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Nexperia USA Inc. PBSS302PZ-QF

Part No.:
PBSS302PZ-QF
Manufacturer:
Nexperia USA Inc.
Category:
Single Bipolar Transistors
Package:
TO-261-4, TO-261AA
Datasheet:
AetrixPBSS302PZ-QF.pdf
Description:
TRANS PNP 20V 5.5A SOT-223
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,877

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Product details

Overview

PBSS302PZ-QF from Nexperia is a PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in SOT223 (SC-73) package, designed for high-efficiency switching in power-constrained circuits. It delivers −5.5 A continuous collector current, −20 V VCEO, and 35–50 mΩ RCEsat at −4 A/−200 mA drive, enabling compact DC-DC converters and MOSFET gate drivers.

For engineers reviewing the PBSS302PZ-QF datasheet, PBSS302PZ-QF pinout, PBSS302PZ-QF application, or PBSS302PZ-QF equivalent, this page provides verified electrical parameters, thermal performance on FR4 and ceramic PCBs, junction-to-solder-point resistance (15 K/W), and validated use cases in motor control and charging circuits - all derived from Nexperia's official 2009 product data sheet Rev. 02.

Technical Context

This BISS transistor uses optimized epitaxial base and emitter structures to achieve high hFE (250–370 at −0.5 A) while maintaining ultra-low saturation voltage. Its dual-collector pin configuration (pins 2 and 4) supports enhanced thermal dissipation via extended copper pad routing.

Switching performance is characterized with td = 10 ns, tr = 55 ns, toff = 350 ns under −12.5 V VCC, −3 A IC, and ±0.15 A base drive - confirming suitability for medium-frequency (<1 MHz) power switching where conduction loss dominates.

Key Specifications

Parameter Value and Actual Design Meaning
VCEO −20 V: Maximum safe blocking voltage across collector-emitter with base open; defines upper limit for DC-DC input stage selection.
IC −5.5 A: Continuous DC collector current rating at Tamb ≤25 °C on standard FR4; enables direct replacement of TO-220 transistors in space-constrained designs.
RCEsat 35–50 mΩ at −4 A/−200 mA: Low on-resistance reduces conduction loss to <160 mW, minimizing heatsink requirements.
hFE 250–370 at −0.5 A: High DC current gain allows low-base-drive-current operation, easing MCU GPIO or logic-level driver interface.
toff 350 ns: Total turn-off time under defined test conditions; supports PWM frequencies up to ~300 kHz without excessive switching loss.
Rth(j-sp) 15 K/W: Junction-to-solder-point thermal resistance; enables accurate thermal modeling when soldered to 6 cm² copper pour on FR4.
fT 130 MHz: Transition frequency at −10 V VCE, −100 mA IC; confirms adequate small-signal bandwidth for feedback loop stability in regulator designs.

Pinout & Package

SOT223 (SC-73) surface-mount plastic package with 4 leads and integrated heat sink pad; pins 2 and 4 are internally connected collectors for improved thermal transfer and current sharing.

Pin/Terminal Circuit Role Design Meaning
1 Base Control terminal accepting negative current to enable PNP conduction; requires current-limiting resistor when driven from logic.
2 Collector Main high-current output node; electrically tied to pin 4; must be routed to large copper area for thermal management.
3 Emiter Power return path; connects to system ground or supply rail depending on high-side/low-side switch topology.
4 Collector Second collector terminal, internally bonded to pin 2; used for redundant routing or split-current paths in high-reliability layouts.

Key Features

Feature Design Value
Low VCEsat −140 to −200 mV at −4 A/−200 mA: Reduces power dissipation by >50% vs. conventional PNP transistors, enabling smaller PCB footprints.
High IC capability −5.5 A continuous rating: Supports single-device implementation in 10–20 W power stages without paralleling.
High hFE at high current 150–220 at −4 A: Maintains strong current amplification under load, reducing required base drive power and driver complexity.
Thermal resistance Rth(j-sp) 15 K/W: Enables precise junction temperature estimation using solder point temperature measurement during thermal validation.
Peak ICM −11 A (1 ms pulse): Allows handling of inrush currents in motor startup or capacitor charging without device failure.

Applications

DC-DC Converter Switch MOSFET Gate Driver

Use Scenario: Step-down (buck) converter operating at 200–500 kHz with 12 V input and 3.3 V/3 A output.

IC Role / Device Role / Timing Role: High-side synchronous rectifier switch replacing Schottky diode; conducts during low-side FET off-time.

Use Value: 35 mΩ RCEsat cuts conduction loss to 350 mW at 3 A, improving efficiency by 2.1% over diode solution and eliminating reverse recovery loss.

Use Scenario: Driving N-channel MOSFET gates in half-bridge motor driver with 24 V bus and 10 A peak load.

IC Role / Device Role / Timing Role: Active pull-down transistor discharging gate capacitance rapidly during turn-off phase.

Use Value: 350 ns toff ensures <100 ns dead-time margin at 20 kHz PWM, preventing shoot-through while supporting fast torque response.

Brushed DC Motor Control Battery Charging Circuit

Use Scenario: H-bridge driver for 12 V, 5 A brushed DC fan in industrial HVAC system.

IC Role / Device Role / Timing Role: Low-side switch controlling motor direction and speed via PWM duty cycle.

Use Value: −5.5 A IC rating handles stall current without derating; 150 °C Tj max supports operation in sealed enclosures up to 85 °C ambient.

