Diodes Incorporated PAM3101DAB150

Overview

PAM3101DAB150 from Diodes Incorporated is a 1.5V fixed-output, 300mA low-dropout linear regulator with active-high enable and bypass pin in DFN1.6x1.6-6L package. It delivers 65µA quiescent current, 180mV dropout at 300mA (VO=3.3V), and 70dB PSRR at 1kHz-optimized for noise-sensitive battery-powered systems such as Bluetooth earphones and portable audio.

For engineers reviewing the PAM3101DAB150 datasheet, PAM3101DAB150 pinout, PAM3101DAB150 application, or PAM3101DAB150 equivalent, key selection criteria include output voltage accuracy (±2%), thermal shutdown threshold (+150°C), shutdown current (0.01µA typ.), EN logic compatibility (1.5V high threshold), and stability with ≥2.2µF ceramic output capacitance.

Technical Context

The PAM3101DAB150 integrates a 0.75Ω P-channel MOSFET pass transistor enabling ultra-low ground current across load conditions. Its internal feedback loop maintains ±2% output voltage accuracy over line, load, and temperature variations while supporting fast discharge via dedicated VOUT-to-GND path when disabled.

It employs a 10nF capacitor on the BYP pin to form a 200kΩ–10nF RC filter that suppresses high-frequency output noise. The device operates within 2.5V–5.5V input range and features built-in current limiting (400mA typ.) and thermal shutdown with 30°C hysteresis for robust fault protection.

Key Specifications

Pinout & Package

DFN1.6x1.6-6L package: 1.6mm × 1.6mm footprint, 0.5mm pitch, exposed thermal pad for enhanced heat dissipation (θJA = 175°C/W, θJC = 65°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-dropout regulator applications.

Compared with AP2125K-15W5 and XC6206P152MR, the PAM3101DAB150 uniquely combines enable control, bypass filtering, and ultra-low 65µA quiescent current in a 1.6×1.6mm DFN-making it optimal for space-constrained, noise-sensitive, battery-operated designs requiring full power management flexibility.

Availability

PAM3101DAB150 is available at Aetrix Electronics and suitable for Bluetooth earphones, digital cameras, and MP3 players requiring stable component supply with guaranteed long-term availability and traceable sourcing.

Supply support for PAM3101DAB150 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in power management, signal integrity, and protection solutions for consumer, industrial, and communications markets.

The PAM3101 belongs to Diodes' high-PSRR, low-IQ LDO family designed specifically for battery-powered portable electronics where noise immunity, efficiency, and small-footprint integration are critical.

FAQ

What is the minimum input voltage required for PAM3101DAB150 to regulate 1.5V at 300mA?

The minimum input voltage is determined by dropout: VIN(MIN) = VO + VDROP. At 300mA and VO = 1.5V, typical dropout is 230mV (per datasheet Table 1, VO ≥ 3.3V row applies to all outputs ≥1.5V due to PMOS architecture). Thus, VIN(MIN) ≈ 1.73V. However, actual minimum depends on junction temperature and load-design margin recommends ≥1.8V.

Can the BYP pin be left unconnected?

No. The BYP pin must be connected to a 10nF capacitor to GND to ensure specified 50µVRMS output noise performance. Leaving it open degrades high-frequency PSRR and increases output ripple; connecting it directly to GND disables the internal RC filter and eliminates its noise-reduction benefit.

Is PAM3101DAB150 compatible with ceramic output capacitors smaller than 2.2µF?

No. Stability is guaranteed only with ≥2.2µF ceramic output capacitance and ESR >5mΩ. Using smaller values risks oscillation or poor transient response. The 2.2µF minimum is validated across temperature and process corners-reducing below this requires full stability testing per JEDEC JESD22-B103.

Does the NC pin on PAM3101DAB150 require PCB routing or thermal treatment?

No. Pins 2 and 5 are unconnected die pads with no internal bond wire. They may be left floating or tied to GND for mechanical reinforcement-but must not be routed to signals or power nets. No thermal treatment beyond standard DFN reflow profile is needed; the exposed thermal pad remains the sole thermal path.