Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Single Bipolar Transistors

Nexperia USA Inc. PBSS5240XF

Name: PBSS5240XF
Brand: Nexperia USA Inc.
SKU: PBSS5240XF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: PBSS5240XF

Manufacturer:: Nexperia USA Inc.

Category:: Single Bipolar Transistors

Package:: TO-243AA

Datasheet:: PBSS5240XF.pdf

Description:: TRANS PNP 40V 2A SOT-89

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:12,658

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

PBSS5240XF from Nexperia is a PNP low V_CEsat (BISS) transistor in SOT89 package, designed for high-efficiency switching in low-voltage DC-DC converters and load drivers. It delivers −2 A continuous collector current, −40 V V_CEO, and 310 mΩ R_CEsat at −1 A/−100 mA drive, enabling compact thermal design in battery-powered LED backlighting and relay drivers.

For engineers reviewing the PBSS5240XF datasheet, PBSS5240XF pinout, PBSS5240XF application, or PBSS5240XF equivalent, key selection criteria include verified V_CEsat performance at −1 A, thermal resistance to ambient under defined PCB mounting conditions, SOT89 lead-frame thermal pad layout compatibility, and PNP BISS architecture suitability for high-side switching with reduced conduction loss.

Technical Context

This device implements a Breakthrough In Small Signal (BISS) PNP structure optimized for low saturation voltage without compromising gain-bandwidth trade-offs: f_T = 150 MHz at −10 V V_CE, −50 mA I_C, supporting fast switching in PWM-controlled loads. Its h_FE ranges from 55 (at −2 A pulsed) to 140 (at −100 mA), enabling stable base drive across wide current ranges.

Thermal design relies on validated junction-to-solder-point resistance of 16 K/W and junction-to-ambient derating curves tied to specific FR4 PCB footprints - standard (0.5 W), 1 cm² collector pad (0.95 W), or 6 cm² pad (1.35 W) - ensuring predictable power handling in production layouts.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CEO	−40 V: Maximum safe blocking voltage in open-base configuration for supply-line switching up to 36 V systems.
I_C	−2 A continuous: Sustained load current capability for driving relays, buzzers, or LED strings without forced cooling.
R_CEsat	310 mΩ at −1 A/−100 mA: Enables <0.31 V drop at rated current, reducing conduction loss by >40% vs. standard PNP transistors.
f_T	150 MHz: Supports clean switching edges in PWM frequencies up to ~10 MHz, minimizing transition losses in DC-DC controllers.
h_FE	55–140: Provides stable current amplification across operating range, allowing simplified base resistor design for both low- and high-current modes.
R_th(j-sp)	16 K/W: Low junction-to-solder-point thermal resistance enables direct thermal coupling to PCB copper, critical for sustained 1 A+ operation.

Pinout & Package

SOT89 plastic surface-mounted package with exposed die pad for enhanced thermal transfer; 3-lead flat-lead outline measuring 4.6 mm × 2.6 mm × 1.8 mm (L × W × H), compatible with standard reflow soldering footprints per Figure 11.

Pin/Terminal	Circuit Role	Design Meaning
1 (E)	Emitter	High-current return path; connected to system ground or negative rail in high-side switch configurations.
2 (C)	Collector	Main power output terminal; bonded to internal die pad for direct thermal conduction to PCB copper area.
3 (B)	Base	Control input requiring −100 mA drive for full saturation at −1 A; logic-level compatible with 3.3 V/5 V microcontrollers via current-limiting resistor.

Key Features

Feature	Design Value
Low V_CEsat	−310 mV at −1 A/−100 mA enables <0.3 W conduction loss, reducing heatsink requirements in space-constrained designs.
High I_C capability	−2 A continuous rating supports direct drive of 12 V automotive relays or multi-string LED arrays without external driver stages.
Robust thermal performance	16 K/W R_th(j-sp) allows >1 W dissipation on 6 cm² copper, eliminating need for discrete thermal vias in many industrial PCBs.
Fast switching response	150 MHz f_T ensures minimal delay and overshoot in feedback-controlled buck regulators and PWM dimming circuits.

Applications

DC-DC Conversion

Supply Line Switching

Use Scenario: Step-down converter in portable medical devices requiring ultra-low dropout and minimal heat generation.

IC Role / Device Role / Timing Role: High-side synchronous rectifier switch controlling energy transfer during low-side FET off-time.

Use Value: 310 mΩ R_CEsat reduces conduction loss by 45% versus standard PNP, extending battery runtime by 12% at 500 mA load.

Use Scenario: Power sequencing control in industrial PLC I/O modules managing 24 V field bus isolation.

IC Role / Device Role / Timing Role: PNP high-side switch enabling controlled ramp-up of downstream 5 V/3.3 V rails with soft-start behavior.

Use Value: −40 V V_CEO withstands 24 V system transients; −2 A rating supports simultaneous activation of multiple isolated channels.

Battery Charger Control

Inductive Load Driver

Use Scenario: Charge path management in dual-battery backup systems for telecom edge routers.

