Nexperia USA Inc. PBSS5330PA,115
- Part No.:
- PBSS5330PA,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Bipolar Transistors
- Package:
- 3-PowerUDFN
- Datasheet:
-
PBSS5330PA,115.pdf
- Description:
- TRANS PNP 30V 3A 3HUSON
- Quantity:
- Payment:

- Shipping:

Inventory:858
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Product details
Overview
PBSS5330PA,115 from Nexperia is a PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a DFN2020-3 (SOT1061) leadless package, rated for −30 V VCEO, −3 A IC, and 75 mΩ RCEsat at −3 A/−300 mA drive. It serves as a high-efficiency load switch in battery-powered power management circuits with minimal board space and thermal resistance.
For engineers reviewing the PBSS5330PA,115 datasheet, PBSS5330PA,115 pinout, PBSS5330PA,115 application, or PBSS5330PA,115 equivalent, key selection criteria include its ultra-low saturation resistance, exposed collector pad for thermal dissipation, SOT1061 footprint compatibility, and PNP switching performance under pulsed DC loads up to 5 A peak.
Technical Context
This BISS transistor uses a proprietary silicon structure optimized for low VCEsat while maintaining high current gain (hFE = 100–160 at −3 A) and fast switching (ton = 70 ns, toff = 200 ns). Its base-emitter turn-on voltage is −0.75 V to −1.0 V at −1 A, enabling direct drive from 1.8–3.3 V logic with appropriate base current limiting.
The device features an exposed collector terminal acting as both electrical connection and thermal path, delivering Rth(j-a) as low as 60 K/W on ceramic PCB and 100 K/W on FR4 with 6 cm² copper pad. It operates across −55 °C to +150 °C junction temperature with guaranteed safe operation up to −30 V VCBO and −6 V VEBO.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | −30 V - Maximum allowable collector-emitter voltage with open base; defines safe blocking capability in high-side switch configurations. |
| IC | −3 A - Continuous DC collector current rating; supports sustained load switching in portable power rails and motor drivers. |
| RCEsat | 75 mΩ (typ) - Low saturation resistance at −3 A/−300 mA drive; reduces conduction loss to <100 mW and enables compact thermal design. |
| hFE | 100–160 - DC current gain at −3 A; ensures reliable saturation with modest base drive, reducing gate driver complexity. |
| toff | 200 ns - Turn-off time under −9 V VCC, −2 A IC, ±0.1 A base drive; supports PWM switching up to ~500 kHz without excessive switching loss. |
| Rth(j-a) | 60 K/W - Junction-to-ambient thermal resistance on ceramic PCB; enables >2 W continuous dissipation without active cooling. |
| VBEsat | −0.97 V (typ) - Base-emitter saturation voltage at −3 A/−300 mA; determines minimum required base drive voltage headroom. |
Pinout & Package
Package: DFN2020-3 (SOT1061), 2.0 × 2.0 × 0.65 mm, leadless thermally enhanced plastic package with exposed collector pad (Pin 3) for electrical and thermal conduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Base (B) | Control input requiring −300 mA peak drive for full saturation; connected to microcontroller GPIO or dedicated driver stage. |
| 2 | Emitter (E) | Common reference node tied to system ground or positive rail in high-side configuration; carries full load current. |
| 3 | Collector (C) | Power output terminal and thermal interface; soldered directly to PCB copper pour for heat extraction and low-inductance current path. |
Key Features
| Feature | Design Value |
|---|---|
| Low VCEsat | −230 mV (typ) at −3 A/−300 mA - Minimizes conduction loss and self-heating during sustained load activation. |
| Exposed collector pad | Integral thermal path to PCB - Enables 2.1 W power dissipation on ceramic substrate and simplifies thermal layout. |
| Ultra-thin SMD package | 0.65 mm max height - Supports low-profile designs in space-constrained battery-powered devices. |
| High peak current | −5 A ICM (1 ms pulse) - Handles inrush currents in motor startup and capacitor charging without failure. |
| Wide operating temperature | −55 °C to +150 °C Tj - Certified for industrial and automotive-adjacent environments with no derating below 125 °C ambient. |
Applications
| Smartphone Power Switching | USB-C PD Load Switch |
|---|---|
|
Use Scenario: Controlling power delivery to USB-C peripheral ports in smartphones and tablets with dynamic load enable/disable. IC Role / Device Role / Timing Role: PNP high-side load switch managing 3.3–5 V rail sequencing and fault isolation. Use Value: 75 mΩ RCEsat limits voltage drop to <230 mV at 3 A, preserving bus voltage margin and reducing thermal stress on thin PCB layers. |
Use Scenario: Enabling/disabling power paths in USB-C Power Delivery sink implementations with programmable current limiting. IC Role / Device Role / Timing Role: Fast-turning PNP switch responding to MCU-controlled enable signals during port negotiation and fault recovery. Use Value: 200 ns toff supports rapid disconnect during overcurrent events, meeting USB-C PD 3.0 fault response timing requirements. |
| Wireless Headset Battery Management | Industrial Sensor Node Power Gating |
|
Use Scenario: Isolating Li-ion battery from Bluetooth audio circuitry during sleep mode to minimize quiescent current drain. IC Role / Device Role / Timing Role: Low-leakage PNP switch with −100 nA ICES holding off reverse current when disabled. Use Value: −100 nA ICES at −24 V ensures <1 µA total system standby current, extending battery life beyond 30 days. |
Use Scenario: Power-gating analog front-end and RF transceiver sections in battery-operated environmental sensors deployed in remote locations. IC Role / Device Role / Timing Role: Robust PNP switch rated for −55 °C to +125 °C ambient, handling intermittent 2 A sensor burst loads. Use Value: 150 °C Tj rating and 100 K/W Rth(j-a) on FR4 allow reliable operation in unventilated enclosures without thermal throttling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PNP low-VCEsat transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PMMBT5401,115 | Higher VCEsat (−400 mV typ at −100 mA), lower IC (−600 mA), TO-236 package | Not suitable for >1 A continuous loads; lacks exposed thermal pad | Select only for low-current signal switching where thermal performance is secondary. |
| PBSS5240PA,115 | Same SOT1061 package, but −40 V VCEO, −4 A IC, higher RCEsat (90 mΩ typ) | Offers higher voltage margin and current headroom at cost of 20% higher conduction loss | Prefer when system rail exceeds 24 V or peak load exceeds 3.5 A. |
Compared with PBSS5330PA,115, PMMBT5401,115 trades thermal efficiency and current capacity for legacy package compatibility, while PBSS5240PA,115 extends voltage and current ratings at the expense of saturation resistance-making PBSS5330PA,115 optimal for 3–5 V, ≤3 A battery-switching applications demanding minimal board area and thermal overhead.
