Diodes Incorporated PAM3101DAB330

Overview

PAM3101DAB330 from Diodes Incorporated is a 3.3V fixed-output, 300mA low-dropout CMOS linear regulator with active-high enable, bypass pin, and DFN1.6x1.6-6L package. It delivers 180mV dropout at 300mA, ±2% output accuracy, 65µA quiescent current, and 70dB PSRR at 1kHz-optimized for noise-sensitive battery-powered audio and RF subsystems in portable electronics.

For engineers reviewing the PAM3101DAB330 datasheet, PAM3101DAB330 pinout, PAM3101DAB330 application, or PAM3101DAB330 equivalent, key selection criteria include dropout voltage under load, EN/BYP pin behavior, thermal resistance (θJA = 175°C/W), stability with ≥2.2µF ceramic output capacitor, and shutdown current of 0.01µA.

Technical Context

The PAM3101DAB330 integrates a 0.75Ω P-channel MOSFET pass transistor enabling ultra-low ground current across load conditions. Its internal feedback loop maintains regulation with 2.2µF minimum output capacitance and requires a 10nF bypass capacitor on the BYP pin to form a 200kΩ–10nF RC filter for high-frequency noise suppression.

It features dual protection: thermal shutdown activates at +150°C with +30°C hysteresis, and current limiting caps output at ~400mA. The EN pin defaults pull-high per ordering code 'D', eliminating external biasing in always-on configurations.

Key Specifications

Pinout & Package

Package: DFN1.6x1.6-6L (1.6mm × 1.6mm, 0.5mm pitch, exposed thermal pad). Compact footprint ideal for space-constrained PCBs in earbuds and wearables.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise LDO regulator applications.

Compared with AP2125K-3.3TRG1 and MCP1700T-3302E/TT, the PAM3101DAB330 uniquely combines 300mA drive, 180mV dropout, integrated BYP filtering, and active-high EN in a 1.6mm² DFN-making it optimal for next-gen compact RF/audio systems requiring both efficiency and signal integrity.

Availability

PAM3101DAB330 is available at Aetrix Electronics and suitable for Bluetooth earphones, Wi-Fi IoT nodes, and portable medical monitors requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.

Supply support for PAM3101DAB330 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs for power management, signal integrity, and connectivity applications.

The PAM3101 belongs to Diodes' high-PSRR LDO family designed specifically for noise-critical portable electronics-emphasizing low dropout, ultra-low IQ, and robust stability with ceramic capacitors.

FAQ

What is the recommended output capacitor for PAM3101DAB330?

A minimum 2.2µF X5R or X7R ceramic capacitor with ESR >5mΩ is required for stability. Larger values (e.g., 4.7µF–10µF) improve transient response and PSRR but increase start-up time. Avoid tantalum or aluminum electrolytics due to ESR and aging effects.

How does the BYP pin function, and what capacitor value is required?

The BYP pin connects internally to a 200kΩ resistor forming a low-pass filter with an external capacitor. A 10nF capacitor is recommended to reduce output noise to 50µVRMS (10Hz–100kHz); increasing capacitance lowers noise further but extends startup delay proportionally.

Can PAM3101DAB330 operate with a 2.8V input when regulating 3.3V output?

No. With a 3.3V output and 180mV typical dropout, minimum input is 3.48V. At 2.8V input, the device enters dropout and cannot regulate-output collapses to ~2.6V. It requires VIN ≥ VO + VDROP across full load and temperature range.

Is the exposed thermal pad on the DFN1.6x1.6-6L package electrically connected?

Yes-the exposed pad is internally connected to GND and serves as the primary thermal and electrical ground path. It must be soldered to a dedicated PCB thermal pad with ≥4 thermal vias to inner ground planes to achieve the specified θJA = 175°C/W and prevent thermal shutdown under 300mA load.