IC Role / Device Role / Timing Role: Reverse-polarity protection and charge-enable switch placed between primary and backup Li-ion cells.

Use Value: −310 mV V_CEsat limits voltage drop to <0.4 V at 1.5 A, preserving >97% charging efficiency across temperature range.

Use Scenario: Driving 12 V DC solenoids and latching relays in smart building HVAC actuators.

IC Role / Device Role / Timing Role: Low-loss interface between MCU GPIO and inductive coil, with integrated flyback diode support.

Use Value: 150 MHz f_T ensures clean turn-off edge, suppressing voltage spikes >40 V and eliminating need for external snubbers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP low-V_CEsat transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MMBT5401	V_CEO = −60 V, but V_CEsat = −500 mV at −10 mA; no BISS optimization; lower I_C (−0.6 A).	Higher voltage margin but unsuitable for >500 mA loads due to excessive saturation loss and thermal runaway risk.	Select only when absolute maximum voltage >40 V is required and load current remains below 200 mA.
BC807-40	V_CEO = −45 V, I_C = −0.5 A, V_CEsat = −700 mV at −100 mA; standard BJT, not BISS.	Limited to low-power signal switching; cannot sustain 1 A+ loads without significant derating or heatsinking.	Acceptable for logic-level translation or low-current bias networks, but not for power switching above 300 mA.

Compared with MMBT5401 and BC807-40, PBSS5240XF uniquely combines −2 A current handling, −310 mV V_CEsat, and SOT89 thermal pad integration - making it the only option among the three capable of delivering >1 W continuous power dissipation in standard FR4 layouts without auxiliary cooling.

Availability

PBSS5240XF is available at Aetrix Electronics and suitable for DC-DC conversion, supply line switching, and inductive load driver applications requiring stable component supply across industrial, medical, and telecom product lifecycles.

Supply support for PBSS5240XF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

PBSS5240XF belongs to Nexperia's BISS transistor family, engineered specifically for high-efficiency, medium-power switching where low saturation voltage and robust thermal performance are critical in space-constrained SMT designs.

FAQ

What is the maximum continuous collector current for PBSS5240XF?

The PBSS5240XF is rated for −2 A continuous collector current (I_C) under standard FR4 PCB mounting with single-sided copper and tin plating. This rating assumes Tamb ≤ 25 °C and proper thermal pad layout per Figure 11; derating applies above 25 °C ambient per Fig. 1 power curves.

Does PBSS5240XF require a heatsink in typical applications?

No external heatsink is required when mounted on an FR4 PCB with a 6 cm² copper collector pad, where it sustains 1.35 W dissipation. With standard footprint (no extended pad), max power drops to 0.5 W - sufficient for ≤500 mA continuous loads at 25 °C ambient without additional thermal management.

How does PBSS5240XF differ from its NPN complement PBSS4240X?

PBSS4240X is the NPN counterpart with identical V_CEO (40 V), I_C (2 A), and R_CEsat (310 mΩ) specs but opposite polarity. It serves low-side switching roles, while PBSS5240XF is optimized for high-side configurations - enabling complementary use in H-bridge or dual-rail power control topologies.

Can PBSS5240XF be used in automotive applications?

PBSS5240XF is not automotive-qualified per Nexperia's legal disclaimers. It lacks AEC-Q101 stress testing and is intended for industrial, medical, and consumer equipment. For automotive use, engineers must select Nexperia's explicitly qualified equivalents such as the PBSS5240XZ (AEC-Q101 compliant variant) with documented PPAP support.

PBSS5240XF Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: -

Package/Case:: TO-243AA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Transistor Type:: PNP

Current - Collector (Ic) (Max):: 2 A

Voltage - Collector Emitter Breakdown (Max):: 40 V

Vce Saturation (Max) @ Ib, Ic:: 140mV @ 5mA, 100mA

Current - Collector Cutoff (Max):: 100nA (ICBO)

DC Current Gain (hFE) (Min) @ Ic, Vce:: 300 @ 1mA, 5V

Power - Max:: 500 mW

Frequency - Transition:: 150MHz

Operating Temperature:: 150°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: SOT-89

PBSS5240XF FAQ

1.How can I place an order for PBSS5240XF through Aetrix?

Please submit a Request for Quotation (RFQ) for PBSS5240XF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PBSS5240XF reliable?

The price and inventory of PBSS5240XF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PBSS5240XF is usually 5 days.

3.What payment methods are accepted for PBSS5240XF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PBSS5240XF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PBSS5240XF?

PBSS5240XF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PBSS5240XF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PBSS5240XF?

For technical support, including PBSS5240XF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PBSS5240XF requirements.

6.How does Aetrix verify that PBSS5240XF is sourced from the original manufacturer or authorized distributors?

All PBSS5240XF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PBSS5240XF meets industry standards.

7.What is the process for return or replacement of PBSS5240XF?

All PBSS5240XF units undergo pre-shipment inspection (PSI). If there is an issue with PBSS5240XF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PBSS5240XF part is unused and in its original packaging.

Return procedure for PBSS5240XF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…