Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Voltage Regulators - DC DC Switching Regulators

Diodes Incorporated PAM2306AYPCB

Name: PAM2306AYPCB
Brand: Diodes Incorporated
SKU: PAM2306AYPCB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: PAM2306AYPCB

Manufacturer:: Diodes Incorporated

Category:: Voltage Regulators - DC DC Switching Regulators

Package:: 12-WFDFN Exposed Pad

Datasheet:: PAM2306AYPCB.pdf

Description:: IC REG BCK 1.2V/1.5V DL 12WDFN

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,012

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

PAM2306AYPCB from Diodes Incorporated is a dual-channel, current-mode PWM step-down DC-DC converter in U-DFN3030-12 package, delivering up to 1A per channel with 96% peak efficiency, 1.5MHz switching frequency, and 40μA typical quiescent current per channel. It supports 2.5V–5.5V input and offers fixed or adjustable outputs (e.g., 3.3V/2.8V/1.8V), targeting battery-powered portable electronics requiring high light-load efficiency and compact power management.

For engineers reviewing the PAM2306AYPCB datasheet, PAM2306AYPCB pinout, PAM2306AYPCB application, or PAM2306AYPCB equivalent, key selection criteria include dual-output synchronization capability, PSM/PWM mode transition behavior, thermal shutdown hysteresis (+30°C), feedback reference voltage accuracy (±2%), and EN pin logic compatibility with 1.5V high-threshold control signals.

Technical Context

The PAM2306AYPCB integrates two independent synchronous buck regulators sharing no internal coupling-each with its own P-channel high-side and N-channel low-side MOSFETs (R_DS(ON) = 0.3–0.45Ω / 0.35–0.5Ω), 0.6V reference, and cycle-by-cycle peak-current limiting (1.5A typical). Control is implemented via constant-frequency PWM at 1.2–1.8MHz, with automatic transition to pulse-skipping mode below ~100mA load per channel.

It features separate enable (EN1/EN2), feedback (FB1/FB2), and switch-node (LX1/LX2) pins for independent channel control and layout optimization. Under-voltage lockout triggers below 2.5V input, and thermal shutdown activates at +150°C with +30°C hysteresis-ensuring safe operation under sustained overload or poor PCB thermal design.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.5V to 5.5V - supports single Li+/Li-Po cell, USB 5V, or multi-cell alkaline/NiMH sources without external regulation.
Output Current (per channel)	Up to 1A - sufficient to power core logic, RF transceivers, or display drivers in portable systems.
Switching Frequency	1.5MHz (typ.) - enables use of small 2.2µH inductors and ceramic capacitors for space-constrained layouts.
Feedback Reference Voltage	0.6V ±2% - sets output via external resistor divider; enables precise 1.2V–3.3V fixed or adjustable regulation.
Quiescent Current (per channel)	40μA (typ.) - extends battery runtime in standby/sleep modes of handheld devices.
Efficiency (peak)	96% - minimizes power loss and heat generation in thermally restricted enclosures.
Shutdown Current (per channel)	0.1μA (typ.) - isolates input from output during system off-state, preventing battery drain.

Pinout & Package

U-DFN3030-12 (3.0mm × 3.0mm × 0.6mm) with exposed thermal pad (Pin 3/9) requiring solder connection to PCB ground plane for optimal thermal performance (θ_JA = 60°C/W).