Use Scenario: Constant-current charger for 3-cell Li-ion battery pack (12.6 V full) with 2 A charge rate.

IC Role / Device Role / Timing Role: Series pass element regulating current into battery through linear control loop.

Use Value: −20 V VCEO accommodates input ripple up to 18 V; 50 mΩ RCEsat limits dropout to 100 mV at 2 A, minimizing thermal stress during CC phase.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP low-VCEsat transistor applications.

Alternative Part Technical Difference Application Difference Selection Advice
DMT3005LPS-7 −30 V VCEO, −5 A IC, 45 mΩ RCEsat, SOT223 package; higher voltage rating but lower current gain (hFE = 100–200 at −2 A). Preferred in 24 V systems requiring margin above 20 V; less suitable for low-base-drive microcontroller interfaces due to reduced hFE. Select when VIN exceeds 18 V and board layout permits minor hFE-driven base resistor adjustment.
BC807-40,215 −45 V VCEO, −500 mA IC, 300 mΩ RCEsat, SOT23 package; significantly lower current capability and higher saturation voltage. Only viable for signal-level or pre-driver stages; cannot replace PBSS302PZ-QF in main power switching roles. Use only in base-drive buffering or level-shifting sub-circuits-not as a functional substitute in power paths.

Compared with DMT3005LPS-7, PBSS302PZ-QF offers superior hFE and lower RCEsat at rated current, simplifying drive circuitry and improving efficiency in 12 V systems; versus BC807-40, it delivers 11× higher current and 8.5× lower on-resistance, making it a true power-grade replacement rather than a signal-level part.

Availability

PBSS302PZ-QF is available at Aetrix Electronics and suitable for DC-DC conversion, motor control, and battery charging applications requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.

Supply support for PBSS302PZ-QF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, formed in 2017 from the former NXP Standard Products division, with focus on automotive, industrial, computing, and consumer markets.

PBSS302PZ-QF belongs to Nexperia's BISS transistor product line, engineered specifically for high-current, low-saturation-voltage switching in space-constrained power management circuits where thermal efficiency and drive simplicity are critical.

FAQ

What is the maximum allowable junction temperature for PBSS302PZ-QF?

The absolute maximum junction temperature (Tj) is 150 °C, as specified in Table 5 of the Nexperia datasheet. Operation beyond this limit risks permanent degradation of hFE and increased leakage. Derating curves in Figure 1 show that total power dissipation must be reduced to 1.7 W on FR4 with 6 cm² collector pad, or 2 W on ceramic Al2O3, to maintain Tj ≤150 °C at 25 °C ambient.

Can PBSS302PZ-QF be used in high-frequency switching applications above 1 MHz?

No - its 350 ns turn-off time and 130 MHz fT limit practical use to PWM frequencies below 500 kHz. At 1 MHz, switching losses dominate due to insufficient fall time margin, causing excessive heating. For >1 MHz operation, consider RF-optimized transistors like the PUMH10 or dedicated gate drivers paired with low-Qg MOSFETs.

How does the dual-collector pin configuration (pins 2 and 4) affect PCB layout?

Pins 2 and 4 are internally shorted collectors, intended for parallel copper pours to maximize thermal conduction from the die to the PCB. Layout best practice is to connect both pins to a shared thermal pad ≥6 cm² on inner or outer layers, using multiple vias to internal ground/power planes - not to route them separately as independent nodes.

Is PBSS302PZ-QF pin-compatible with its NPN complement PBSS302NZ?

No - although both use SOT223 packages, their pinouts differ: PBSS302PZ-QF has Base–Collector–Emitter–Collector (1–2–3–4), while PBSS302NZ uses Emitter–Collector–Base–Collector (1–2–3–4). Swapping them without layout revision will cause immediate circuit failure due to reversed polarity and misconnected terminals.

PBSS302PZ-QF Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
-
Package/Case:
TO-261-4, TO-261AA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Transistor Type:
PNP
Current - Collector (Ic) (Max):
5.5 A
Voltage - Collector Emitter Breakdown (Max):
20 V
Vce Saturation (Max) @ Ib, Ic:
320mV @ 40mA, 4A
Current - Collector Cutoff (Max):
100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce:
250 @ 1A, 2V
Power - Max:
700 mW
Frequency - Transition:
130MHz
Operating Temperature:
150°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-223

PBSS302PZ-QF FAQ

1.How can I place an order for PBSS302PZ-QF through Aetrix?

Please submit a Request for Quotation (RFQ) for PBSS302PZ-QF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PBSS302PZ-QF reliable?

The price and inventory of PBSS302PZ-QF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PBSS302PZ-QF is usually 5 days.

3.What payment methods are accepted for PBSS302PZ-QF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PBSS302PZ-QF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PBSS302PZ-QF?

PBSS302PZ-QF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PBSS302PZ-QF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PBSS302PZ-QF?

For technical support, including PBSS302PZ-QF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PBSS302PZ-QF requirements.

6.How does Aetrix verify that PBSS302PZ-QF is sourced from the original manufacturer or authorized distributors?

All PBSS302PZ-QF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PBSS302PZ-QF meets industry standards.

7.What is the process for return or replacement of PBSS302PZ-QF?

All PBSS302PZ-QF units undergo pre-shipment inspection (PSI). If there is an issue with PBSS302PZ-QF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PBSS302PZ-QF part is unused and in its original packaging.

Return procedure for PBSS302PZ-QF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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