Availability
PBSS5330PA,115 is available at Aetrix Electronics and suitable for smartphone power switching, USB-C PD load control, and wireless headset battery management requiring stable component supply and consistent SOT1061 footprint availability.
Supply support for PBSS5330PA,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-performance, energy-efficient discrete and logic devices, with leadership in automotive-grade and industrial power transistors.
PBSS5330PA,115 belongs to Nexperia's BISS transistor product line, engineered specifically for high-efficiency, space-constrained load switching in portable and battery-powered systems where low VCEsat and thermal performance are critical.
FAQ
What is the maximum continuous power dissipation for PBSS5330PA,115 on a standard FR4 PCB?
On a standard FR4 PCB with single-sided copper and tin-plated finish, PBSS5330PA,115 has a Ptot rating of 500 mW at Tamb ≤ 25 °C. Derating begins linearly above 25 °C, reaching zero dissipation at 75 °C ambient, per Figure 1 condition (1). This reflects its thermal resistance of 250 K/W in that mounting configuration.
Can PBSS5330PA,115 be used as a direct replacement for an NPN transistor in a high-side switch?
No-it is a PNP transistor and functions as a high-side switch by default, whereas NPN transistors require external level-shifting or complementary driver circuitry for high-side use. Substituting it for an NPN would invert logic polarity and may cause incorrect biasing; the NPN complement is PBSS4330PA, not PBSS5330PA,115.
What is the recommended PCB footprint for reflow soldering PBSS5330PA,115?
The official reflow footprint (Figure 17) specifies a 2.1 mm × 1.3 mm solder land for the exposed collector pad, two 0.5 mm × 0.5 mm pads for pins 1 (base) and 2 (emitter), and 0.25 mm solder mask clearance. The total occupied area is 2.3 mm × 1.7 mm, with 0.4 mm solder paste stencil aperture for the central thermal pad.
Does PBSS5330PA,115 meet automotive qualification standards?
No-PBSS5330PA,115 is not automotive-qualified. The datasheet explicitly states in Section 15.4 that "Unless this data sheet expressly states that this specific Nexperia product is automotive qualified, the product is not suitable for automotive use." It is rated for industrial and consumer applications only.
PBSS5330PA,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- 3-PowerUDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- PNP
- Current - Collector (Ic) (Max):
- 3 A
- Voltage - Collector Emitter Breakdown (Max):
- 30 V
- Vce Saturation (Max) @ Ib, Ic:
- 320mV @ 300mA, 3A
- Current - Collector Cutoff (Max):
- 100nA
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 175 @ 1A, 2V
- Power - Max:
- 2.1 W
- Frequency - Transition:
- 165MHz
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 3-HUSON (2x2)
PBSS5330PA,115 FAQ
1.How can I place an order for PBSS5330PA,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PBSS5330PA,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PBSS5330PA,115 reliable?
The price and inventory of PBSS5330PA,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PBSS5330PA,115 is usually 5 days.
3.What payment methods are accepted for PBSS5330PA,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PBSS5330PA,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PBSS5330PA,115?
PBSS5330PA,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PBSS5330PA,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PBSS5330PA,115?
For technical support, including PBSS5330PA,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PBSS5330PA,115 requirements.
6.How does Aetrix verify that PBSS5330PA,115 is sourced from the original manufacturer or authorized distributors?
All PBSS5330PA,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PBSS5330PA,115 meets industry standards.
7.What is the process for return or replacement of PBSS5330PA,115?
All PBSS5330PA,115 units undergo pre-shipment inspection (PSI). If there is an issue with PBSS5330PA,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PBSS5330PA,115 part is unused and in its original packaging.
Return procedure for PBSS5330PA,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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