Pin/Terminal	Circuit Role	Design Meaning
1 VIN2	Power Input (Channel 2)	Independent 2.5–5.5V supply rail for second buck stage; decoupling capacitor must be placed adjacent.
2 LX2	Switch Node (Channel 2)	Connection point for inductor and output capacitor; high dv/dt node requiring short, low-inductance routing.
3,9 Exposed Pad	Thermal & Electrical Ground	Mandatory solder connection to large GND copper area; primary path for heat dissipation and noise return.
4 FB1	Feedback Input (Channel 1)	Senses regulated output voltage via resistor divider; high-impedance node sensitive to noise coupling.
5,11 NC1, NC2	No Connection	Unbonded die pads; must remain unconnected and un-routed on PCB.
6 EN1	Enable Input (Channel 1, Active High)	Logic-level control (V_EH = 1.5V min) to start/stop Channel 1; pulls down to <0.3V to disable.
7 VIN1	Power Input (Channel 1)	Independent input for first buck stage; may be tied to VIN2 if rails share source.
8 LX1	Switch Node (Channel 1)	High-frequency switching node for Channel 1; requires identical layout care as LX2.
10 FB2	Feedback Input (Channel 2)	Independent regulation sensing for Channel 2; routed separately from FB1 to avoid crosstalk.
12 EN2	Enable Input (Channel 2, Active High)	Asynchronous enable control for Channel 2; allows staggered startup or independent power domain sequencing.

Key Features

Feature	Design Value
Dual independent buck regulators	Enables simultaneous generation of two distinct supply rails (e.g., 3.3V I/O + 1.8V core) with separate enable and feedback paths.
Pulse-Skipping Modulation (PSM)	Reduces quiescent current to 40μA/channel at light loads while maintaining regulation-critical for always-on sensor nodes.
Internal synchronous rectification	Eliminates external Schottky diodes; improves efficiency by 8–12% vs. asynchronous designs at 500mA load.
Soft-start circuitry	Gradually ramps output voltage over ~1ms to limit inrush current and prevent input rail collapse during startup.
Comprehensive protection suite	Includes cycle-by-cycle overcurrent (1.5A peak), thermal shutdown (+150°C), UVLO (2.5V), and short-circuit foldback (400kHz min freq).

Applications

Smartphone Baseband Power

Wireless Modem RF Core Supply

Use Scenario: Dual-rail power for application processor (1.2V core) and PMIC interface (3.3V I/O) in LTE/5G smartphones.

IC Role / Device Role / Timing Role: Primary dual-output DC-DC regulator managing dynamic voltage scaling and sleep-mode transitions.

Use Value: 96% efficiency at 800mA load reduces thermal load on stacked PCBs; PSM mode extends standby time beyond 72 hours.

Use Scenario: Dedicated 1.8V supply for RF transceiver IC in DSL/wireless modems operating from USB 5V input.

IC Role / Device Role / Timing Role: Isolated low-noise buck converter minimizing switching interference on sensitive RF receive paths.

Use Value: Independent EN2 control enables RF section power gating during idle; 1.5MHz switching avoids critical 2.4GHz ISM band harmonics.

Portable Medical Sensor Hub

Industrial Handheld Terminal

Use Scenario: Powering ultra-low-power MCU (1.8V), analog front-end (2.5V), and BLE radio (3.3V) in battery-operated ECG monitors.

IC Role / Device Role / Timing Role: Central power management IC enabling coordinated wake-up and deep-sleep sequencing across subsystems.

Use Value: 40μA/channel quiescent current ensures >14-day battery life on CR2032; thermal shutdown prevents overheating in sealed enclosures.

Use Scenario: Dual-rail supply (3.3V logic, 5V display backlight) in ruggedized barcode scanners powered by 3.7V Li-ion packs.

IC Role / Device Role / Timing Role: Main DC-DC converter supporting wide-input operation (2.5–5.5V) across battery charge/discharge cycles.

Use Value: UVLO prevents deep discharge damage to Li-ion cells; 1A per channel sustains peak backlight + scanner laser current surges.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output buck regulator applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TPS62130ARGTR	Single-channel 3A buck; no dual-output capability; higher IQ (19μA) but lower dropout.	Requires two ICs to replicate dual-rail function; better suited for high-current single-rail systems.	Select when total output current exceeds 1A per rail or when footprint allows discrete channel implementation.
RT8059ZSP	Dual-channel, but fixed 3.3V/1.8V outputs only; no adjustable option; 2.5MHz switching.	Lacks flexibility for custom voltage combinations; optimized for memory + I/O rail pairs in embedded controllers.	Choose when standard voltage pairing suffices and board space permits slightly larger 3×3 QFN package.

