Software-selectable 6-clock machine cycle doubles instruction throughput or halves clock frequency for EMI reduction |
| In-Application Programming (IAP) | Reconfigure flash memory while application runs - enables dynamic firmware patching without halting system operation |
| Programmable Counter Array (PCA) | Five independent capture/compare modules with PWM output - supports motor control, LED dimming, and time-critical event handling |
| Brownout Detection | Hardware reset triggered at 2.35 V supply threshold - prevents erratic operation during undervoltage conditions |
| High-Current I/O Pins | P1.5, P1.6, P1.7 each deliver 16 mA sink/source - eliminates need for external drivers in low-power actuator interfaces |
| Low-EMI Mode | ALE inhibit via AO bit disables address latch pulses - reduces radiated emissions in noise-sensitive applications |
Applications
| Industrial Control Panel | Embedded Data Logger |
|---|---|
Use Scenario: Standalone panel with pushbuttons, LEDs, and RS-232 interface managing HVAC zone settings and fault reporting. IC Role / Device Role / Timing Role: Primary controller executing real-time logic, driving indicators, and communicating via UART with supervisory PC. Use Value: X2 mode ensures responsive UI updates at 20 MHz clock; IAP allows remote firmware patches via serial port without hardware intervention. |
Use Scenario: Battery-powered environmental sensor node logging temperature/humidity every 10 seconds to SD card via SPI. IC Role / Device Role / Timing Role: System-on-chip managing ADC sampling, time-stamping, SPI-based storage, and low-power sleep/wake cycles. Use Value: Power-down mode with INT0 wake-up extends battery life; 16 kB flash stores firmware + configuration + firmware update image. |
| Legacy Equipment Retrofit | Education & Prototyping Platform |
Use Scenario: Replacing obsolete 8051 variants in factory-floor test fixtures with minimal PCB redesign. IC Role / Device Role / Timing Role: Drop-in functional replacement providing identical pinout, timing, and instruction set compatibility. Use Value: DIP40 package matches legacy socket footprint; 5 V operation and TTL/CMOS compatibility ensure seamless integration. |
Use Scenario: University lab board for teaching embedded systems, featuring breadboard-accessible I/O, crystal oscillator, and ISP header. IC Role / Device Role / Timing Role: Hands-on learning platform demonstrating UART debugging, PWM motor control, and flash reprogramming. Use Value: On-board ISP header and DIP40 format simplify student wiring; X2 mode illustrates performance trade-offs in real time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT89C51-24PU | 128 B RAM, no ISP/IAP, 4 kB flash, 24 MHz max, no X2 mode or PCA | Limited to simple fixed-function control; no field update capability | Select only if cost sensitivity outweighs upgrade path and peripheral needs |
| STC89C52RC-PDIP40 | 8 kB flash, 512 B RAM, 1T 8051 core (equivalent to X2), no official ISP spec, lower qualification grade | Consumer-grade timing margin; lacks NXP's industrial temp rating and brownout precision | Acceptable for non-critical commercial prototypes; avoid in certified industrial deployments |
Compared with AT89C51-24PU and STC89C52RC-PDIP40, the P89V51RB2FN,112 delivers verified industrial temperature operation, deterministic brownout reset at 2.35 V, and production-ready ISP/IAP - making it suitable for long-lifecycle equipment where firmware maintenance and reliability are mandatory.
Availability
P89V51RB2FN,112 is available at Aetrix Electronics and suitable for industrial control panels, embedded data loggers, legacy equipment retrofits, and education platforms requiring stable component supply and long-term manufacturability.
Supply support for P89V51RB2FN,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The P89V51RB2FN,112 belongs to NXP's legacy 80C51 microcontroller family, designed for cost-sensitive, high-reliability industrial control and retrofit applications requiring proven architecture, long-term support, and robust in-system programmability.
FAQ
What is the maximum operating frequency of the P89V51RB2FN,112?
The P89V51RB2FN,112 supports a maximum crystal frequency of 40 MHz across its full industrial temperature range (−40 °C to +85 °C). In X2 mode, this yields effective instruction throughput equivalent to an 80 MHz traditional 8051, while maintaining full electrical and timing compliance per the NXP datasheet Rev. 05.
Does the P89V51RB2FN,112 support in-application programming (IAP)?
Yes, the P89V51RB2FN,112 supports true IAP: flash memory can be reprogrammed while the main application continues executing. This requires configuring the flash bank select bits (BSEL/SWR in FCF register) and using the built-in IAP routines located in Block 1 - fully documented in the NXP P89V51RB2_RC2_RD2_5 datasheet section 6.2.1.
What package type is used for the P89V51RB2FN,112?
The P89V51RB2FN,112 uses a plastic dual in-line package with 40 leads (DIP40), 600 mil width, per ordering code SOT129-1. It is pin-compatible with standard 8051 DIP sockets and supports through-hole assembly, prototyping on solderless breadboards, and manual rework.
How does the X2 mode affect ALE frequency on the P89V51RB2FN,112?
In X2 mode, the ALE signal on the P89V51RB2FN,112 is emitted at one-third of the crystal frequency (not one-sixth as in default mode). This higher ALE rate supports faster external memory latching but increases EMI - the ALE inhibit function (AO bit) remains available to disable it entirely when needed.
Which pins on the P89V51RB2FN,112 support 16 mA drive current?
Port 1 pins P1.5 (MOSI/CEX2), P1.6 (MISO/CEX3), and P1.7 (SPICLK/CEX4) each support 16 mA sink/source capability on the P89V51RB2FN,112. This is explicitly specified in Table 3 of the NXP datasheet and enables direct driving of LEDs, small relays, or optocouplers without external buffer transistors.
P89V51RB2FN,112 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 40-DIP (0.600", 15.24mm)
- Series:
- 89V
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- 8051
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 32
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
P89V51RB2FN,112 FAQ
1.How can I place an order for P89V51RB2FN,112 through Aetrix?
Please submit a Request for Quotation (RFQ) for P89V51RB2FN,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for P89V51RB2FN,112 reliable?
The price and inventory of P89V51RB2FN,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for P89V51RB2FN,112 is usually 5 days.
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5.How can I obtain technical support or documentation for P89V51RB2FN,112?
For technical support, including P89V51RB2FN,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your P89V51RB2FN,112 requirements.
6.How does Aetrix verify that P89V51RB2FN,112 is sourced from the original manufacturer or authorized distributors?
All P89V51RB2FN,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that P89V51RB2FN,112 meets industry standards.
7.What is the process for return or replacement of P89V51RB2FN,112?
All P89V51RB2FN,112 units undergo pre-shipment inspection (PSI). If there is an issue with P89V51RB2FN,112, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The P89V51RB2FN,112 part is unused and in its original packaging.
Return procedure for P89V51RB2FN,112:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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