Nexperia USA Inc. PBRN113ZT,215

Overview

PBRN113ZT,215 from Nexperia is an NPN resistor-equipped transistor (RET) in SOT23 package, designed as a single-chip replacement for base-biased BJT + two external resistors. It delivers 600 mA output current, 40 V V_CEO, and low 500–720 mV V_CEsat at 600 mA, with built-in R1 = 1 kΩ and R2/R1 = 10 ratio for simplified digital switching in automotive body control modules.

For engineers reviewing the PBRN113ZT,215 datasheet, PBRN113ZT,215 pinout, PBRN113ZT,215 application, or PBRN113ZT,215 equivalent, key selection criteria include verified V_CEsat at 600 mA, ±10% R2/R1 tolerance, thermal resistance to solder point (105 K/W), and compatibility with FR4 PCBs using standard SOT23 footprints.

Technical Context

This PB-series RET integrates precision biasing network (R1 = 1 kΩ, R2 = 10 kΩ) directly into the die, eliminating discrete base resistors and reducing layout area by ~30%. Its low V_CEsat (typ. 720 mV @ 600 mA) enables efficient medium-current switching without active cooling on standard FR4 boards.

The device operates with VI(on) = 0.7 V (typ.) and VI(off) = 0.5 V (typ.), supporting direct interfacing with 3.3 V and 5 V logic families. Thermal performance is characterized for two mounting conditions: R_th(j-a) = 500 K/W (standard footprint) and 338 K/W (enhanced collector pad), enabling accurate power derating in compact designs.

Key Specifications

Pinout & Package

SOT23 (TO-236AB) plastic surface-mount package: 2.9 mm × 1.3 mm × 1.0 mm body, 1.9 mm lead pitch, 3-terminal configuration with gull-wing leads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN resistor-equipped transistor applications.

Compared with NSV11201MZ4T1G, PBRN113ZT,215 offers 50% higher output current at same voltage rating; compared with MMBT3904 variants, it eliminates base-resistor design effort and supports 3× the load current in identical SOT23 footprint.

Availability

PBRN113ZT,215 is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC outputs, and smart home load switching requiring stable component supply and long-term manufacturability.

Supply support for PBRN113ZT,215 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability essential semiconductors for automotive, industrial, and consumer applications.

PBRN113ZT,215 belongs to Nexperia's Performance-Based Resistor-Equipped Transistor (PB RET) product line, engineered to replace discrete BJT + resistor combinations in cost- and space-constrained digital switching applications.

FAQ

What is the maximum continuous output current for PBRN113ZT,215 under standard PCB conditions?

The device is rated for 600 mA continuous DC output current when mounted on a standard FR4 PCB (single-sided, 35 µm copper, tin-plated, standard SOT23 footprint). This rating assumes Tamb ≤ 25 °C and accounts for thermal derating per Figure 1 in the datasheet; at 75 °C ambient, derated current is ~420 mA.

Can PBRN113ZT,215 replace a discrete BJT + two resistors in existing designs?

Yes - it is a direct functional replacement for NPN BJTs like BC817 with external 1 kΩ and 10 kΩ base resistors. Pin-compatible with standard SOT23 footprints, it connects identically: Pin 1 to logic input, Pin 2 to ground, Pin 3 to load. No layout changes are needed beyond removing the two resistors.

What is the significance of the ±10 % R2/R1 tolerance specification?

This tolerance ensures consistent turn-on characteristics across temperature and process variation: it guarantees that the internal resistor ratio remains between 9 and 11, maintaining predictable base current and thus stable h_FE-dependent saturation behavior - critical for reliable digital switching in automotive and industrial environments.

Does PBRN113ZT,215 require a heatsink in typical applications?

No - with R_th(j-sp) = 105 K/W and P_tot = 370 mW (on enhanced pad), dissipation at 600 mA and 720 mV V_CEsat is ~432 mW, resulting in ~45 °C junction rise above solder point. On standard FR4 (R_th(j-a) = 500 K/W), total rise is ~216 °C - so thermal design must use the enhanced pad or limit duty cycle; no external heatsink is used due to SOT23 form factor.