Compared with TPS62130ARGTR and RT8059ZSP, the PAM2306AYPCB uniquely balances dual independent regulation, adjustable output flexibility, and ultra-low light-load IQ in a 3×3mm footprint-making it optimal for space-constrained, multi-rail portable designs where voltage customization and battery longevity are critical.

Availability

PAM2306AYPCB is available at Aetrix Electronics and suitable for smartphone baseband power, wireless modem RF core supply, portable medical sensor hubs, and industrial handheld terminals requiring stable component supply across production lifecycles.

Supply support for PAM2306AYPCB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

The PAM2306 belongs to Diodes' Power Management IC portfolio, designed specifically for compact, battery-sensitive portable electronics needing dual independent DC-DC conversion with minimal external components and robust protection.

FAQ

What is the maximum recommended PCB copper area for the exposed thermal pad?

The exposed pad (Pins 3 and 9) must be soldered to a minimum 40 mm² continuous GND copper pour with ≥4 thermal vias (0.3mm diameter, spaced ≤1mm apart) connecting to inner-layer GND planes. This achieves the specified θ_JA = 60°C/W and prevents junction temperature exceedance above 125°C at full 1A load per channel.

Can FB1 and FB2 be tied together to force synchronized regulation?

No-FB1 and FB2 are independent high-impedance inputs with separate internal reference buffers. Tying them risks instability due to mismatched feedback loop dynamics and violates the functional block diagram. For synchronized outputs, use external resistor dividers with matched ratios and route FB traces separately with guard rings.

Does PAM2306AYPCB support forced PWM mode without PSM?

No-PSM mode is automatic and non-disableable. The device transitions seamlessly between PWM (heavy load) and PSM (light load) based on output current demand. There is no pin or register to force continuous PWM; this architecture prioritizes quiescent current minimization over ripple consistency.

What is the minimum inductor DCR allowed for stable 1A operation?

Inductor DCR must not exceed 85mΩ to maintain peak switch current limit margin. At 1A load and 0.45Ω high-side R_DS(ON), the worst-case voltage drop across DCR plus R_DS(ON) must stay below the 1.5A current-limit threshold-verified using Equation (1) in the datasheet with ΔI_L = 400mA ripple target.

PAM2306AYPCB Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: 12-WFDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Discontinued at Digi-Key

Function:: Step-Down

Output Configuration:: Positive

Topology:: Buck

Output Type:: Fixed

Number of Outputs:: 2

Voltage - Input (Min):: 2.5V

Voltage - Input (Max):: 5.5V

Voltage - Output (Min/Fixed):: 1.2V, 1.5V

Voltage - Output (Max):: -

Current - Output:: 1A

Frequency - Switching:: 1.5MHz

Synchronous Rectifier:: Yes

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: W-DFN3030-12

PAM2306AYPCB FAQ

1.How can I place an order for PAM2306AYPCB through Aetrix?

Please submit a Request for Quotation (RFQ) for PAM2306AYPCB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PAM2306AYPCB reliable?

The price and inventory of PAM2306AYPCB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PAM2306AYPCB is usually 5 days.

3.What payment methods are accepted for PAM2306AYPCB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PAM2306AYPCB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PAM2306AYPCB?

PAM2306AYPCB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PAM2306AYPCB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PAM2306AYPCB?

For technical support, including PAM2306AYPCB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PAM2306AYPCB requirements.

6.How does Aetrix verify that PAM2306AYPCB is sourced from the original manufacturer or authorized distributors?

All PAM2306AYPCB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PAM2306AYPCB meets industry standards.

7.What is the process for return or replacement of PAM2306AYPCB?

All PAM2306AYPCB units undergo pre-shipment inspection (PSI). If there is an issue with PAM2306AYPCB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PAM2306AYPCB part is unused and in its original packaging.

Return procedure for PAM2306AYPCB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…